Homework 6: Printed Circuit Board Layout Design Narrative

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1 Homework 6: Printed Circuit Board Layout Design Narrative Team Code Name: Home Kinection Group No. 1 Team Member Completing This Homework: Stephen Larew Address of Team Member: purdue.edu Evaluation: SCORE DESCRIPTION Excellent among the best papers submitted for this assignment. Very few 10 corrections needed for version submitted in Final Report. Very good all requirements aptly met. Minor additions/corrections needed for 9 version submitted in Final Report. Good all requirements considered and addressed. Several noteworthy 8 additions/corrections needed for version submitted in Final Report. Average all requirements basically met, but some revisions in content should 7 be made for the version submitted in the Final Report. Marginal all requirements met at a nominal level. Significant revisions in 6 content should be made for the version submitted in the Final Report. Below the passing threshold major revisions required to meet report * requirements at a nominal level. Revise and resubmit. * Resubmissions are due within one week of the date of return, and will be awarded a score of 6 provided all report requirements have been met at a nominal level. Comments:

2 1.0 Introduction The Home Kinection project intends to unite the control of living room objects through the use of a Microsoft Kinect sensor and subordinate control devices. The Microsoft Kinect sensor serves to receive user input in the form of gestures and sound and enable custom software to interpret the input. Once input processing is complete, custom software then transmits the control information wirelessly over a ZigBee mesh network to the individual control modules. The control modules act upon reception of commands and data and may, at any time, transmit control information back to the main controller. In its current design, the system consists of a custom computer connected to the Kinect, a central controller module, and four peripheral modules for infrared (IR), light dimming, shade, and virtual touchscreen control. Due to the distributed nature of the Home Kinection project, five custom printed circuit board (PCB) designs must be completed one each for the peripheral modules and one for the central controller module. All PCB designs will have an Atmel ZigBit integrated microcontroller, IEEE radio transceiver, and antenna as well as a power supply. The transceiver and antenna require special consideration in order to minimize electromagnetic interference (EMI). In addition, each peripheral module uses extra components to perform its intended task. The dimmer module uses a solid-state relay (SSR) to switch AC mains provided to a light. The shade module uses mechanical relays to switch two twenty-four volt signals that control the up and down motion of a Lutron shade. The IR module has both IR receivers and transmitters. The virtual touchscreen module communicates via USB protocol with a host computer and thus uses a Maxim USB integrated circuit (IC). Finally, the central controller module communicates with the Kinect computer via an internal RS232 line. While each PCB has relatively few components, the dissimilarity in power supplies and support components poses significant complexity when considered as a whole. 2.0 PCB Layout Design Considerations - Overall In general, each PCB is simple, having few components and requiring a small overall footprint. Few analog components are used and can be spaced to create separation between their radiated emissions and the ZigBit antenna. Overall, each PCB will be partitioned into three separate areas for a power supply, analog components, and digital components including the ZigBit module. -1-

3 Traces should be kept short and wide to reduce their stray capacitance and inductance which could interfere with the ZigBit s antenna. The target minimum trace width is 14 mils. However, most traces could easily be made wider. In order to reduce trace length, an optimal component layout that places connected pins close together and packs all components tightly will be targeted. In the dimmer and shade controller module, relays will be used and thus will require separation from the ZigBit module. The mechanical switching of high voltage mains will produce instantaneous radiation that could interfere with the ZigBit s antenna. Fortunately, the use of a solid-state relay (SSR) and mains zero-detect circuit on the dimmer module will allow the dimmer to switch the mains at zero crossings, which will reduce radiated emissions. Furthermore, the use of optical isolation will allow the decoupling of the noise between the relays and ZigBit module. Finally, the virtual touchscreen module will use the relatively high speed USB bus for communications and will require some special considerations for layout and trace routing. In particular, according to [2], the data lines must run in parallel to each other with grounded guard traces surrounding them. In practice, this means that the Maxim USB chip will need to place and oriented close to the USB connector to ease signal routing. Additionally, the oscillator running the Maxim USB chip should be kept separated from the data lines. 3.0 PCB Layout Design Considerations Microcontroller All peripheral modules use the Atmel ZigBit module with integrated chip antenna. Inside each module is an Atmel ATmega1281V microcontroller, an Atmel AT86RF230 RF transceiver, and a built in antenna. All passive and analog circuitry is self-contained within the module. Forty-three pads are exposed for direct soldering to the main PCB. No external crystal is required to clock the ZigBit module, thus simplifying the circuit and PCB design. A single power supply bypass capacitor is required and can be placed on the layer directly beneath the ZigBit s VCC and ground pins. The decision to use the ZigBit module greatly simplifies the direct support circuitry usually required for a microcontroller and radio system. However, the ZigBit still constrains the layout and routing of the PCB. Being a radio frequency device, the ZigBit is sensitive to EMI that may be sourced either externally or internally from other components. Fortunately, the most sensitive parts have been carefully designed and protected within the ZigBit module itself. The sole precaution to be taken -2-

