M24C16, M24C08 M24C04, M24C02, M24C01

Transcription

1 M24C16, M24C08 M24C04, M24C02, M24C01 16Kbit, 8Kbit, 4Kbit, 2Kbit and 1Kbit Serial I²C bus EEPROM Feature summary Two-wire I²C serial interface Supports 400kHz protocol Single supply voltage: 2.5 to 5.5V for M24Cxx-W 1.8 to 5.5V for M24Cxx-R Write Control input Byte and Page Write (up to 16 Bytes) Random and Sequential Read modes Self-timed programming cycle Automatic address incrementing Enhanced ESD/latch-up protection More than 1 million Write cycles More than 40-year data retention Packages ECOP (RoHS compliant) PDIP8 (BN) SO8 (MN) 150 mil width Table 1. Product list Reference M24C16 M24C08 M24C04 M24C02 M24C01 Part Number M24C16-W M24C16-R M24C08-W M24C08-R M24C04-W M24C04-R M24C02-W M24C02-R M24C01-W M24C01-R TSSOP8 (DW) 169 mil width TSSOP8 (DS) 3x3mm² body size UFDFPN8 (MB) 2x3mm² (MLP) September 2006 Rev 8 1/33 1

2 Contents M24C16, M24C08, M24C04, M24C02, M24C01 Contents 1 Summary description Signal description Serial Clock (SCL) Serial Data (SDA) Chip Enable (E0, E1, E2) Write Control (WC) Supply voltage (V CC ) Operating supply voltage V CC Power-up and device Reset Power-down Device operation Start condition Stop condition Acknowledge Bit () Data input Memory addressing Write operations Byte Write Page Write Minimizing system delays by polling on Read operations Random Address Read Current Address Read Sequential Read Acknowledge in Read mode Initial delivery state Maximum rating DC and AC parameters /33

3 M24C16, M24C08, M24C04, M24C02, M24C01 Contents 7 Package mechanical Part numbering Revision history /33

4 List of tables M24C16, M24C08, M24C04, M24C02, M24C01 List of tables Table 1. Product list Table 2. Signal names Table 3. Device select code Table 4. Operating modes Table 5. Absolute maximum ratings Table 6. Operating conditions (M24Cxx-W) Table 7. Operating conditions (M24Cxx-R) Table 8. DC characteristics (M24Cxx-W, Device Grade 6) Table 9. DC characteristics (M24Cxx-W, Device Grade 3) Table 10. DC characteristics (M24Cxx-R) Table 11. AC measurement conditions Table 12. Input parameters Table 13. AC characteristics (M24Cxx-W) Table 14. AC characteristics (M24Cxx-R) Table 15. PDIP8 8 pin Plastic DIP, 0.25mm lead frame, package mechanical data Table 16. SO8 narrow 8 lead Plastic Small Outline, 150 mils body width, package mechanical data Table 17. UFDFPN8 (MLP8) 8-lead Ultra thin Fine pitch Dual Flat Package No lead 2x3mm², data Table 18. TSSOP8 8 lead Thin Shrink Small Outline, package mechanical data Table 19. TSSOP8 3x3mm² 8 lead Thin Shrink Small Outline, 3x3mm² body size, mechanical data Table 20. Ordering information scheme Table 21. Document revision history /33

5 M24C16, M24C08, M24C04, M24C02, M24C01 List of figures List of figures Figure 1. Logic diagram Figure 2. 8-pin package connections (top view) Figure 3. Device select code Figure 4. Maximum R P value versus bus parasitic capacitance (C) for an I²C bus Figure 5. I²C bus protocol Figure 6. Write mode sequences with WC = 1 (data write inhibited) Figure 7. Write mode sequences with WC = 0 (data write enabled) Figure 8. Write cycle polling flowchart using Figure 9. Read mode sequences Figure 10. AC measurement I/O waveform Figure 11. AC waveforms Figure 12. PDIP8 8 pin Plastic DIP, 0.25mm lead frame, package outline Figure 13. SO8 narrow 8 lead Plastic Small Outline, 150 mils body width, package outline Figure 14. UFDFPN8 (MLP8) 8-lead Ultra thin Fine pitch Dual Flat Package No lead 2x3mm², outline Figure 15. TSSOP8 8 lead Thin Shrink Small Outline, package outline Figure 16. TSSOP8 3x3mm² 8 lead Thin Shrink Small Outline, 3x3mm² body size, package outline /33

6 Summary description M24C16, M24C08, M24C04, M24C02, M24C01 1 Summary description These I²C-compatible electrically erasable programmable memory (EEPROM) devices are organized as 2048/1024/512/256/128 x 8 (M24C16, M24C08, M24C04, M24C02 and M24C01). In order to meet environmental requirements, ST offers these devices in ECOP packages. ECOP packages are Lead-free and RoHS compliant. ECOP is an ST trademark. ECOP specifications are available at: Figure 1. Logic diagram VCC E0-E2 3 SDA SCL M24Cxx WC VSS AI02033 I²C uses a two-wire serial interface, comprising a bi-directional data line and a clock line. The devices carry a built-in 4-bit Device Type Identifier code (1010) in accordance with the I²C bus definition. The device behaves as a slave in the I²C protocol, with all memory operations synchronized by the serial clock. Read and Write operations are initiated by a Start condition, generated by the bus master. The Start condition is followed by a Device Select Code and Read/Write bit (RW) (as described in Table 3), terminated by an acknowledge bit. When writing data to the memory, the device inserts an acknowledge bit during the 9 th bit time, following the bus master s 8-bit transmission. When data is read by the bus master, the bus master acknowledges the receipt of the data byte in the same way. Data transfers are terminated by a Stop condition after an Ack for Write, and after a NoAck for Read. Table 2. Signal names E0, E1, E2 Chip Enable SDA SCL WC V CC V SS Serial Data Serial Clock Write Control Supply Voltage Ground 6/33

