Product End-of-Life Disassembly Instructions Product Category: Personal Computers

Transcription

1 Product End-of-Life Disassembly Instructions Product Category: Personal Computers Marketing Name / Model [List multiple models if applicable.] HP ProDesk 400 G3 MT Business PC Name / Model #2 Name / Model #3 Name / Model #4 Name / Model #5 Purpose: The document is intended for use by end-of-life recyclers or treatment facilities. It provides the basic instructions for the disassembly of HP products to remove components and materials requiring selective treatment, as defined by EU directive 2002/96/EC, Waste Electrical and Electronic Equipment (WEEE). 1.0 Items Requiring Selective Treatment 1.1 Items listed below are classified as requiring selective treatment. 1.2 Enter the quantity of items contained within the product which require selective treatment in the right column, as applicable. Quantity of items Item Description Notes included in product Printed Circuit Boards (PCB) or Printed Circuit Assemblies (PCA) Batteries Mercury-containing components Liquid Crystal Displays (LCD) with a surface greater than 100 sq cm Cathode Ray Tubes (CRT) Capacitors / condensers (Containing PCB/PCT) Electrolytic Capacitors / Condensers measuring greater than 2.5 cm in diameter or height With a surface greater than 10 sq cm 2 All types including standard alkaline and lithium coin or button style batteries For example, mercury in lamps, display backlights, scanner lamps, switches, batteries Includes background illuminated displays with gas discharge lamps External electrical cables and cords Power cord 1 Gas Discharge Lamps Plastics containing Brominated Flame Retardants weighing > 25 grams (not including PCBs or PCAs already listed as a separate item above) Components and parts containing toner and ink, including liquids, semi-liquids (gel/paste) and toner Components and waste containing asbestos Cooler fan 81g,system fan 99g,PSU fan 67g Include the cartridges, print heads, tubes, vent chambers, and service stations. EL-MF Page g

2 Components, parts and materials containing refractory ceramic fibers Components, parts and materials containing radioactive substances 2.0 Tools Required List the type and size of the tools that would typically be used to disassemble the product to a point where components and materials requiring selective treatment can be removed. Tool Description Screw driver T-15 Micro shear Screw driver Description #4 Description #5 Tool Size (if applicable) 3.0 Product Disassembly Process 3.1 List the basic steps that should typically be followed to remove components and materials requiring selective treatment: 1. Remove access panel. (see Figure 1-2) 2. Remove front bezel. (see Figure 3) 3. Disconnect cooler cable then remove the cooler from board. (see Figure4-5) 4. Remove the HDD (see Figure 6-8) 5. Remove the Slim ODD (see Figure 9-10) 6. Unplug all cable conn. from PCA. (see Figure 11) 7. Remove the PCA(see Figure 12-13) 8. Remove the DIMM. (see Figure 14) 9. Remove the CPU. (see Figure 15-16) 10. Remove the Battery. (see Figure 17) 11. Remove the FIO module from chassis. (see Figure 18-19) 12. Remove the PWR_LED switch cable from chassis. (see Figure 20-21) 13. Remove the SD card reader from chassis. (see Figure 22-23) 14. Remove the speaker from chassis. (see Figure 24-25) 15. Remove Sys fan from chassis. (see Figure 26-27) 16. Remove the PSU from chassis. (see Figure 28-29) 17. Remove the PSU chassis and remove the PSU board. (see Figure 30-39) 18. Remove the Electrolytic Capacitors from PSU board. (see Figure 40-59) 3.2 Optional Graphic. If the disassembly process is complex, insert a graphic illustration below to identify the items contained in the product that require selective treatment (with descriptions and arrows identifying locations). YN-3 PH2 EL-MF Page 2

3 Figure1 Release Thumb screw on the access panel. Figure2 Griping the tab at the end of access panel, pull towards the rear and remove from unit. Figure3 Pull 3 pcs bezel hooks and remove the front bezel from chassis. Figure4 Unplug the cooler cable from PCA Figure5 Release 4 screws from cooler and remove it Figure6 Disconnect the SATA and power cables from HDD EL-MF Page 3

4 Figure7 Release the HDD screws Figure8 Remove the HDD form chassis Figure9 Push the latch and release the Slim ODD. Figure10 Remove the Slim ODD form chassis. Figure11 Unplug all cable conn. from PCA. Figure12 Release 8 pcs screws from PCA EL-MF Page 4

