Flex Mounting and Soldering Application Note For TOSA

Transcription

1 1925 LMM Flex Mounting and Soldering Application Note For TOSA 1925 LMM Edition December 2009 Introduction This 1925 LMM contains a 3S PHOTONICS DFB laser with monolithically integrated electro-absorption modulator. The modulation voltage is applied to the modulator section while the DFB laser operates CW. Without the complexity of LiNbO3 external modulators, the 1925 LMM is dedicated to STM64 / OC-192 bit rate with reduced size and cost. This device allows 10 Gbit/s data transmission with an extinction ratio higher than 10dB and less than 2V modulation voltage. The 1925 LMM is optimized for up to 10.7Gbit/s TDM transmission systems supporting dispersion up to 1600 ps/nm.

2 Product Pinout N Description 1 TE Cooler Cathode 2 TE Cooler Anode 3 Floating signal ground 4 Modulator Anode (bias-) 5 Floating signal ground 6 PD Anode (bias-) 7 LD Anode (bias-) 8 Thermistor Product Mechanical Details FPC dimensions might be different depending from customer application: 3S Photonics is offering a short FPC version (~7mm) and a longer version that is XMD MSA compliant (~11mm long)

3 Absolute Maximum Ratings Exposure to absolute maximum rating conditions for extended periods may affect device reliability. Table 2 Parameters Min Max Unit Laser module Storage case temperature C Laser Forward Current 150 ma Laser Reverse Voltage 2 V Laser Reverse Current 10 µa Modulator Forward Voltage 1 V Modulator Forward Current 100 ma Modulator Reverse Voltage 5 V Modulator Reverse Current 10 µa Photodiode Forward Current 1 ma Photodiode Reverse Voltage 20 V TEC Voltage 2.6 V TEC Current 1.4 A FPC Flex Pad Soldering Temperature (5s) 290 C Flex bending radius 2 mm Flex torsion angle Flex rework operation 1 time Laser Safety Information Take appropriate precautions to prevent undue exposure to naked eye. This product is classified Class 1M Laser Product according to IEC : edition2. All versions are Class IIIB laser products per 21 CFR Laser. Safety requirements under accession number Handling This product is sensitive to electrostatic discharge and should not be handled except at a static free workstation. Take precautions to prevent ESD; use wrist straps, grounded work surfaces and recognized anti-static techniques when handling the 1925 LMM module. Handle the laser module by its package only, never hold it by its receptacle. Care should be taken to avoid supply transient and over voltage. Over voltage above the maximum specified in absolute maximum rating section may cause permanent damage to the device. ATTENTION OBSERVE PRECAUTIONS FOR HANDLING ELECTROSTATIC DISCHARGE SENSITIVE DEVICES

4 Flex Cable Mounting Procedure 1. Prior to remove the module from its box, please insure you are connected to the ground to prevent from ESD 2. Do not remove the module from the box by the receptacle or the FPC (flex cable) : remove it by holding the part by the package body only 3. Prior to solder the flex cable, it is highly recommended to bake the flex at 85 C during minimum 2 hours to avoid potential flex delamination 4. Prior to solder the flex cable on the PCB, insure that the module package body is laid on a non abrasive plane surface to enable heat flow conduction generated by the soldering heat 5. Apply heat locally on the FPC pad only to solder the flex onto the PC Board Heat applied on other area than the soldering pad of the flex will damage it severely and prevent TOSA utilization F TOSA FPC :Flex cable is flat, no torsion Heat applied on soldering pad to fix the FPC 290 C (5s) PC Board Plane Surface 6. When soldering, avoid to twist the FPC Any twist applied on the FPC with an angle greater than ±10 may damage the flex cable and its connection to the package TOSA package body FPC when flat angle>10 HF ceramic FPC with torsion NO

5 7. Do not apply a soldering temperature greater than 290 C during max 5s on the FPC pad. If FPC is overheated during soldering process, the metallization of the FPC pad can be degraded and copper is frequently removed leading to loss of electrical contact between FPC pad and PCB pad or/and degradation/loss of electrical continuity between the FPC and the TOSA package ceramic interface 8. Once FPC is soldered on the PCB, insure that the module package body is laid on a non abrasive plane surface, then push it into the transceiver cage by applying an horizontal force onto the package body Insure that you do not twist the FPC when pushing F TOSA R 2mm FPC :Flex cable PC Board Plane Surface 9. During TOSA module translation, the FPC must be maintained at a minimum 2mm bending radius to avoid to damage it.

6 Flex Cable Rework Procedure 1. In case FPC initial soldering operation was not satisfactory, the FPC can be removed one time and soldered a second time.during soldering and de-soldering operations, the applied temperature should not exceed 290 C during max 5s. 2. If more than one rework happens or if FPC is overheated during soldering process, the metallization of the FPC is degraded and copper is frequently removed leading to loss of electrical contact between FPC pad and PCB pad (see pictures of page 5) or/and degradation/loss of electrical continuity between the FPC and the TOSA package ceramic interface TOSA Thermal Dissipation Recommendation 1. It is mandatory to use a thermal pad or thermal grease between the TOSA package and PCB to improve thermal dissipation 2. Enough pressure must be applied on TOSA package body in order to maximize the TOSA heat dissipation performance and avoid internal heat increase leading to potential thermal runaway. In case the interface between the TOSA package body and the PCB is loose, heat dissipation is degraded leading to non optimized transceiver power consumption END of Document Customized versions are available for volume quantities. Performance figures contained in this document must be specifically confirmed in writing by 3S PHOTONICS before they become applicable to any order or contract. 3S PHOTONICS reserves the right to make changes to the products or information contained herein without notice. For additional information, contact your Account Manager, or the following: sales@3sphotonics.com Internet: S PHOTONICS S.A. All rights reserved S PHOTONICS S.A. All rights reserved December 2008 December 2009