Replacing Spansion S29GL_S with Macronix MX29GL_F

Transcription

1 1. Introduction Macronix offers MX29GL_F high performance parallel flash in densities from 128Mb to 1Gb. MX29GL_F and Spansion S29GL_S devices have similar features, performance, and command codes. This application note explains how to accommodate device differences when migrating from Spansion S29GL_S devices to equivalent Macronix MX29GL_F parallel flash. The information in this document is based on datasheets listed in Section 12. Newer versions of the datasheets may override the contents of this document. P/N: AN

2 2. General Features Both flash device families have similar features and functions (Table 2-1). Table 2-1: Features Type / Function Macronix MX29GL_F Spansion S29GL_S Vcc Voltage Range 2.7V ~ 3.6V 2.7V ~ 3.6V I/O Voltage Range 2.7V ~ 3.6V (H/L type *1 ) 1.65V ~ 3.6V (U/D type *2 ) Bus Width x16 / x8 x16 only Sector Size 128KB 128KB Page Read Buffer 8Words 16Words Write Buffer 32Words 256Words 2.7V ~ 3.6V (01/02 type *1 ) 1.65V ~ 3.6V (V1/V2 type *2 ) WP# Pin Function Highest/Lowest address Highest/Lowest address sector sector Software Protected Mode Password (64bits) Password (64bits) Solid Protection *3 Persistent Protection *3 OTP Security Region 128Words 256Words x 2 Write Status Polling Data Polling Data Polling & Status Register Multi-Sector Erase Yes No Blank Check Command No Yes CFI Table Length 40Words 40Words + extend 8Words *4 Manufacture ID C2h 01h 128Mb 227Eh / 2221h / 2201h 227Eh / 2221h / 2201h 256Mb 227Eh / 2222h / 2201h 227Eh / 2222h / 2201h Device ID Package 512Mb 227Eh / 2223h / 2201h 227Eh / 2223h / 2201h 1Gb 227Eh / 2228h / 2201h 227Eh / 2228h / 2201h 56-TSOP (14x20mm) 56-TSOP (14x20mm) 64-LFBGA (11x13mm) 64-LFBGA (11x13mm) Note: 1. Macronix H/L is same as Spansion 01/02 definition. H / 01 type is VI/O = Vcc = 2.7 ~ 3.6V, highest address sector protected. L / 02 type is VI/O = Vcc = 2.7 ~ 3.6V, lowest address sector protected. 2. Macronix U/D is same as Spansion V1/V2 definition. U / V1 type is VI/O = 1.65 ~ Vcc, Vcc = 2.7 ~ 3.6V, highest address sector protected. D / V2 type is VI/O = 1.65 ~ Vcc, Vcc = 2.7 ~ 3.6V, lowest address sector protected. 3. Solid Protection provides the same function as Persistent Protection. 4. Both families support CFI mode. Spansion s CFI table includes an extra 8Words of additional information. P/N: AN

