IP4221CZ6-S. 1. Product profile. Dual USB 2.0 integrated quad with ESD protection to IEC , level 4 (Pb-free) 1.1 General description

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1 Dual USB.0 integrated quad with ESD protection to IEC 000--, level (Pb-free) Rev. 0 9 April 008 Product data sheet. Product profile. General description The is designed to protect Input/Output (I/O) ports that are sensitive to capacitive load, such as USB.0, Ethernet and DVI from destruction by ElectroStatic Discharge (ESD). It provides protection to downstream signal and supply components from ESD voltages as high as ±8 kv (contact discharge). The incorporates four pairs of ultra-low capacitance rail-to-rail diodes plus a Zener diode. The rail-to-rail diodes are connected to the Zener diode which allows ESD protection to be independent of supply voltage. The is fabricated using thin film-on-silicon technology integrating four ultra-low capacitance rail-to-rail ESD protection diodes in a miniature -terminal SOT88 package.. Features Pb-free and RoHS compliant ESD protection compliant to IEC level, ±8 kv contact discharge Four ultra-low input capacitance ( pf typical) rail-to-rail ESD protection diodes Low voltage clamping due to integrated Zener diode Small -terminal SOT88 package. Applications General-purpose downstream ESD protection high frequency analog signals and high-speed serial data transmission for ports inside: Cellular and PCS mobile handsets PC/notebook USB.0/IEEE 9 ports DVI/HDMI interfaces Cordless telephones Wireless data (WAN/LAN) systems PDAs

2 . Pinning information Table. Pinning Pin Description Simplified outline Graphic symbol ESD protection I/O ground (GND) ESD protection I/O ESD protection I/O supply voltage (V CC ) ESD protection I/O bottom view 00aag7. Ordering information Table.. Limiting values Type number Ordering information Package Name Description Version XSON plastic extremely thin small outline package; no leads; SOT88 terminals; body. 0. mm Table. Limiting values In accordance with the Absolute Maximum Rating System (IEC 0). Symbol Parameter Conditions Min Max Unit V I input voltage V V esd electrostatic discharge voltage. Recommended operating conditions all pins; IEC 000--; level contact discharge 8 +8 kv air discharge + kv T stg storage temperature + C Table. Recommended operating conditions Symbol Parameter Conditions Min Max Unit T amb ambient temperature 0 +8 C _ Product data sheet Rev. 0 9 April 008 of

3 . Characteristics Table. Electrical Characteristics T amb = C unless otherwise specified. Symbol Parameter Conditions Min Typ Max Unit C (I/O-GND) input/output to ground V I = 0 V; f = MHz; V CC = V [] pf capacitance I LR reverse leakage current V I = V [] na C sup supply pin to ground V I = 0 V; f = MHz; V CC = V [] pf capacitance V BR breakdown voltage Zener diode; I I = ma [] - 9 V V F forward voltage V [] Measured from pins,, and to ground. [] Measured from pin to pin. 7. Application information 7. Universal serial bus. and.0 protection The is optimized to protect two USB.0 ports against ESD. DAT+ DAT VBUS DAT+ DAT GND USB PORT USB.0/ IEEE 9 CONTROLLER DAT+ DAT VBUS DAT+ DAT GND USB PORT 00aah7 Fig. Each device is capable of protecting both USB data lines as well as VBUS supply. Typical application for USB ESD protection _ Product data sheet Rev. 0 9 April 008 of

4 7. Universal serial bus OTG protection The is optimized to protect USB.0 ports with or without OTG functionality against ESD. to phone VBUS DAT+ DAT ID GND Shld GND USB OTG RECEPTACLE CARKIT mini B receptacle mini A receptacle 00aag0 Fig. The device is capable of protecting the USB data lines as well as VBUS supply and the ID pin. Typical application for USB OTG ESD protection 7. Universal SIM-card protection The protects the SIM-card interfaces against ESD. I/O CLOCK RESET V CC GND SIM 00aag0 Fig. This device also protects V CC. Typical application for universal SIM-card ESD protection _ Product data sheet Rev. 0 9 April 008 of

5 7. IEEE 9a/b protection The is optimized to protect both the IEEE 9 physical layer and the IEEE 9 connector ports against ESD. TPBIAS µf Shld 7 BUS PWR PWR TPA+ TPA Ω Ω TPA+ TPA IEEE 9 PHYSICAL LAYER 9 CONNECTOR TPB+ TPB Ω Ω TPB+ TPB GND Shld 8 0 pf kω nf 0 nf MΩ 00aag00 Fig. Typical application for IEEE 9a/b ESD protection _ Product data sheet Rev. 0 9 April 008 of

