MPI TS150-HP 150 mm High Power Manual Probe System For accurate High Power measurements up to 10 kv, 600 A

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1 MPI TS15-HP 15 mm High Power Manual Probe System For accurate High Power measurements up to 1 kv, 6 A FEATURES / BENEFITS Universal Use Designed specifically for high power device measurement and wide variety of applications such as Device Characterization and Modeling, Wafer Level Reliability, Failure Analysis, IC Engineering, and MEMS Ergonomic and Safe Design Unique puck controlled air bearing stage for quick single-handed operation Rigid platen accommodates up to 1 high voltage or 4 high current positioners EMI shielded DarkBox and platen ArcShieldTM for safe high voltage applications Highly repeatable platen lift design with three discrete positions for contact, separation, and loading Upgradability Available with various instrument connection options and chuck options and wide range of accessories such as MicroPositioners and microscopes to support various application requirements SPECIFICATIONS Chuck XY Stage (Standard) Total travel range 18 x 23 mm (7.1 x 9.1 in) Fine-travel range 25 x 25 mm fine micrometer control Fine-travel resolution < 1. µm (.4 5 µm/rev Planarity < 1 µm Theta travel (standard) 36 Theta travel (fine) ± 5. Theta resolution 7.5 x 1-3 gradient Puck controlled air bearing stage Optional XY Stage for TS15-ES Planarity < 1 µm (.4 mils) Theta travel (standard) Free movement up to 36 Easy puck controlled air bearing stage for TS15-ES Fine adjustment N/A 1

2 Manual Microscope Stage (Air Bearing) range 25 x 25 mm (1 x 1 in) Resolution N/A Scope lift Manual, tilt-back Air bearing control, fixed by vacuum Manual Microscope Stage (Linear) range 5 x 5 mm (2 x 2 in) Resolution < 5 µm (.2 mils) Scope lift Manual, tilt-back or vertical (depending on microscope type) Independently controlled X and Y movement with locking screws PROBE PLATEN Specifications Material Nickel plated steel Dimensions See drawing Chuck top to platen top Min. 28 mm Max. No of MicroPositioners 1 DC and 4 RF Platen lift control 3 positions - contact (), separation (3 µm), and loading (3 mm) Platen Z-height movement High resolution screw for fine control Z-height adjustment range Max. 2 mm (.8 in) Separation repeatability < 1 µm (.4 mils) by automated control RF MicroPositioner mounting Magnetic with guided rail DC MicroPositioner mounting Magnetic 3 C thermal isolation Depends on chuck configuration R Universal probe platen design for up to 1 DC MicroPositioners 2

3 HIGH POWER PROBES - SELECTION GUIDE High current probes 3 fingers 5 fingers High voltage probes 7 fingers PA-HVT PA-HVC PA-HVC-1KV Max current 4 A 65 A 1 A 2A 2A 2A Max voltage 5 V 5 V 5 V 3, V 5, V 1, V 5 mω 3 mω 1 mω 1 pa 6 pa Banana plug or BNC Banana plug or BNC Banana plug or BNC HV triaxial** 35 µm (Std) 35 µm (Std) 35 µm (Std) Residual resistance (Typical) max. V Connector options Replaceable tip Probe pitch* > 35 TΩ 1 KV UHV or banana plug** SHV Single needle Single needle Single needle *Configurable, **Keysight or Keithley. NON-THERMAL HIGH POWER CHUCKS High Power Chucks Connectivity 1 Coaxial: 1 kv (Banana), 5 kv (SHV) Connectivity 2 MPI HV Kelvin Triax (f): 3 kv (Triaxial mode), 1 kv (Coaxial mode) Diameter 16 mm Material Gold plated aluminum Chuck surface Planar with.5 mm diameter holes in centric sections Vacuum holes selection (diameter) 3, 27, 45, 69, 93, 117, 141 mm Vacuum actuation Manual switch between Center (4 holes), 5, 1, 15 mm (2, 4, 6 in) Supported DUT sizes Single DUTs down to 4 x 4 mm size or wafers 5 mm (2 in) thru 15 mm (6 in)* Surface planarity ± 5 µm Rigidity < 15 µm / 1 *Single DUT testing requires higher vacuum conditions dependent upon testing application. Electrical Specification (Coax) Operation voltage In accordance with EC 611, certificates for higher voltages available upon request Isolation > 2 GΩ Electrical Specification (Triax) Standard Chuck (1 V) High Power Chuck (1 V) Chuck isolation > 1 GΩ > 3 TΩ Force to guard > 1 GΩ > 3 TΩ Guard to shield > 1 GΩ > 5 GΩ Force to shield > 5 GΩ > 1 GΩ 3