4 is to ground the perimeter of each board according to the guidelines given in the ZigBit data sheet. In particular, a grounded copper trace 1 mm wide will surround the entire periphery of each board with the exception of the upper layer where the chip antenna protrudes from the edge of the board. Small vias will be spaced 1 mm apart along the periphery ground trace to catch radiating waves in the board dielectric. Figure 1 is reproduced from [3] below to better visualize the board EMI protection scheme outlined above. All pads used on the ZigBit module are either for digital input and output (I/O) or for power purposes. Due to the inherent immunity to noise in digital I/O, only the power traces will necessitate special consideration in the layout. The ZigBit module will draw at most 20 ma plus any current required to drive the status LEDs and support components. In all prototype circuits, the maximum drawn current was found to remain under about 80 ma. Thus, no power trace necessarily needs to be particularly wide according to the IPC trace width vs temperature charts in [1]. Nonetheless, the target trace width of all power traces is a minimum of 60 mils. [5] 4.0 PCB Layout Design Considerations - Power Supply Each board has a different power supply design. The IR, central controller, and dimmer use a standard low-dropout (LDO) 3.3V linear regulator requiring only a small bulk capacitor. The virtual touchscreen module uses a 3.3V linear regulator specialized for USB bus powered designs. Finally, the dimmer module has a transformer with full-bridge rectifier and bulk capacitor. The main concern of all power supplies is the EMI of the transformer interacting with the antenna of the ZigBit module. The transformer used in the dimmer module is a small 6 VA, 8 VAC output design that can easily be used with four 1N4001 series diodes and a relatively small bulk capacitor. Nevertheless, in order to minimize any EMI interactions, the entire dimmer module power supply will be constructed on a separate PCB and wired to the main PCB of the dimmer module. This will allow ample tolerance in trace widths for hight voltage mains around the transformer due to the its footprint. The physical separation and distance between the ZigBit s antenna and the transformer will serve to reduce EMI, increase safety, and simplify the design. The other modules power supplies, which use linear regulators, can all be safely designed on the same PCB as the main circuit. The layout techniques in [4], whereby the power supply is partitioned into its own section of the PCB separated from the analog and digital portions of the circuit, will be followed. The main challenge in these circuits will be to route -3-

5 wide power traces (approximately 100 mils) around the perimeter of the board to branch of smaller (60 mils) traces to each integrated circuit (IC). Each integrated circuit will require its own bypass capacitor to stabilize the input voltage and reduce noise from other components. The bypass capacitors will be placed on the opposite layer, directly above or below their respective ICs. This will allow the shortest paths between the power and ground pins and the bypass capacitors. Finally, the ground traces will be made as wide as possible in order to further reduce EMI on the board. 5.0 Summary Five PCBs will be designed in total. Each has a different power supply requirement and unique analog components. The main concern for each is to minimize the EMI between the ZigBit antenna and board. Additionally, all relays will kept distant from the ZigBit antenna. Finally, the USB data lines will be protected from other high frequency traces. Figure 1: ZigBit mounting on a PCB -4-

6 List of References [1] Using the IPC temperature charts, UltraCad Design, Inc. [2] EMI Design Guidelines for USB Components. Intel Corporation. [3] ZigBit 2.4 GHz Wireless Modules, Atmel Corporation, [4] M.Glenewinkel, System Design and Layout Techniques for Noise Reduction in MCUbased Systems, Motorola App Note AN1259, [5] D.Meyer, PCB Design Considerations, Lecture Notes for ECE477, Digital Senior Design, Purdue University, Fall semester,

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