7 M24C16, M24C08, M24C04, M24C02, M24C01 Summary description Figure 2. 8-pin package connections (top view) 16Kb/8Kb/4Kb/2Kb/1Kb NC / NC / NC/ E0/ E0 NC / NC/ E1/ E1/ E1 NC/ E2/ E2/ E2/ E2 VSS M24Cxx VCC WC SCL SDA AI02034E 1. NC = Not Connected 2. See Section 7: Package mechanical for package dimensions, and how to identify pin-1. 7/33

8 Signal description M24C16, M24C08, M24C04, M24C02, M24C01 2 Signal description 2.1 Serial Clock (SCL) This input signal is used to strobe all data in and out of the device. In applications where this signal is used by slave devices to synchronize the bus to a slower clock, the bus master must have an open drain output, and a pull-up resistor can be connected from Serial Clock (SCL) to V CC. (Figure 4 indicates how the value of the pull-up resistor can be calculated). In most applications, though, this method of synchronization is not employed, and so the pullup resistor is not necessary, provided that the bus master has a push-pull (rather than open drain) output. 2.2 Serial Data (SDA) This bi-directional signal is used to transfer data in or out of the device. It is an open drain output that may be wire-or ed with other open drain or open collector signals on the bus. A pull up resistor must be connected from Serial Data (SDA) to V CC. (Figure 4 indicates how the value of the pull-up resistor can be calculated). 2.3 Chip Enable (E0, E1, E2) These input signals are used to set the value that is to be looked for on the three least significant bits (b3, b2, b1) of the 7-bit Device Select Code. These inputs must be tied to V CC or V SS, to establish the Device Select Code as shown in Figure 3. Figure 3. Device select code V CC V CC M24Cxx E i M24Cxx E i V SS V SS Ai Write Control (WC) This input signal is useful for protecting the entire contents of the memory from inadvertent write operations. Write operations are disabled to the entire memory array when Write Control (WC) is driven High. When unconnected, the signal is internally read as V IL, and Write operations are allowed. When Write Control (WC) is driven High, Device Select and Address bytes are acknowledged, Data bytes are not acknowledged. 8/33

9 M24C16, M24C08, M24C04, M24C02, M24C01 Signal description 2.4 Supply voltage (V CC ) Operating supply voltage V CC Prior to selecting the memory and issuing instructions to it, a valid and stable V CC voltage within the specified [V CC (min), V CC (max)] range must be applied (see Table 6 and Table 7). In order to secure a stable DC supply voltage, it is recommended to decouple the V CC line with a suitable capacitor (usually of the order of 10nF to 100nF) close to the V CC /V SS package pins. This voltage must remain stable and valid until the end of the transmission of the instruction and, for a Write instruction, until the completion of the internal write cycle (t W ). The V CC rise time must not vary faster than 1V/µs Power-up and device Reset In order to prevent inadvertent Write operations during Power-up, a Power On Reset (POR) circuit is included. At Power-up (continuous rise of V CC ), the device does not respond to any instruction until V CC has reached the Power On Reset threshold voltage (this threshold is lower than the minimum V CC operating voltage defined in Table 6 and Table 7). When V CC has passed the POR threshold, the device is reset and in Standby Power mode Power-down At Power-down (where V CC decreases continuously), as soon as V CC drops from the operating voltage range to below the Power On Reset threshold voltage, the device stops responding to any instruction sent to it. During Power-down, the device must be deselected and in the Standby Power mode (that is there should be no internal Write cycle in progress). Figure Maximum R P value versus bus parasitic capacitance (C) for an I²C bus V CC Maximum RP value (kω) fc = 400kHz fc = 100kHz MASTER SDA SCL R P C R P C C (pf) AI01665b 9/33

10 Signal description M24C16, M24C08, M24C04, M24C02, M24C01 Figure 5. I²C bus protocol SCL SDA START Condition SDA Input SDA Change STOP Condition SCL SDA MSB START Condition SCL SDA MSB STOP Condition AI00792B Table 3. Device select code Device Type Identifier (1) Chip Enable (2),(3) RW b7 b6 b5 b4 b3 b2 b1 b0 M24C01 Select Code E2 E1 E0 RW M24C02 Select Code E2 E1 E0 RW M24C04 Select Code E2 E1 A8 RW M24C08 Select Code E2 A9 A8 RW M24C16 Select Code A10 A9 A8 RW 1. The most significant bit, b7, is sent first. 2. E0, E1 and E2 are compared against the respective external pins on the memory device. 3. A10, A9 and A8 represent most significant bits of the address. 10/33