4 THERMAL HIGH POWER CHUCKS Specifications of MPI ERS Integrated Technology 2 C to 2 C 2 C to 3 C MPI HV Kelvin Triax (f): 3 kv (Triaxial mode), 1 kv (Coaxial mode) MPI HV Kelvin Triax (f): 3 kv (Triaxial mode), 1 kv (Coaxial mode) Cooling air / Resistance heater Cooling air / Resistance heater Air (user supplied) Air (user supplied) Smallest temperature selection step.1 C.1 C Chuck temperature display resolution.1 C.1 C External touc hsc reen display operation ±.8 C ±.8 C Connectivity Temperature control method Coolant Temperature stability Temperature accuracy.1 C.1 C Low Noise DC/PID Low Noise DC/PID RS232C RS232C Gold plated with pinhole surface Gold plated with pinhole surface Pt1 1/3DIN, 4-line wired Pt1 1/3DIN, 4-line wired Temperature uniformity < ±.5 C < ±.5 C at 2 to 2 C < ±1. C at > 2 C Surface flatness and base parallelism < ±1 µm < ±1 µm 2 to 2 C < 2 min 2 to 2 C < 2 min 2 to 3 C < 25 min 3 to 2 C < 25 min < 15 fa at 25 C < 3 fa at 2 C < 15 fa at 25 C < 5 fa at 3 C < 5 pa at 25 C < 15 pa at 3 C < 1 pa at 2 C < 6 na at 2 C < 6 na at 3 C 1 kv DC 1 kv DC Control method Interfaces Chuck surface plating Temperature sensor Heating and cooling rates* 1 V - Kelvin Triax (f) 3 V 1 kv - Coax BNC (f) Maximum voltage between chuck top and GND *All data are relevant for chucks in ECO mode mm high power thermal chuck 39.6 High current probe dimensions 4

5 TYPICAL TRANSITION TIME AC3 15 mm +2 C to +2 C 25 3 temperature [ C] temperature [ C] AC3 15 mm +2 C to +3 C time [min] time [min] FACILITY REQUIREMENTS Thermal Chuck Electrical Supply Electrical primary connection 1 to 24 VAC auto switch Frequency 5 Hz / 6 Hz Compressed Air Supply Operating pressure 6. bar (.6 MPa, 87 psi) at specified flow rate CDA dew point C Controller Dimensions / Power and Air Consumption System type W x D x H (mm) Weight (kg) Power cons. (VA) max. Air flow* (l/min) 2 to 2 C (Triaxial Chuck) 3 x 36 x to 3 C (Triaxial Chuck) 3 x 36 x *All data are relevant for chucks in ECO mode. General Probe System Power 1-24 V AC nominal; 5/6 Hz for optical accessories* only Vacuum -.5 bar (for single DUT) / -.3 bar (for wafers) Compressed air 6. bar *e.g. microscope illumination, CCD cameras, monitors. REGULATORY COMPLIANCE CE certified. TÜV compliance tested according to EN 611, ISO 121 WARRANTY Warranty*: 12 months Extended service contract: contact MPI Corporation for more information *See MPI Corporation s Terms and Conditions of Sale for more details. 5

6 PHYSICAL DIMENSIONS Station Platform with Bridge* Dimensions (W x D x H) 47 x 55 x 635 mm (18.5 x 19.9 x 25. in) Weight ~6 kg (132 lb.) *Station accessories, such as different microscopes, cameras, or laser cutters, may change the total height Table with DarkBox Dimensions (W x D x H) 9 x 8 x 163 mm (35.4 x 31.5 x 64.2 in) Weight ~19 kg (418 lb.) MPI Global Presence Asia region: EMEA region: America region: Direct contact: ast-asia@mpi-corporation.com ast-europe@mpi-corporation.com ast-americas@mpi-corporation.com MPI global presence: for your local support, please find the right contact here: 6

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