3 3. Package and Pinout The Macronix and Spansion families have similar footprints and pinouts. 56-TSOP (14x20mm) A23 1 NC on MX29GL128F NC on MX29GL128F/256F 56 A24 A23 1 NC on S29GL128S NC on S29GL128S/256S 56 A24 A22 2 NC on MX29GL128F/256F/512F 55 A25 A22 2 NC on S29GL128S/256S/512S 55 A25 A A16 A A16 A BYTE# A14 4 Reserve for Future Use 53 RFU A GND A VSS A Q15/A-1 A DQ15/A-1 A Q7 A DQ7 A Q14 A DQ14 A Q6 A DQ6 A Q13 A DQ13 A Q5 A DQ5 A Q12 A DQ12 WE# Q4 WE# DQ4 MX29GL_F RESET# VCC RESET# 14 S29GL_S 43 VCC A Q11 A DQ11 WP#/ACC Q3 WP# DQ3 RY/BY# Q10 RY/BY# DQ10 A Q2 A DQ2 A Q9 A DQ9 A Q1 A DQ1 A Q8 A DQ8 A Q0 A DQ0 A OE# A OE# A GND A VSS A CE# A CE# A A0 A A0 NC NC RFU 27 Reserve for Future Use Reserve for Future Use 30 RFU NC VI/O DNU 28 Do Not Use 29 VI/O Macronix GND (Pin 52, Pin 33) = Spansion VSS ( Pin 52, Pin 33) Macronix Byte# pin ( Pin 53) needs to be pulled high. Spansion reserves Pin 53 for furture use (RFU). 64-LFBGA (11x13mm) MX29GL_F S29GL_S 8 NC A22 A23 VIO GND A24 A25 NC 8 NC A22 A23 VIO VSS A24 A25 NC 7 A13 A12 A14 A15 A16 BYTE # Q15/ A-1 GND 7 A13 A12 A14 A15 A16 RFU Q15/ A-1 VSS 6 A9 A8 A10 A11 Q7 Q14 Q13 Q6 6 A9 A8 A10 A11 DQ7 DQ14 DQ13 DQ6 5 WE# RES- ET# A21 A19 Q5 Q12 VCC Q4 5 WE# RES- ET# A21 A19 DQ5 DQ12 VCC DQ4 4 RY/ BY# WP#/ ACC A18 A20 Q2 Q10 Q11 Q3 4 RY/ BY# WP# A18 A20 DQ2 DQ10 DQ11 DQ3 3 A7 A17 A6 A5 Q0 Q8 Q9 Q1 3 A7 A17 A6 A5 DQ0 DQ8 DQ9 DQ1 2 A3 A4 A2 A1 A0 CE# OE# GND 2 A3 A4 A2 A1 A0 CE# OE# VSS 1 NC NC NC NC NC VIO NC NC 1 NC NC NC NC DNU VIO RFU NC A B C D E F G H A B C D E F G H C8: NC on MX29GL128F C8: NC on S29GL128S E1: Do Not Use F8: NC on MX29GL128F/256F F8: NC on S29GL128S/256S F7, G1: Reserve for Future Use G8: NC on MX29GL128F/256F/512F G8: NC on S29GL128S/256S/512S Macronix Byte# ball ( F7) needs to be pulled high. Spansion reserves F7 for furture use (RFU). P/N: AN

4 4. Performance Comparison MX29GL_F and S29GL_S have similar Read/Write performance (Table 4-1). Table 4-1: Read Performance Read Function Macronix MX29GL_F Spansion S29GL_S 128Mb 70ns (H/L type) 90ns (01/02 type) 90ns (U/D type) 100ns (V1/V2 type) 90ns (H/L type) 90ns (01/02 type) Random Read 256Mb 110ns (U/D type) 100ns (V1/V2 type) Access time *1 100ns (H/L type) 100ns (01/02 type) (Taa/Tce or tacc/tce) 512Mb 110ns (U/D type) 110ns (V1/V2 type) 1Gb 110ns (H/L type) 100ns (01/02 type) 120ns (U/D type) 110ns (V1/V2 type) Page Read Access time *1 (Tpa or tpacc) 25ns (H/L type ) 30ns (U/D type) 15ns (01/02 type) 25ns (V1/V2 type) Page Read Buffer Length *2 8 Words / 16Bytes 16 Words Notes: 1. Read Access times are density dependent; align wait state setting of the controller or SoC for correct system operation. 2. Page Read Buffer Length is different between the two families; aligning length to 8 words will provide system compatibility for both device families. Table 4-2: Write Performance Write Function Macronix MX29GL_F Spansion S29GL_S Write Buffer 32 word *1 120us *3 (typ.) 175us (typ.) Program time 256 word *1 N/A 340us (typ.) Word Program time *2 11us (typ.) 125us (typ.) Sector Erase time 0.6s (typ.) 0.275s (typ.) 128Mb 64s (typ.) 32s (typ.) *4 Chip Erase time 256Mb 128s (typ.) 64s (typ.) *4 512Mb 256s (typ.) 128s (typ.) *4 1Gb 512s (typ.) 256s (typ.) *4 Write/Erase Cycles (Endurance) 100, ,000 Notes: 1. Write Buffer sizes are different; aligning length to 32 words to provide system compatibility. 2. Macronix flash is Floating Gate Technology (1 bit/cell) which is flexibility in s/w algorithm or file system. 3. Write Buffer Programming time = 120us for 128Mb, 256Mb and 512 (10Q EPNs) and 70n s for 1Gb and 512Mb (11G and 12G EPNs). 4. From CFI Table in Datasheet P/N: AN