11 M24C16, M24C08, M24C04, M24C02, M24C01 Device operation 3 Device operation The device supports the I²C protocol. This is summarized in Figure 5. Any device that sends data on to the bus is defined to be a transmitter, and any device that reads the data to be a receiver. The device that controls the data transfer is known as the bus master, and the other as the slave device. A data transfer can only be initiated by the bus master, which will also provide the serial clock for synchronization. The M24Cxx device is always a slave in all communication. 3.1 Start condition Start is identified by a falling edge of Serial Data (SDA) while Serial Clock (SCL) is stable in the High state. A Start condition must precede any data transfer command. The device continuously monitors (except during a Write cycle) Serial Data (SDA) and Serial Clock (SCL) for a Start condition, and will not respond unless one is given. 3.2 Stop condition Stop is identified by a rising edge of Serial Data (SDA) while Serial Clock (SCL) is stable and driven High. A Stop condition terminates communication between the device and the bus master. A Read command that is followed by NoAck can be followed by a Stop condition to force the device into the Stand-by mode. A Stop condition at the end of a Write command triggers the internal Write cycle. 3.3 Acknowledge Bit () The acknowledge bit is used to indicate a successful byte transfer. The bus transmitter, whether it be bus master or slave device, releases Serial Data (SDA) after sending eight bits of data. During the 9 th clock pulse period, the receiver pulls Serial Data (SDA) Low to acknowledge the receipt of the eight data bits. 3.4 Data input During data input, the device samples Serial Data (SDA) on the rising edge of Serial Clock (SCL). For correct device operation, Serial Data (SDA) must be stable during the rising edge of Serial Clock (SCL), and the Serial Data (SDA) signal must change only when Serial Clock (SCL) is driven Low. 11/33

12 Device operation M24C16, M24C08, M24C04, M24C02, M24C Memory addressing To start communication between the bus master and the slave device, the bus master must initiate a Start condition. Following this, the bus master sends the Device Select Code, shown in Table 3 (on Serial Data (SDA), most significant bit first). The Device Select Code consists of a 4-bit Device Type Identifier, and a 3-bit Chip Enable Address (E2, E1, E0). To address the memory array, the 4-bit Device Type Identifier is 1010b. Each device is given a unique 3-bit code on the Chip Enable (E0, E1, E2) inputs. When the Device Select Code is received, the device only responds if the Chip Enable Address is the same as the value on the Chip Enable (E0, E1, E2) inputs. However, those devices with larger memory capacities (the M24C16, M24C08 and M24C04) need more address bits. E0 is not available for use on devices that need to use address line A8; E1 is not available for devices that need to use address line A9, and E2 is not available for devices that need to use address line A10 (see Figure 2 and Table 3 for details). Using the E0, E1 and E2 inputs, up to eight M24C02 (or M24C01), four M24C04, two M24C08 or one M24C16 devices can be connected to one I²C bus. In each case, and in the hybrid cases, this gives a total memory capacity of 16 Kbits, 2 KBytes (except where M24C01 devices are used). The 8 th bit is the Read/Write bit (RW). This bit is set to 1 for Read and 0 for Write operations. If a match occurs on the Device Select code, the corresponding device gives an acknowledgment on Serial Data (SDA) during the 9 th bit time. If the device does not match the Device Select code, it deselects itself from the bus, and goes into Stand-by mode. Table 4. Operating modes Mode RW bit WC (1) Bytes Initial Sequence Current Address Read 1 X 1 START, Device Select, RW = 1 Random Address Read Sequential Read 1 X 1 1. X = V IH or V IL. 0 X START, Device Select, RW = 0, Address 1 1 X restart, Device Select, RW = 1 Similar to Current or Random Address Read Byte Write 0 V IL 1 START, Device Select, RW = 0 Page Write 0 V IL 16 START, Device Select, RW = 0 12/33

13 M24C16, M24C08, M24C04, M24C02, M24C01 Device operation Figure 6. Write mode sequences with WC = 1 (data write inhibited) WC NO Byte Write DEV SEL BYTE ADDR DATA IN START R/W STOP WC NO NO Page Write DEV SEL BYTE ADDR DATA IN 1 DATA IN 2 DATA IN 3 START R/W WC (cont'd) NO NO Page Write (cont'd) DATA IN N STOP AI02803C 3.6 Write operations Following a Start condition the bus master sends a Device Select Code with the Read/Write bit (RW) reset to 0. The device acknowledges this, as shown in Figure 7, and waits for an address byte. The device responds to the address byte with an acknowledge bit, and then waits for the data byte. When the bus master generates a Stop condition immediately after the Ack bit (in the 10 th bit time slot), either at the end of a Byte Write or a Page Write, the internal Write cycle is triggered. A Stop condition at any other time slot does not trigger the internal Write cycle. During the internal Write cycle, Serial Data (SDA) and Serial Clock (SCL) are ignored, and the device does not respond to any requests Byte Write After the Device Select code and the address byte, the bus master sends one data byte. If the addressed location is Write-protected, by Write Control (WC) being driven High (during the period from the Start condition until the end of the address byte), the device replies to the data byte with NoAck, as shown in Figure 6, and the location is not modified. If, instead, the addressed location is not Write-protected, the device replies with Ack. The bus master terminates the transfer by generating a Stop condition, as shown in Figure 7. 13/33

