FUZETEC TECHNOLOGY CO., LTD.
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1 NO. PQ18-29E Product Specification and Approval Sheet Version A6 Page 1/5 Surface Mountable PTC Resettable Fuse: Low Rho FSMD1206 Series 1. Summary (a) RoHS Compliant & Halogen Free (b) Applications: All high-density boards (c) Product Features: Small surface mountable, Solid state, Faster time to trip than standard SMD devices, Lower resistance than standard SMD devices (d) Operation : 0.50~6.00A (e) Maximum Voltage: 6VDC (f) Temperature Range : -40 to Agency Recognition UL: *File No. E C-UL: *File No. E TÜ V: File No. R *Note: FSMD RZ UL and C-UL In Process. 3. Electrical Characteristics (23 ) Part Number Hold Trip Rated Voltage Max Typical Power Max Time to Trip Resistance Time RMIN R1MAX IH, A IT, A VMAX, VDC IMAX, A Pd, W A Sec Ohms Ohms FSMD RZ FSMD RZ FSMD RZ FSMD RZ FSMD RZ FSMD RZ FSMD RZ FSMD RZ FSMD RZ FSMD RZ FSMD RZ FSMD RZ FSMD RZ IH=Hold current-maximum current at which the device will not trip at 23 still air. IT=Trip current-minimum current at which the device will always trip at 23 still air. V MAX=Maximum voltage device can withstand without damage at it rated current.(i MAX) I MAX= Maximum fault current device can withstand without damage at rated voltage (V MAX). Pd=Typical power dissipated-type amount of power dissipated by the device when in the tripped state in 23 still air environment. RMIN=Minimum device resistance at 23 prior to tripping. R1MAX=Maximum device resistance at 23 measured 1 hour post trip. Termination pad characteristics Termination pad materials: Pure Tin
2 NO. PQ18-29E Product Specification and Approval Sheet Version A6 Page 2/5 4. FSMD Product Dimensions (Millimeters) Part A B C D E Number Min Max Min Max Min Max Min Max Min Max FSMD RZ FSMD RZ FSMD RZ FSMD RZ FSMD RZ FSMD RZ FSMD RZ FSMD RZ FSMD RZ FSMD RZ FSMD RZ FSMD RZ FSMD RZ
3 Time-to-trip (S) Percent of Rated Hold and Trip NO. PQ18-29E Product Specification and Approval Sheet Version A6 Page 3/5 5. Thermal Derating Curve 200% Low Rho FSMD1206 Series 150% 100% 50% 0% Ambient Temperature (C) 6. Typical Time-To-Trip at 23 A = FSMD RZ B = FSMD RZ C = FSMD RZ D = FSMD RZ E = FSMD RZ F = FSMD RZ G = FSMD RZ H = FSMD RZ I = FSMD RZ J = FSMD RZ K = FSMD RZ L = FSMD RZ M= FSMD RZ A B C D E F G H IJ KL M Fault (A)
4 NO. PQ18-29E Product Specification and Approval Sheet Version A6 Page 4/5 7. Material Specification Terminal pad material: Pure Tin Soldering characteristics: Meets EIA specification RS 186-9E, ANSI/J-std-002 Category 3 8. Part Numbering and Marking System Part Numbering System Part Marking System F S M D 1206 RZ Special Code Rating EZ Example Part Identification EZ = FSMD RZ FZ = FSMD RZ HZ = FSMD RZ JZ = FSMD RZ KZ = FSMD RZ MZ = FSMD RZ QZ = FSMD RZ SZ = FSMD RZ VZ = FSMD RZ WZ = FSMD RZ YZ = FSMD RZ ZZ = FSMD RZ BZ = FSMD RZ Warning: -Operation beyond the specified maximum ratings or improper use may result in damage and possible electrical arcing and/or flame. -PPTC device are intended for occasional overcurrent protection. Application for repeated overcurrent condition and/or prolonged trip are not anticipated. -Avoid contact of PPTC device with chemical solvent. Prolonged contact will damage the device performance.
5 NO. PQ18-29E Product Specification and Approval Sheet Version A6 Page 5/5 9. Pad Layouts Solder Reflow and Rework Recommendations The dimension in the table below provide the recommended pad layout for each Low Rho FSMD1206 device Pad dimensions (millimeters) A B C Device Nominal Nominal Nominal All FSMD1206 Series Profile Feature Pb-Free Assembly Average Ramp-Up Rate (Tsmax to Tp) 3 /second max. Preheat : Temperature Min (Tsmin) 150 Temperature Max (Tsmax) 200 Time (tsmin to tsmax) seconds Time maintained above: Temperature(T L ) Time (t L ) seconds Peak/Classification Temperature(Tp) : 260 Time within 5 of actual Peak : Temperature (tp) seconds Ramp-Down Rate : 6 /second max. Time 25 to Peak Temperature : 8 minutes max. Note 1: All temperatures refer to of the package, measured on the package body surface. Reflow Profile Solder reflow Due to Lead Free nature, Temperature and Dwelling time for the soldering zone is higher than those for Regular. This may cause damage to other components. 1. Recommended max past thickness > 0.25mm. 2. Devices can be cleaned using standard methods and aqueous solvent. 3. Rework use standard industry practices. 4. Storage Environment : < 30 / 60%RH Caution: 1. If reflow temperatures exceed the recommended profile, devices may not meet the performance requirements. 2. Devices are not designed to be wave soldered to the bottom side of the board.
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