6 7. Gigabit Ethernet transceiver protection The protects the gigabit Ethernet transceiver against ESD. TPOPA TPONA R C C TPOPB GIGABIT ETHERNET TRANSCEIVER TPONB TPOPC TPONC R R C C QUAD TRANSFORMER C C7 RJ TPOPD TPOND R C C8 00aag0 Fig. Typical application for gigabit Ethernet transceiver ESD protection _ Product data sheet Rev. 0 9 April 008 of

7 7. Universal microsd/transflash and SD-memory card protection The protects each data line of the microsd/transflash device against ESD. DAT0 DAT DAT DAT/CD CMD CLK V CC GND TRANSFLASH 00aag0 Fig. Typical application for universal microsd/transflash and SD-memory card ESD protection _ Product data sheet Rev. 0 9 April of

8 8. Package outline XSON: plastic extremely thin small outline package; no leads; terminals; body x. x 0. mm SOT88 b L L () e e e () A A D E terminal index area 0 mm DIMENSIONS (mm are the original dimensions) UNIT mm A () max A max Notes. Including plating thickness.. Can be visible in some manufacturing processes. b D E e e L scale L OUTLINE VERSION REFERENCES IEC JEDEC JEITA EUROPEAN PROJECTION ISSUE DATE SOT88 MO Fig 7. Package outline SOT88 (XSON) _ Product data sheet Rev. 0 9 April of

9 9. Soldering of SMD packages This text provides a very brief insight into a complex technology. A more in-depth account of soldering ICs can be found in Application Note AN0 Surface mount reflow soldering description. 9. Introduction to soldering Soldering is one of the most common methods through which packages are attached to Printed Circuit Boards (PCBs), to form electrical circuits. The soldered joint provides both the mechanical and the electrical connection. There is no single soldering method that is ideal for all IC packages. Wave soldering is often preferred when through-hole and Surface Mount Devices (SMDs) are mixed on one printed wiring board; however, it is not suitable for fine pitch SMDs. Reflow soldering is ideal for the small pitches and high densities that come with increased miniaturization. 9. Wave and reflow soldering Wave soldering is a joining technology in which the joints are made by solder coming from a standing wave of liquid solder. The wave soldering process is suitable for the following: Through-hole components Leaded or leadless SMDs, which are glued to the surface of the printed circuit board Not all SMDs can be wave soldered. Packages with solder balls, and some leadless packages which have solder lands underneath the body, cannot be wave soldered. Also, leaded SMDs with leads having a pitch smaller than ~0. mm cannot be wave soldered, due to an increased probability of bridging. The reflow soldering process involves applying solder paste to a board, followed by component placement and exposure to a temperature profile. Leaded packages, packages with solder balls, and leadless packages are all reflow solderable. Key characteristics in both wave and reflow soldering are: Board specifications, including the board finish, solder masks and vias Package footprints, including solder thieves and orientation The moisture sensitivity level of the packages Package placement Inspection and repair Lead-free soldering versus SnPb soldering 9. Wave soldering Key characteristics in wave soldering are: Process issues, such as application of adhesive and flux, clinching of leads, board transport, the solder wave parameters, and the time during which components are exposed to the wave Solder bath specifications, including temperature and impurities _ Product data sheet Rev. 0 9 April of

10 9. Reflow soldering Key characteristics in reflow soldering are: Lead-free versus SnPb soldering; note that a lead-free reflow process usually leads to higher minimum peak temperatures (see Figure 8) than a SnPb process, thus reducing the process window Solder paste printing issues including smearing, release, and adjusting the process window for a mix of large and small components on one board Reflow temperature profile; this profile includes preheat, reflow (in which the board is heated to the peak temperature) and cooling down. It is imperative that the peak temperature is high enough for the solder to make reliable solder joints (a solder paste characteristic). In addition, the peak temperature must be low enough that the packages and/or boards are not damaged. The peak temperature of the package depends on package thickness and volume and is classified in accordance with Table and 7 Table. SnPb eutectic process (from J-STD-00C) Package thickness (mm) Package reflow temperature ( C) Volume (mm ) < 0 0 < Table 7. Lead-free process (from J-STD-00C) Package thickness (mm) Package reflow temperature ( C) Volume (mm ) < 0 0 to 000 > 000 < to. 0 0 >. 0 Moisture sensitivity precautions, as indicated on the packing, must be respected at all times. Studies have shown that small packages reach higher temperatures during reflow soldering, see Figure 8. _ Product data sheet Rev. 0 9 April of