14 Device operation M24C16, M24C08, M24C04, M24C02, M24C Page Write The Page Write mode allows up to 16 bytes to be written in a single Write cycle, provided that they are all located in the same page in the memory: that is, the most significant memory address bits are the same. If more bytes are sent than will fit up to the end of the page, a condition known as roll-over occurs. This should be avoided, as data starts to become overwritten in an implementation dependent way. The bus master sends from 1 to 16 bytes of data, each of which is acknowledged by the device if Write Control (WC) is Low. If the addressed location is Write-protected, by Write Control (WC) being driven High (during the period from the Start condition until the end of the address byte), the device replies to the data bytes with NoAck, as shown in Figure 6, and the locations are not modified. After each byte is transferred, the internal byte address counter (the 4 least significant address bits only) is incremented. The transfer is terminated by the bus master generating a Stop condition. Figure 7. Write mode sequences with WC = 0 (data write enabled) WC BYTE WRITE DEV SEL BYTE ADDR DATA IN START R/W STOP WC PAGE WRITE DEV SEL BYTE ADDR DATA IN 1 DATA IN 2 DATA IN 3 START R/W WC (cont'd) PAGE WRITE (cont'd) DATA IN N STOP AI02804B 14/33

15 M24C16, M24C08, M24C04, M24C02, M24C01 Device operation Figure 8. Write cycle polling flowchart using WRITE Cycle in Progress START Condition DEVICE SELECT with RW = 0 NO Returned First byte of instruction with RW = 0 already decoded by the device YES NO Next Operation is Addressing the Memory YES ReSTART Send Address and Receive STOP NO START Condition YES DATA for the WRITE Operation DEVICE SELECT with RW = 1 Continue the WRITE Operation Continue the Random READ Operation AI01847C Minimizing system delays by polling on During the internal Write cycle, the device disconnects itself from the bus, and writes a copy of the data from its internal latches to the memory cells. The maximum Write time (t w ) is shown in Table 13 and Table 14, but the typical time is shorter. To make use of this, a polling sequence can be used by the bus master. The sequence, as shown in Figure 8, is: Initial condition: a Write cycle is in progress. Step 1: the bus master issues a Start condition followed by a Device Select Code (the first byte of the new instruction). Step 2: if the device is busy with the internal Write cycle, no Ack will be returned and the bus master goes back to Step 1. If the device has terminated the internal Write cycle, it responds with an Ack, indicating that the device is ready to receive the second part of the instruction (the first byte of this instruction having been sent during Step 1). 15/33

16 Device operation M24C16, M24C08, M24C04, M24C02, M24C01 Figure 9. CURRENT ADDRESS READ Read mode sequences DEV SEL DATA OUT NO START R/W STOP NO RANDOM ADDRESS READ DEV SEL * BYTE ADDR DEV SEL * DATA OUT START R/W START R/W STOP SEQUENTIAL CURRENT READ NO DEV SEL DATA OUT 1 DATA OUT N START R/W STOP SEQUENTIAL RANDOM READ DEV SEL * BYTE ADDR DEV SEL * DATA OUT 1 START R/W START R/W NO DATA OUT N STOP AI The seven most significant bits of the Device Select Code of a Random Read (in the 1 st and 3 rd bytes) must be identical. 3.7 Read operations Read operations are performed independently of the state of the Write Control (WC) signal. The device has an internal address counter which is incremented each time a byte is read Random Address Read A dummy Write is first performed to load the address into this address counter (as shown in Figure 9) but without sending a Stop condition. Then, the bus master sends another Start condition, and repeats the Device Select Code, with the Read/Write bit (RW) set to 1. The device acknowledges this, and outputs the contents of the addressed byte. The bus master must not acknowledge the byte, and terminates the transfer with a Stop condition. 16/33

17 M24C16, M24C08, M24C04, M24C02, M24C01 Device operation Current Address Read For the Current Address Read operation, following a Start condition, the bus master only sends a Device Select Code with the Read/Write bit (RW) set to 1. The device acknowledges this, and outputs the byte addressed by the internal address counter. The counter is then incremented. The bus master terminates the transfer with a Stop condition, as shown in Figure 9, without acknowledging the byte Sequential Read This operation can be used after a Current Address Read or a Random Address Read. The bus master does acknowledge the data byte output, and sends additional clock pulses so that the device continues to output the next byte in sequence. To terminate the stream of bytes, the bus master must not acknowledge the last byte, and must generate a Stop condition, as shown in Figure 9. The output data comes from consecutive addresses, with the internal address counter automatically incremented after each byte output. After the last memory address, the address counter rolls-over, and the device continues to output data from memory address 00h Acknowledge in Read mode For all Read commands, the device waits, after each byte read, for an acknowledgment during the 9 th bit time. If the bus master does not drive Serial Data (SDA) Low during this time, the device terminates the data transfer and switches to its Stand-by mode. 17/33

