24AA128/24LC128/24FC128

Transcription

1 18K I C CMOS Serial EEPROM Device Selection Table Part Number Range Max. Clock Frequency Temp. Ranges Temperature ranges: - Industrial (I): -0 C to +8 C - Automotive (E): -0 C to +1 C A8 1.-.V 00 khz (1) I LC18.-.V 00 khz I, E FC V 1 MHz () I Note 1: khz for <.V. : 00 khz for <.V. Features: Single supply with operation down to 1.V for A8/FC18 devices,.v for LC18 devices Low-Power CMOS Technology: - Write current ma, typical - Standby current na, typical -Wire Serial Interface, I C Compatible Cascadable up to Eight Devices Schmitt Trigger Inputs for Noise Suppression Output Slope Control to Eliminate Ground Bounce khz and 00 khz Clock Compatibility 1 MHz Clock for FC Versions Page Write Time ms, typical Self-Timed Erase/Write Cycle -Byte Page Write Buffer <adjust per device> Hardware Write-Protect ESD Protection >000V More than 1 Million Erase/Write Cycles Data Retention > 00 years Factory Programming Available Packages include 8-lead PDIP, SOIC, TSSOP, DFN, MSOP, and Chip Scale Packages Pb-free and RoHS Compliant Package Types A0 1 PDIP/SOIC TSSOP/MSOP 1 XX18 8 A0 Note 1: Pins A0 and are no-connects for the MSOP package only. : Available in I-temp, AA only. 1 XX18 8 Description: The Microchip Technology Inc. A8/LC18/ FC18 (XX18*) is a 1K x 8 (18 Kbit) Serial Electrically Erasable PROM (EEPROM), capable of operation across a broad voltage range (1.V to.v). It has been developed for advanced, low-power applications such as personal communications or data acquisition. This device also has a page write capability of up to bytes of data. This device is capable of both random and sequential reads up to the 18K boundary. Functional address lines allow up to eight devices on the same bus, for up to 1 Mbit address space. This device is available in the standard 8-pin plastic DIP, SOIC (.90 mm and.8 mm), TSSOP, MSOP, DFN, and Chip Scale packages. Block Diagram I/O Control Logic I/O A0 Memory Control Logic XDEC HV Generator EEPROM Array Page Latches YDEC Sense Amp. R/W Control *XX18 is used in this document as a generic part number for the A8/LC18/FC18 devices. A0 DFN 1 8 XX18 CS (Chip Scale) A0 1 8 (TOP DOWN VIEW, BALLS NOT VISIBLE) 008 Microchip Technology Inc. DS1191Q-page 1

2 1.0 ELECTRICAL CHARACTERISTICS Absolute Maximum Ratings ( )...V All inputs and outputs w.r.t V to +1.0V Storage temperature...- C to +10 C Ambient temperature with power applied...-0 C to +1 C ESD protection on all pins... kv NOTICE: Stresses above those listed under Absolute Maximum Ratings may cause permanent damage to the device. This is a stress rating only and functional operation of the device at those or any other conditions above those indicated in the operational listings of this specification is not implied. Exposure to maximum rating conditions for extended periods may affect device reliability. TABLE 1-1: DC CHARACTERISTICS DC CHARACTERISTICS Electrical Characteristics: Industrial (I): = +1.V to.v TA = -0 C to +8 C Automotive (E): = +.V to.v TA = -0 C to 1 C Param. No. Sym. Characteristic Min. Max. Units Conditions D1 A0,,,, and pins: D VIH High-level input voltage 0. V D VIL Low-level input voltage D VHYS Hysteresis of Schmitt Trigger inputs (, pins) V V.V <.V 0.0 V.V (Note 1) D VOL Low-level output voltage 0.0 V IOL =.0 =.V IOL =.1 =.V D ILI Input leakage current ±1 μa VIN = or, = VIN = or, = D ILO Output leakage current ±1 μa VOUT = or D8 CIN, COUT Pin capacitance (all inputs/outputs) 10 pf =.0V (Note 1) TA = C, FCLK = 1 MHz D9 ICC Read Operating current 00 μa =.V, = 00 khz ICC Write ma =.V D10 ICCS Standby current 1 μa TA = -0 C to +8 C = = =.V A0,,, = μa TA = -0 C to 1 C = = =.V A0,,, = Note 1: This parameter is periodically sampled and not % tested. DS1191Q-page 008 Microchip Technology Inc.