5 Figure13 Remove PCA from chassis Figure14 Push the hooks on both sides and then pick up the memory Figure15 Rotate the handle and open it up Figure16 Remove the CPU from board Figure17 Remove the battery from the PCA Figure18 Release the screw of the FIO cable EL-MF Page 5

6 Figure19 Rotation and Remove the FIO module from chassis Figure20 Push the plastic hook. Figure21 Remove the PWR_LED switch from chassis Figure22 Release 1 pcs screw of speaker Figure23 Remove the speaker form chassis Figure24 Release the SD card reader screw EL-MF Page 6

7 Figure25 Remove the SD Card reader from chassis Figure26 Release 2 pcs screws from system fan. Figure27 Remove the system fan from chassis Figure28 Release 4 pcs screws of PSU and remove it Figure29 Pull up the PSU and remove it EL-MF Page 7

8 Figure30 Cut the cable tie Figure31 Remove screw for bottom Figure32 Remove screw for top Figure33 Remove FG screw Figure34 Disconnect fan connector Figure35 Remove LED holder EL-MF Page 8

9 Figure36 Remove plastic cover Figure37 Remove PCB screw Figure38 Remove AC inlet screw Figure 39 Cut output cable, AC inlet wire, LED wire Figure40 Remove capacitors use solder iron Figure41 Heat the solder of Electrolytic Capacitors (C801,C151,C303,C951) (Gamay-S 300W APFC-Delta) C151 C303 C801 C951 EL-MF Page 9

10 Figure42 Heat the solder of Electrolytic Capacitors greater (C801,C802, C152, C153, C303,C951) (Gamay-S 300W REG-Delta) Figure43 Heat the solder of Electrolytic Capacitors greater than 2.5cm in diameter or height and remove it. (C801,C951) (Crasto-S 180W E-Star6-Delta) Figure44 Heat the solder of Electrolytic Capacitors greater (C801,C802,C951,C303) (Crasto-S 180W REG-Delta) Figure45 Heat the solder of Electrolytic Capacitors greater than 2.5cm in diameter or height and remove it. (C801) (Ortega 180W ATX bronze-delta) EL-MF Page 10

11 Figure46 Heat the solder of Electrolytic Capacitors greater (C1,C6) (Gamay-S 300W APFC_AcBel) Figure47 Heat the solder of Electrolytic Capacitors greater than 2.5cm in diameter or height and remove it (C1,C6,C19) (Gamay-S 300W Bronze_AcBel) Figure48 Heat the solder of Electrolytic Capacitors (C6,C19) (Crasto-S 180W APFC_AcBel) Figure48 Heat the solder of Electrolytic Capacitors greater (C6,C19) (Crasto-S 180W Bronze_AcBel) Figure50 Heat the solder of Electrolytic Capacitors (C6,C19,C57,C13) (Ortega 180W Bronze_AcBel) Figure51 Heat the solder of Electrolytic Capacitors greater (C223, C224, C225, C406, C105) (Gamay-S 300W Bronze_Lite-On) EL-MF Page 11

12 Figure52 Heat the solder of Electrolytic Capacitors (C120, C121, C223) (Gamay-S 300W Reg_Lite-On) Figure53 Heat the solder of Electrolytic Capacitors (C72 C74 C75 C33) (Crasto-S 180W APFC_Huntkey) C72 C33 C74 C75 EL-MF Page 12

13 Figure54 Heat the solder of Electrolytic Capacitors (C1, C2) (Gamay-S 300W REG_Chicony) Figure55 Heat the solder of Electrolytic Capacitors greater (C1) (Gamay-S 300W APFC_Chicony) Figure56 Heat the solder of Electrolytic Capacitors (C1) (Gamay-S 300W Bronze_Chicony) Figure57 Heat the solder of Electrolytic Capacitors greater (C1, C2) (Crasto-S 180W REG_Chicony) Figure58 Heat the solder of Electrolytic Capacitors (C1) (Crasto-S 180W APFC_Chicony) Figure59 Heat the solder of Electrolytic Capacitors (C1) (Ortega 180W Bronze_Chicony) EL-MF Page 13