18 Initial delivery state M24C16, M24C08, M24C04, M24C02, M24C01 4 Initial delivery state The device is delivered with all bits in the memory array set to 1 (each byte contains FFh). 5 Maximum rating Stressing the device outside the ratings listed in Table 5 may cause permanent damage to the device. These are stress ratings only, and operation of the device at these, or any other conditions outside those indicated in the Operating sections of this specification, is not implied. Exposure to Absolute Maximum Rating conditions for extended periods may affect device reliability. Refer also to the STMicroelectronics SURE Program and other relevant quality documents. Table 5. Absolute maximum ratings Symbol Parameter Min. Max. Unit T A Ambient Operating Temperature C T STG Storage Temperature C T LEAD PDIP-Specific Lead Temperature during Soldering 260 (2) C Lead Temperature during Soldering see note (1) C V IO Input or Output range V V CC Supply Voltage V V ESD Electrostatic Discharge Voltage (Human Body model) (2) V 1. Compliant with JEDEC Std J-STD-020C (for small body, Sn-Pb or Pb assembly), the ST ECOP specification, and the European directive on Restrictions on Hazardous Substances (RoHS) 2002/95/EU. 2. T LEAD max must not be applied for more than 10s. 1. T LEAD max must not be applied for more than 10s. 2. AEC-Q (compliant with JEDEC Std JESD22-A114A, C1=100pF, R1=1500Ω, R2=500Ω). 18/33

19 M24C16, M24C08, M24C04, M24C02, M24C01 DC and AC parameters 6 DC and AC parameters This section summarizes the operating and measurement conditions, and the DC and AC characteristics of the device. The parameters in the DC and AC Characteristic tables that follow are derived from tests performed under the Measurement Conditions summarized in the relevant tables. Designers should check that the operating conditions in their circuit match the measurement conditions when relying on the quoted parameters. Table 6. Operating conditions (M24Cxx-W) Symbol Parameter Min. Max. Unit V CC Supply Voltage V T A Ambient Operating Temperature (Device Grade 6) Ambient Operating Temperature (Device Grade 3) C C Table 7. Operating conditions (M24Cxx-R) Symbol Parameter Min. Max. Unit V CC Supply Voltage V T A Ambient Operating Temperature C Table 8. DC characteristics (M24Cxx-W, Device Grade 6) Symbol Parameter Test Condition (in addition to those in Table 6) Min. Max. Unit I LI Input Leakage Current (SCL, SDA, E0, E1,and E2) V IN = V SS or V CC, device in Standby mode ± 2 µa I LO Output Leakage Current V OUT = V SS or V CC, SDA in Hi-Z ± 2 µa I CC I CC1 Supply Current Stand-by Supply Current V IL Input Low Voltage (1) V CC =5V, f c =400kHz (rise/fall time < 30ns) V CC =2.5V, f c =400kHz (rise/fall time < 30ns) V IN = V SS or V CC, for 2.5V < V CC = < 5.5V 2 ma 1 ma 1 µa V CC V V IH Input High Voltage (1) 0.7V CC V CC +1 V V OL Output Low Voltage I OL = 2.1mA when V CC = 2.5V or I OL = 3mA when V CC = 5.5V 1. The voltage source driving only E0, E1 and E2 inputs must provide an impedance of less than 1kΩ. 0.4 V 19/33

20 DC and AC parameters M24C16, M24C08, M24C04, M24C02, M24C01 Table 9. DC characteristics (M24Cxx-W, Device Grade 3) Symbol Parameter Test Condition (in addition to those in Table 6) Min. Max. Unit I LI Input Leakage Current (SCL, SDA, E0, E1,and E2) V IN = V SS or V CC, device in Standby mode ± 2 µa I LO Output Leakage Current V OUT = V SS or V CC, SDA in Hi-Z ± 2 µa I CC I CC1 Supply Current Stand-by Supply Current V IL Input Low Voltage (1) V CC =5V, f C =400kHz (rise/fall time < 30ns) V CC =2.5V, f C =400kHz (rise/fall time < 30ns) 3 ma 3 ma V IN = V SS or V CC, V CC = 5 V 5 µa V IN = V SS or V CC, V CC = 2.5 V 2 µa V CC V V IH Input High Voltage (1) 0.7V CC V CC +1 V V OL Output Low Voltage I OL = 2.1mA when V CC = 2.5V or I OL = 3mA when V CC = 5.5V 1. The voltage source driving only E0, E1 and E2 inputs must provide an impedance of less than 1kΩ. 0.4 V Table 10. Symbol DC characteristics (M24Cxx-R) Parameter Test Condition (in addition to those in Table 7) Min. Max. Unit I LI Input Leakage Current (SCL, SDA, E0, E1,and E2) V IN = V SS or V CC, device in Standby mode ± 2 µa I LO Output Leakage Current V OUT = V SS or V CC, SDA in Hi-Z ± 2 µa I CC I CC1 Supply Current Stand-by Supply Current V IL Input Low Voltage (1) V CC =1.8V, f c =400kHz (rise/fall time < 30ns) V IN = V SS or V CC, 1.8V < V CC < 2.5V 0.8 ma 1 µa 2.5 V V CC V CC V 1.8 V V CC < 2.5V V CC V V IH Input High Voltage (1) 0.7V CC V CC +1 V V OL Output Low Voltage I OL = 0.7 ma, V CC = 1.8 V 0.2 V 1. The voltage source driving only E0, E1 and E2 inputs must provide an impedance of less than 1kΩ. 20/33