5 Write Buffer Length Alignment Write buffer maximum length is different between MX29GL_F and S29GL_S devices. Software modification is necessary for if the longer S29GL_S buffer length is being used. There are two methods for length alignment: (i) Modify write buffer length to 32 words for both devices. (ii) Read the maximum buffer length from CFI offset address 2Ah (word mode) and adjust the algorithm to use this length. Note: Spansion suggests performing buffer writes using multiples of 32-byte pages to maximize data integrity. Macronix provides 32-word buffer writes are in common using for file systems and software algorithms. Page Read Length Alignment MX29GL_F and S29GL_S maximum page read lengths are different. It will be necessary to modify the software if the longer S29GL_S read page length is being used. There are two methods for length alignment. (i) Adjust the page read length in the SoC or controller to 8 words for both devices. (ii) Read the maximum length from CFI offset address 4Ch (word mode) and adjust the SoC or controller setting accordingly. P/N: AN

6 5. DC Characteristics Macronix has improved Write Current power consumption while Read currents are similar (Table 5-1). Table 5-1: Read/Write Current DC Characteristic Macronix MX29GL_F Spansion S29GL_S Read 5MHz 50mA (max.) 60mA (max.) Page Read 33MHz Standby Current Write Current 20mA (max.) 25mA (max.) 128Mb 30uA (typ.); 100uA (max.) 70uA (typ.); 100uA (max.) 256Mb 30uA (typ.); 100uA (max.) 70uA (typ.); 100uA (max.) 512Mb 60uA (typ.); 200uA (max.) 70uA (typ.); 100uA (max.) 1Gb 120uA (typ.); 400uA (max.) 70uA (typ.); 100uA (max.) 128Mb 26mA (typ.); 30mA (max.) 45mA(typ.); 100mA (max.) 256Mb 26mA (typ.); 30mA(max.) 45mA(typ.); 100mA (max.) 512Mb 26mA (typ.); 30mA(max.) 45mA (typ.); 100mA (max.) 1Gb 36mA (typ.); 60mA(max.) 45mA (typ.); 100mA (max.) Table 5-2 shows that both flash families have similar input sink and output drive characteristics. Table 5-2: Input/Output Voltage DC Characteristic Macronix MX29GL_F Spansion S29GL_S Very High Voltage 9.5V ~ 10.5V N/A Input Low Voltage -0.1V (min..) / 0.3VI/O (max.) -0.5V (min.) / 0.3VI/O (max.) Input High Voltage 0.7VI/O (min.) / VI/O+0.3V (max.) 0.7VI/O (min.) / VI/O+0.4V (max.) Output Low Voltage 0.45V (max.) 0.15VI/O (max.) Output High Voltage 0.85VI/O (min.) 0.85VI/O (min.) Notes: VI/O voltage must be same as VCC for Macronix H/L versions and Spansion 01/02 types. P/N: AN

7 6. Command Set and Firmware Basic command sets and write status checking methods are similar between both flash families. While the algorithm descriptions may be slightly different, the concepts are the same. Furthermore, Spansion supports status register checking, which is a new structure in parallel flash and is not backward compatible. Depending on the write status checking method used, the algorithm may require minor modifications. 6.1 Basic Command Table (Word mode) MX29GL_F and S29GL_S have the same basic command set. The Read operation and Write command can be used directly without modification.. Table 4-1 shows the command set in Word mode. Table 6-1: Basic Commands (Word Mode) Command Read Rese t Progra m Write to Buffer Chip Erase Sector Erase Program/Eras e Suspend *6 Program/Era se Resume *6 1 st Bus Addr Addr XXX 555h 555h 555h 555h XXX XXX Cycle Data Data F0h AAh AAh AAh AAh B0h 30h 2 nd Bus Cycle 3 rd Bus Cycle Addr 2AAh 2AAh 2AAh 2AAh Data 55h 55h 55h 55h Addr 555h SA *1 555h 555h Data A0h 25h 80h 80h 4 th Bus Addr Addr SA 555h 555h Cycle Data Data N-1 *2 AAh AAh 5 th Bus Addr WA *3 2AAh 2AAh Cycle Data WD *4 55h 55h 6 th Bus Addr WBL *5 555h SA Cycle Data WD 10h 30h Note: 1. SA: Sector Address 2. N-1: Word Count (Maximum length is different form two series.) 3. WA: Write Address 4. WD: Write Data 5. WBL: Write Buffer Location 6. Spansion provides two command sets for Program Suspend/Resume. Spansion recommends using B0h/30h for Erase suspend/resume, but 51h/50h for Program suspend/resume.macronix use same commands(b0h/30h) for both functions. P/N: AN