3 TABLE 1-: AC CHARACTERISTICS AC CHARACTERISTICS Param. No. Electrical Characteristics: Industrial (I): = +1.V to.v TA = -0 C to +8 C Automotive (E): = +.V to.v TA = -0 C to 1 C Sym. Characteristic Min. Max. Units Conditions 1 FCLK Clock frequency THIGH Clock high time TLOW Clock low time TR and rise time (Note 1) TF and fall time (Note 1) THD:STA Start condition hold time 000 TSU:STA Start condition setup time THD:DAT Data input hold time 0 ns (Note ) 9 TSU:DAT Data input setup time 10 TSU:STO Stop condition setup time TSU: setup time THD: hold time 00 khz 1.V <.V FC18 FC18 FC18 ns All except, FC18 FC18 FC18 ns 1. V <.V. V.V. V.V FC18 Note 1: Not % tested. CB = total capacitance of one bus line in pf. : As a transmitter, the device must provide an internal minimum delay time to bridge the undefined region (minimum 00 ns) of the falling edge of to avoid unintended generation of Start or Stop conditions. : The combined TSP and VHYS specifications are due to new Schmitt Trigger inputs, which provide improved noise spike suppression. This eliminates the need for a TI specification for standard operation. : This parameter is not tested but ensured by characterization. For endurance estimates in a specific application, please consult the Total Endurance Model, which can be obtained from Microchip s web site 008 Microchip Technology Inc. DS1191Q-page

4 TABLE 1-: AC CHARACTERISTICS (CONTINUED) AC CHARACTERISTICS Param. No. 1 TAA Output valid from clock (Note ) 1 TBUF Bus free time: Time the bus must be free before a new transmission can start 1 TOF Output fall time from VIH minimum to VIL maximum CB pf 1 TSP Input filter spike suppression ( and pins) 1 TWC Write cycle time (byte or page) Electrical Characteristics: Industrial (I): = +1.V to.v TA = -0 C to +8 C Automotive (E): = +.V to.v TA = -0 C to 1 C Sym. Characteristic Min. Max. Units Conditions CB FC18 FC18 ns All except, FC18 (Note 1) FC18 (Note 1) 0 ns All except, FC18 (Notes 1 and ) ms 18 Endurance 1,000,000 cycles C (Note ) Note 1: Not % tested. CB = total capacitance of one bus line in pf. : As a transmitter, the device must provide an internal minimum delay time to bridge the undefined region (minimum 00 ns) of the falling edge of to avoid unintended generation of Start or Stop conditions. : The combined TSP and VHYS specifications are due to new Schmitt Trigger inputs, which provide improved noise spike suppression. This eliminates the need for a TI specification for standard operation. : This parameter is not tested but ensured by characterization. For endurance estimates in a specific application, please consult the Total Endurance Model, which can be obtained from Microchip s web site at FIGURE 1-1: BUS TIMING DATA D IN OUT 1 1 (protected) (unprotected) 11 1 DS1191Q-page 008 Microchip Technology Inc.

5 N D E1 E NOTE 1 b 1 e A c φ L1 L DS1191Q-page Microchip Technology Inc.

6 PRODUCT IDENTIFICATION SYSTEM To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office. PART NO. X /XX Device Temperature Range Package Device: A8: 18 Kbit 1.V I C Serial EEPROM A8T: 18 Kbit 1.V I C Serial EEPROM (Tape and Reel) LC18: 18 Kbit.V I C Serial EEPROM LC18T: 18 Kbit.V I C Serial EEPROM (Tape and Reel) FC18: 18 Kbit High Speed I C Serial EEPROM FC18T: 18 Kbit High Speed I C Serial EEPROM (Tape and Reel) Temperature Range: I E = -0 C to +8 C = -0 C to +1 C Package: P = Plastic DIP (00 mil body), 8-lead SN = Plastic SOIC (.90 mm body), 8-lead SM = Plastic SOIC (.8 mm body), 8-lead ST = Plastic TSSOP (. mm), 8-lead MF = Dual, Flat, No Lead (DFN) (x mm body), 8-lead MS = Plastic Micro Small Outline (MSOP), 8-lead CS1K (1) = Chip Scale (CS), 8-lead (I-temp, AA, Tape and Reel only) Examples: a) A8-I/P: Industrial Temp., 1.V, PDIP package. b) A8T-I/SN: Tape and Reel, Industrial Temp., 1.V, SOIC package. c) A8-I/ST: Industrial Temp., 1.V, TSSOP package. d) A8-I/MS: Industrial Temp., 1.V, MSOP package. e) LC18-E/P: Extended Temp.,.V, PDIP package. f) LC18-I/SN: Industrial Temp.,.V, SOIC package. g) LC18T-I/SN: Tape and Reel, Industrial Temp.,.V, SOIC package. h) LC18-I/MS: Industrial Temp.,.V, MSOP package. i) FC18-I/P: Industrial Temp., 1.V, High Speed, PDIP package. j) FC18-I/SN: Industrial Temp., 1.V, High Speed, SOIC package. k) FC18T-I/SN: Tape and Reel, Industrial Temp., 1.V, High Speed, SOIC package l) A8T-I/CS1K:Industrial Temp., 1.V, CS package, Tape and Reel Note 1: 1K indicates 10K technology 00 Microchip Technology Inc. DS1191P-page