21 M24C16, M24C08, M24C04, M24C02, M24C01 DC and AC parameters Table 11. AC measurement conditions Symbol Parameter Min. Max. Unit C L Load Capacitance 100 pf Input Rise and Fall Times 50 ns Input Levels 0.2V CC to 0.8V CC V Input and Output Timing Reference Levels 0.3V CC to 0.7V CC V Figure 10. AC measurement I/O waveform Input Levels 0.8V CC Input and Output Timing Reference Levels 0.7V CC 0.2V CC 0.3V CC AI00825B Table 12. Input parameters Symbol Parameter (1),(2) Test Condition Min. Max. Unit C IN Input Capacitance (SDA) 8 pf C IN Input Capacitance (other pins) 6 pf Z WCL WC Input Impedance V IN < 0.3 V kω Z WCH WC Input Impedance V IN > 0.7V CC 500 kω t NS Pulse width ignored (Input Filter on SCL and SDA) Single glitch 100 ns 1. T A = 25 C, f = 400kHz 2. Sampled only, not 100% tested. 21/33

22 DC and AC parameters M24C16, M24C08, M24C04, M24C02, M24C01 Table 13. AC characteristics (M24Cxx-W) Test conditions specified in Table 6 and Table 11 Symbol Alt. Parameter Min. Max. Unit f C f SCL Clock Frequency 400 khz t CHCL t HIGH Clock Pulse Width High 600 ns t CLCH t LOW Clock Pulse Width Low 1300 ns t (1) DL1DL2 t F SDA Fall Time ns t DXCX t SU:DAT Data In Set Up Time 100 ns t CLDX t HD:DAT Data In Hold Time 0 ns t CLQX t DH Data Out Hold Time 200 ns (2) t CLQV t AA Clock Low to Next Data Valid (Access Time) ns (3) t CHDX t SU:STA Start Condition Set Up Time 600 ns t DLCL t HD:STA Start Condition Hold Time 600 ns t CHDH t SU:STO Stop Condition Set Up Time 600 ns Time between Stop Condition and Next Start t DHDL t BUF 1300 ns Condition (4) t W t WR Write Time 5 ms 1. Sampled only, not 100% tested. 2. To avoid spurious START and STOP conditions, a minimum delay is placed between SCL=1 and the falling or rising edge of SDA. 3. For a restart condition, or following a Write cycle. 4. Previous devices bearing the process letter L in the package marking guarantee a maximum write time of 10ms. For more information about these devices and their device identification, please ask your ST Sales Office for Process Change Notices PCN MPG/EE/0061 and 0062 (PCEE0061 and PCEE0062). 22/33

23 M24C16, M24C08, M24C04, M24C02, M24C01 DC and AC parameters Table 14. AC characteristics (M24Cxx-R) Test conditions specified in Table 7 and Table 10 Symbol Alt. Parameter Min. Max. Unit f C f SCL Clock Frequency 400 khz t CHCL t HIGH Clock Pulse Width High 600 ns t CLCH t LOW Clock Pulse Width Low 1300 ns t (1) DL1DL2 t F SDA Fall Time ns t DXCX t SU:DAT Data In Set Up Time 100 ns t CLDX t HD:DAT Data In Hold Time 0 ns t CLQX t DH Data Out Hold Time 200 ns (2) t CLQV t AA Clock Low to Next Data Valid (Access Time) ns (3) t CHDX t SU:STA Start Condition Set Up Time 600 ns t DLCL t HD:STA Start Condition Hold Time 600 ns t CHDH t SU:STO Stop Condition Set Up Time 600 ns Time between Stop Condition and Next Start t DHDL t BUF 1300 ns Condition t W t WR Write Time 10 ms 1. Sampled only, not 100% tested. 2. To avoid spurious START and STOP conditions, a minimum delay is placed between SCL=1 and the falling or rising edge of SDA. 3. For a restart condition, or following a Write cycle. 23/33

24 DC and AC parameters M24C16, M24C08, M24C04, M24C02, M24C01 Figure 11. AC waveforms tchcl tclch SCL tdlcl SDA In tchdx START Condition SDA Input tcldx SDA Change tdxcx tchdh tdhdl STOP START Condition Condition SCL SDA In tchdh STOP Condition tw Write Cycle tchdx START Condition SCL tclqv tclqx SDA Out Data Valid AI00795C 24/33

25 M24C16, M24C08, M24C04, M24C02, M24C01 Package mechanical 7 Package mechanical Figure 12. PDIP8 8 pin Plastic DIP, 0.25mm lead frame, package outline b2 E A2 A A1 L b e ea c D eb 8 E1 1 PDIP-B 1. Drawing is not to scale. Table 15. Symbol PDIP8 8 pin Plastic DIP, 0.25mm lead frame, package mechanical data millimeters inches Typ. Min. Max. Typ. Min. Max. A A A b b c D E E e ea eb L /33