8 6.2 Write Status Checking Method When a flash program/erase operation is in progress, either the Polling Method or Toggle Bit Method may be used to monitor the operation. Both are standard algorithms in parallel flash and can be used for both device families. However, Macronix does not support the status register method for checking write status. Polling Method: Polling method checks Q7 (data complement bit) and Q5 (time out bit) values during the operation. After the operation has finished, Q7 will output true Data. Toggle Bit Method: The toggle bit method checks the Q6 (toggle bit) value during writes. When the write operation ends, Q6 will stop toggling. Start Start Read Q7~Q0 at valid address Read Q7~Q0 Twice Q7 = Data#? No Q6 Toggle? No No Yes Q5 = 1? No Yes Q5 = 1? Yes Read Q7~Q0 at valid address Yes Read Q7~Q0 Twice Q7 = Data#? No Q6 Toggle? No Fail Yes Pass Yes PGM/ERS fail Write Reset CMD PGM/ERS Complete P/N: AN

9 7. Manufacturer ID and Device ID Manufacturer IDs are different and permits software to identify the device manufacturer, but Device IDs are the same (Table 7-1). The same command set is used read the different Manufacturer IDs. Table 7-1: Manufacturer and Device ID Commands Flash Vender Manufacturer ID Device ID MX29GL_F S29GL_S MX29GL_F S29GL_S 1 st Bus Cycle Address 555h 555h 555h 555h (command) Data AAh AAh AAh AAh 2 nd Bus Cycle Address 2AAh 2AAh 2AAh 2AAh (command) Data 55h 55h 55h 55h 3 rd Bus Cycle Address 555h 555h 555h 555h (command) Data 90h 90h 90h 90h 4th Bus Cycle Address X00h X00h X01h X01h (ID output) Data C2h 01h 227Eh 227Eh 5th Bus Cycle (ID output) Address X0Eh X0Eh Data 2221h (128Mb) 2222h (256Mb) 2223h (512Mb) 2228h (1Gb) 2221h (128Mb) 2222h (256Mb) 2223h (512Mb) 2228h (1Gb) 6th Bus Cycle Address X0Fh X0Fh (ID output) Data 2201h 2201h Note. 1. Device ID can be read out after Manufacturer ID with proper address and doesn t need another command sequence. 2. Use Reset command (F0h) to return to normal read mode. P/N: AN

10 8. Power on Timing Macronix and Spansion power on sequences are similar, but the timing is slightly different. (Table- 8-1). Table 8-1: Power on Timing H/W Timing Characteristic Macronix MX29GL_F Spansion S29GL_S Tvr (Vcc Rise Time) 20us/V (min.) / 500ms/V (max.) N/A Tvcs or tvcs (Vcc Setup Time) 500us (min) 300us (min) Tvios or tvios (Vio Setup time) 500us (min) 300us (min) Vcc VI/O Tvr Tvcs/tVCS CE# Tvr Tvios/tVIOS P/N: AN

11 9. H/W Reset# Pin Timing Macronix and Spansion both offer a Hardware Reset function. While they function similarly minor changes to timing may be needed (Table 9-1). Table 9-1: Reset# Timing H/W Timing Characteristic Trh or trh (Reset# high to Read) During auto Trp1 or trp algorithm (Reset# pulse width) mode *1 Tready1 or trph (Reset# low to read or During non-auto algorithm mode *1 write) Trp2 or trp (Reest# pulse width) Tready2 or trph (Reset# low to read or write) Macronix MX29GL_F 200ns (min) 10us (min) 20us (max) 500ns (min) 500ns (max) Spansion S29GL_S 50ns (min) 200ns (min) 35us (min) 200ns (min) 35us (min) Note: 1. Macronix defines different reset timing between auto and non-auto algorithm; Spansion defines same value for both. CE#, OE# WE# Trb1 Trb2 CE#, OE# RY/BY# Trh/tRH RY/BY# Reset# Tready1/tRPH Reset# Tready2/tRPH Trp1/tRP Trp2/tRP During auto algorithm mode During non-auto algorithm mode P/N: AN

12 10. Summary Macronix MX29GL_F and Spansion S29GL_S Parallel Flash occupy the same PCB footprint and have similar commands, function, and features. Overall, the S29GL_S to MX29GL_F migration will only require minimal software modifications. The Macronix BYTE# signal pin must be pulled high, but this is the only hardware modification required. P/N: AN