11 temperature maximum peak temperature = MSL limit, damage level minimum peak temperature = minimum soldering temperature peak temperature time 00aac8 Fig 8. MSL: Moisture Sensitivity Level Temperature profiles for large and small components 0. Abbreviations For further information on temperature profiles, refer to Application Note AN0 Surface mount reflow soldering description. Table 8. Acronym DVI ESD HDMI LAN OTG PCS PDA RoHS SIM USB WAN Abbreviations Description Digital Video Interface ElectroStatic Discharge High Definition Multimedia interface Local Area Network On-The-Go Personal Computing System Personal Digital Assistant Restriction of the use of certain Hazardous substances Subscriber Identity Module Universal Serial Bus Wide Area Network. Revision history Table 9. Revision history Document ID Release date Data sheet status Change notice Supersedes _ Product data sheet - - _ Product data sheet Rev. 0 9 April 008 of

12 . Legal information. Data sheet status Document status [][] Product status [] Definition Objective [short] data sheet Development This document contains data from the objective specification for product development. Preliminary [short] data sheet Qualification This document contains data from the preliminary specification. Product [short] data sheet Production This document contains the product specification. [] Please consult the most recently issued document before initiating or completing a design. [] The term short data sheet is explained in section Definitions. [] The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status information is available on the Internet at URL Definitions Draft The document is a draft version only. The content is still under internal review and subject to formal approval, which may result in modifications or additions. NXP Semiconductors does not give any representations or warranties as to the accuracy or completeness of information included herein and shall have no liability for the consequences of use of such information. Short data sheet A short data sheet is an extract from a full data sheet with the same product type number(s) and title. A short data sheet is intended for quick reference only and should not be relied upon to contain detailed and full information. For detailed and full information see the relevant full data sheet, which is available on request via the local NXP Semiconductors sales office. In case of any inconsistency or conflict with the short data sheet, the full data sheet shall prevail.. Disclaimers General Information in this document is believed to be accurate and reliable. However, NXP Semiconductors does not give any representations or warranties, expressed or implied, as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Right to make changes NXP Semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice. This document supersedes and replaces all information supplied prior to the publication hereof. Suitability for use NXP Semiconductors products are not designed, authorized or warranted to be suitable for use in medical, military, aircraft, space or life support equipment, nor in applications where failure or malfunction of an NXP Semiconductors product can reasonably be expected to result in personal injury, death or severe property or environmental damage. NXP Semiconductors accepts no liability for inclusion and/or use of NXP Semiconductors products in such equipment or applications and therefore such inclusion and/or use is at the customer s own risk. Applications Applications that are described herein for any of these products are for illustrative purposes only. NXP Semiconductors makes no representation or warranty that such applications will be suitable for the specified use without further testing or modification. Limiting values Stress above one or more limiting values (as defined in the Absolute Maximum Ratings System of IEC 0) may cause permanent damage to the device. Limiting values are stress ratings only and operation of the device at these or any other conditions above those given in the Characteristics sections of this document is not implied. Exposure to limiting values for extended periods may affect device reliability. Terms and conditions of sale NXP Semiconductors products are sold subject to the general terms and conditions of commercial sale, as published at including those pertaining to warranty, intellectual property rights infringement and limitation of liability, unless explicitly otherwise agreed to in writing by NXP Semiconductors. In case of any inconsistency or conflict between information in this document and such terms and conditions, the latter will prevail. No offer to sell or license Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.. Trademarks Notice: All referenced brands, product names, service names and trademarks are the property of their respective owners.. Contact information For more information, please visit: For sales office addresses, please send an to: salesaddresses@nxp.com _ Product data sheet Rev. 0 9 April 008 of

13 . Contents Product profile General description Features Applications Pinning information Ordering information Limiting values Recommended operating conditions Characteristics Application information Universal serial bus. and.0 protection Universal serial bus OTG protection Universal SIM-card protection IEEE 9a/b protection Gigabit Ethernet transceiver protection Universal microsd/transflash and SD-memory card protection Package outline Soldering of SMD packages Introduction to soldering Wave and reflow soldering Wave soldering Reflow soldering Abbreviations Revision history Legal information Data sheet status Definitions Disclaimers Trademarks Contact information Contents Please be aware that important notices concerning this document and the product(s) described herein, have been included in section Legal information. For more information, please visit: For sales office addresses, please send an to: salesaddresses@nxp.com Date of release: 9 April 008 Document identifier: _