26 Package mechanical M24C16, M24C08, M24C04, M24C02, M24C01 Figure 13. SO8 narrow 8 lead Plastic Small Outline, 150 mils body width, package outline h x 45 A2 b e A ccc c D 0.25 mm GAUGE PLANE 8 k 1 E1 E A1 L1 L SO-A 1. Drawing is not to scale. 2. The 1 that appears in the top view of the package shows the position of pin 1 and the N indicates the total number of pins. Table 16. Symbol SO8 narrow 8 lead Plastic Small Outline, 150 mils body width, package mechanical data millimeters inches Typ Min Max Typ Min Max A A A b c ccc D E E e h k L L /33

27 M24C16, M24C08, M24C04, M24C02, M24C01 Package mechanical Figure 14. UFDFPN8 (MLP8) 8-lead Ultra thin Fine pitch Dual Flat Package No lead 2x3mm², outline D e b L3 L1 E E2 A L A1 ddd D2 UFDFPN Drawing is not to scale. 2. The central pad (the area E2 by D2 in the above illustration) is pulled, internally, to V SS. It must not be allowed to be connected to any other voltage or signal line on the PCB, for example during the soldering process. 3. The circle in the top view of the package indicates the position of pin 1. Table 17. Symbol UFDFPN8 (MLP8) 8-lead Ultra thin Fine pitch Dual Flat Package No lead 2x3mm², data millimeters inches Typ Min Max Typ Min Max A A b D D ddd E E e L L L /33

28 Package mechanical M24C16, M24C08, M24C04, M24C02, M24C01 Figure 15. TSSOP8 8 lead Thin Shrink Small Outline, package outline D 8 5 c E1 E 1 4 α CP A A2 A1 L L1 b e TSSOP8AM 1. Drawing is not to scale. 2. The circle in the top view of the package indicates the position of pin 1. Table 18. Symbol TSSOP8 8 lead Thin Shrink Small Outline, package mechanical data millimeters inches Typ. Min. Max. Typ. Min. Max. A A A b c CP D e E E L L α /33

29 M24C16, M24C08, M24C04, M24C02, M24C01 Package mechanical Figure 16. TSSOP8 3x3mm² 8 lead Thin Shrink Small Outline, 3x3mm² body size, package outline D 8 5 c E1 E 1 4 α CP A A2 A1 L L1 b e TSSOP8BM 1. Drawing is not to scale. 2. The circle in the top view of the package indicates the position of pin 1. Table 19. Symbol TSSOP8 3x3mm² 8 lead Thin Shrink Small Outline, 3x3mm² body size, mechanical data millimeters inches Typ. Min. Max. Typ. Min. Max. A A A b c D E E e CP L L α /33

30 Part numbering M24C16, M24C08, M24C04, M24C02, M24C01 8 Part numbering Table 20. Ordering information scheme Example: M24C16 W DW 3 T P /W Device Type M24 = I 2 C serial access EEPROM Device Function 16 = 16 Kbit (2048 x 8) 08 = 8 Kbit (1024 x 8) 04 = 4 Kbit (512 x 8) 02 = 2 Kbit (256 x 8) 01 = 1 Kbit (128 x 8) Operating Voltage W = V CC = 2.5 to 5.5V (400 khz) R = V CC = 1.8 to 5.5V (400 khz) Package BN = PDIP8 MN = SO8 (150 mil width) MB = UDFDFPN8 (MLP8) DW = TSSOP8 (169 mil width) DS = TSSOP8 (3x3mm² body size, MSOP8) (1) Device Grade 6 = Industrial temperature range, 40 to 85 C. Device tested with standard test flow 3 = Device tested with High Reliability Certified Flow (2). Automotive temperature range ( 40 to 125 C) Option T = Tape and Reel Packing Plating Technology blank = Standard SnPb plating P or G = ECOP (RoHS compliant) Process (3) /W or /S = F6SP36% 1. Products sold in this package are Not Recommended for New Design. 2. ST strongly recommends the use of the Automotive Grade devices for use in an automotive environment. The High Reliability Certified Flow (HRCF) is described in the quality note QNEE9801. Please ask your nearest ST sales office for a copy. 3. Used only for Device Grade 3. For a list of available options (speed, package, etc.) or for further information on any aspect of this device, please contact your nearest ST Sales Office. The category of second Level Interconnect is marked on the package and on the inner box label, in compliance with JEDEC Standard JESD97. The maximum ratings related to soldering conditions are also marked on the inner box label. 30/33