13 11. Part Number Cross-Reference Cross Reference Table 11-1 shows basic part number and package information for the Macronix MX29GL_F and Spansion products. Table 11-1: Part Number Cross Reference Density Macronix Part Spansion Part Package Dimension 128Mb 256Mb 512Mb 1Gb MX29GL128FHT2I-70G MX29GL128FLT2I-70G MX29GL128FUT2I-90G MX29GL128FDT2I-90G MX29GL128FHXFI-70G MX29GL128FLXFI-70G MX29GL128FUXFI-11G MX29GL128FDXFI-11G MX29GL256FHT2I-90Q MX29GL256FLT2I-90Q MX29GL256FUT2I-11G MX29GL256FDT2I-11G MX29GL256FHXFI-90Q MX29GL256FLXFI-90Q MX29GL256FUXFI-11G MX29GL256FDXFI-11G MX29GL512FHT2I-10Q MX29GL512FLT2I-10Q MX29GL512FUT2I-11G MX29GL512FDT2I-11G MX29GL512FHXFI-10Q MX29GL512FLXFI-10Q MX29GL512FUXFI-11G MX29GL512FDXFI-11G MX68GL1G0FHT2I-11G MX68GL1G0FLT2I-11G MX68GL1G0FUT2I-12G MX68GL1G0FDT2I-12G MX68GL1G0FHXFI-11G MX68GL1G0FLXFI-11G MX68GL1G0FUXFI-12G MX68GL1G0FDXFI-12G S29GL128S90TFI01 S29GL128S90TFI02 S29GL128S10TFIV1 S29GL128S10TFIV2 S29GL128S90FHI01 S29GL128S90FHI02 S29GL128S10FHIV1 S29GL128S10FHIV2 S29GL256S90TFI01 S29GL256S90TFI02 S29GL256S10TFIV1 S29GL256S10TFIV2 S29GL256S90FFI01 S29GL256S90FFI02 S29GL256S10FHIV1 S29GL256S10FHIV2 S29GL512S10TFI01 S29GL512S10TFI02 S29GL512S11TFIV1 S29GL512S11TFIV2 S29GL512S10FHI01 S29GL512S10FHI02 S29GL512S11FHIV1 S29GL512S11FHIV2 S29GL01GS10TFI01 S29GL01GS10TFI02 S29GL01GS11TFIV1 S29GL01GS11TFIV2 S29GL01GS10FHI01 S29GL01GS10FHI02 S29GL01GS11FHIV1 S29GL01GS11FHIV2 56-TSOP 64-LFBGA 56-TSOP 64-LFBGA 56-TSOP 64-LFBGA 56-TSOP 64-LFBGA 14x20mm 11x13x1.4mm 0.6mm ball 14x20mm 11x13x1.4mm 0.6mm ball 14x20mm 11x13x1.4mm 0.6mm ball 14x20mm 11x13x1.4mm 0.6mm ball P/N: AN

14 12. Reference Documents "Table 12-1: Datasheet Version" shows the datasheet versions used for comparison in this application note. For the most current, detailed Macronix specification, please refer to the Macronix Website at macronix.com Table 12-1: Datasheet Version Datasheet Date Issued Version MX29GL128F Apr. 26, MX29GL256F Aug. 12, MX29GL512F Aug. 12, MX68GL1G0F Aug. 12, S29GL_128S_01GS_00 Dec. 21, Revision History Table 13-1: Application Note Revision Revision Description Page Date REV. 1 Initial Release ALL Feb. 22, 2012 REV. 2 Added 70ns and 90ns speed grade parts in Table Added Reference List Table 12-1 Modified Table 5-2 as all densities now offer U/D types. ALL Sep. 27, 2013 P/N: AN

15 Except for customized products which have been expressly identified in the applicable agreement, Macronix's products are designed, developed, and/or manufactured for ordinary business, industrial, personal, and/or household applications only, and not for use in any applications which may, directly or indirectly, cause death, personal injury, or severe property damages. In the event Macronix products are used in contradicted to their target usage above, the buyer shall take any and all actions to ensure said Macronix's product qualified for its actual use in accordance with the applicable laws and regulations; and Macronix as well as it s suppliers and/or distributors shall be released from any and all liability arisen therefrom. Copyright Macronix International Co., Ltd All rights reserved, including the trademarks and tradename thereof, such as Macronix, MXIC, MXIC Logo, MX Logo, Integrated Solutions Provider, NBit, Nbit, NBiit, Macronix NBit, eliteflash, HybridNVM, HybridFlash, XtraROM, Phines, KH Logo, BE-SONOS, KSMC, Kingtech, MXSMIO, Macronix vee, Macronix MAP, Rich Au-dio, Rich Book, Rich TV, and FitCAM. The names and brands of third party referred thereto (if any) are for identification purposes only For the contact and order information, please visit Macronix s Web site at: P/N: AN