31 M24C16, M24C08, M24C04, M24C02, M24C01 Revision history 9 Revision history Table 21. Document revision history Date Version Changes 10-Dec Apr May Extra labelling to Fig-2D 23-Nov Feb TSSOP8 Turned-Die package removed (p 2 and order information) Lead temperature added for TSSOP8 in table 2 Labelling change to Fig-2D, correction of values for E and main caption for Tab-13 SBGA package information removed to an annex document -R range changed to being the -S range, and the new -R range added SBGA package information put back in this document Lead Soldering Temperature in the Absolute Maximum Ratings table amended Write Cycle Polling Flow Chart using illustration updated References to PSDIP changed to PDIP and Package Mechanical data updated Wording brought in to line with standard glossary 20-Apr Revision of DC and AC characteristics for the -S series 08-Oct Nov Jul Feb May Oct Mar Ball numbers added to the SBGA connections and package mechanical illustrations Specification of Test Condition for Leakage Currents in the DC Characteristics table improved Document reformatted using new template. SBGA5 package removed TSSOP8 (3x3mm² body size) package (MSOP8) added. -L voltage range added Document title spelt out more fully. W -marked devices with tw=5ms added. -R voltage range upgraded to 400kHz working, and no longer preliminary data. 5V voltage range at temperature range 3 (-xx3) no longer preliminary data. -S voltage range removed. -Wxx3 voltage+temp ranged added as preliminary data. Table of contents, and Pb-free options added. Minor wording changes in Summary Description, Power-On Reset, Memory Addressing, Read Operations. V IL (min) improved to -0.45V. t W (max) value for -R voltage range corrected. MLP package added. Absolute Maximum Ratings for V IO (min) and V CC (min) changed. Soldering temperature information clarified for RoHS compliant devices. Device grade information clarified. Process identification letter G information added V range is removed, and V range is now Not for New Design 31/33

32 Revision history M24C16, M24C08, M24C04, M24C02, M24C01 Table 21. Document revision history Date Version Changes 7-Oct Jan Sep Product List summary table added. AEC-Q compliance. Device Grade information clarified. Updated Device internal reset section, Figure 3, Figure 4, Table 14 and Table 20 Added Ecopack information. Updated tw=5ms for the M24Cxx-W. Pin numbers removed from silhouettes (see on page 1). Internal Device Reset paragraph moved to below Section 2.4: Supply voltage (VCC). Section 2.4: Supply voltage (VCC) added below Section 2: Signal description. Test conditions for V OL updated in Table 8 and Table 9 SO8N package specifications updated (see Table 16) New definition of I CC1 over the whole V CC range (see Tables 8, 9 and 10). Document converted to new ST template. SO8 and UFDFPN8 package specifications updated (see Section 7: Package mechanical). Section 2.4: Supply voltage (VCC) clarified. I LI value given with the device in Standby mode in Tables 8, 9 and 10. Information given in Table 14: AC characteristics (M24Cxx-R) are no longer preliminary data. 32/33

33 M24C16, M24C08, M24C04, M24C02, M24C01 Please Read Carefully: Information in this document is provided solely in connection with ST products. STMicroelectronics NV and its subsidiaries ( ST ) reserve the right to make changes, corrections, modifications or improvements, to this document, and the products and services described herein at any time, without notice. All ST products are sold pursuant to ST s terms and conditions of sale. Purchasers are solely responsible for the choice, selection and use of the ST products and services described herein, and ST assumes no liability whatsoever relating to the choice, selection or use of the ST products and services described herein. No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted under this document. If any part of this document refers to any third party products or services it shall not be deemed a license grant by ST for the use of such third party products or services, or any intellectual property contained therein or considered as a warranty covering the use in any manner whatsoever of such third party products or services or any intellectual property contained therein. UNLESS OTHERWISE SET FORTH IN ST S TERMS AND CONDITIONS OF SALE ST DISCLAIMS ANY EXPRESS OR IMPLIED WARRANTY WITH RESPECT TO THE USE AND/OR SALE OF ST PRODUCTS INCLUDING WITHOUT LIMITATION IMPLIED WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE (AND THEIR EQUIVALENTS UNDER THE LAWS OF ANY JURISDICTION), OR INFRINGEMENT OF ANY PATENT, COPYRIGHT OR OTHER INTELLECTUAL PROPERTY RIGHT. UNLESS EXPRESSLY APPROVED IN WRITING BY AN AUTHORIZED ST REPRESENTATIVE, ST PRODUCTS ARE NOT RECOMMENDED, AUTHORIZED OR WARRANTED FOR USE IN MILITARY, AIR CRAFT, SPACE, LIFE SAVING, OR LIFE SUSTAINING APPLICATIONS, NOR IN PRODUCTS OR SYSTEMS WHERE FAILURE OR MALFUNCTION MAY RESULT IN PERSONAL INJURY, DEATH, OR SEVERE PROPERTY OR ENVIRONMENTAL DAMAGE. ST PRODUCTS WHICH ARE NOT SPECIFIED AS "AUTOMOTIVE GRADE" MAY ONLY BE USED IN AUTOMOTIVE APPLICATIONS AT USER S OWN RISK. Resale of ST products with provisions different from the statements and/or technical features set forth in this document shall immediately void any warranty granted by ST for the ST product or service described herein and shall not create or extend in any manner whatsoever, any liability of ST. ST and the ST logo are trademarks or registered trademarks of ST in various countries. Information in this document supersedes and replaces all information previously supplied. The ST logo is a registered trademark of STMicroelectronics. All other names are the property of their respective owners STMicroelectronics - All rights reserved STMicroelectronics group of companies Australia - Belgium - Brazil - Canada - China - Czech Republic - Finland - France - Germany - Hong Kong - India - Israel - Italy - Japan - Malaysia - Malta - Morocco - Singapore - Spain - Sweden - Switzerland - United Kingdom - United States of America 33/33