TEXAS INSTRUMENTS ANALOG UNIVERSITY PROGRAM DESIGN CONTEST MIXED SIGNAL TEST INTERFACE CHRISTOPHER EDMONDS, DANIEL KEESE, RICHARD PRZYBYLA SCHOOL OF
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1 TEXASINSTRUMENTSANALOGUNIVERSITYPROGRAMDESIGNCONTEST MIXED SIGNALTESTINTERFACE CHRISTOPHEREDMONDS,DANIELKEESE,RICHARDPRZYBYLA SCHOOLOFELECTRICALENGINEERINGANDCOMPUTERSCIENCE OREGONSTATEUNIVERSITY
2 I. PROJECT DESCRIPTION Graduate students in the Analog/Mixed Signals group at Oregon State University need a reliable system for on chip calibration of the analog integrated circuits that they design. A well designed on chip system would reduce the number of pins devoted to calibrating a prototype integrated circuit, and would simplify the calibration process. Furthermore, this system should require only a minimal amount of die area and be compatible with multiple CMOS processes. Our solution for on chip calibration, depicted in Figure 1, uses an SPI compatible four wire interface to access an on chip register file. These registers output parallel digital data to the rest of the chip. This data can be applied directly to the circuitry under test, or it can be passed through digital to analog converters (DAC), converting the data into an analog voltages. Using these voltages, a user can bias and calibrate analog portions of the chip. Integrated Circuit Serial Interface Bus MTI Digital Layout Macro DAC Bus DAC Bus DAC DAC Analog Stimulus Analog Stimulus Digital Stimulus Digital Stimulus Circuitry Under Test Figure 1: Block Diagram of Mixed Signal Test Interface To demonstrate system functionality, we implemented two versions of the Mixed Signal Test Interface (MTI) in AMI Semiconductor s C5N technology, which is a.5 μm CMOS process, through MOSIS s educational program. Our system requires only 2.4 mm 2 to implement in the C5N process, and since most chips designed in the Analog/Mixed Signals group at OSU are designed in shorter length processes, the effective size of the system is very small, making the system viable for use in testing and calibration applications where it would fit into a corner of the die. We have completed testing of the first chip and it is performing quite well. The second chip is recently back from fabrication, and is in the testing process now. In the remainder of this document, a reader will find a brief outline of each block in our system, as well as a detailed description of how the group used TI analog parts in the testing and characterization of our chip and the motivation for selecting specific TI parts. Title page: Left, first integrated circuit. Right, second integrated circuit. Each die is 3mm x 3mm. 2 of 12
3 Edmonds,Keese,Przybyla Figure2:Normalmicroscopeimageof100bitserialcontroller(left)and10bitserialcontroller(right).Thesmall rectangularpatternedareasaremetalfill,addedtomeetprocessingrequirements.thelinesleavingtheblocks totherightgotothedacs.thelinesenteringthecontrollersfromtheleftarethespisignals. DIGITALINTERFACE ThedigitalinterfaceisSPIcompatibleforchip to PCserialcommunications.Sincethedigital to analog convertersare10 bits,thegroupchosetoimplementadigitalwordsizeof10bits.onthefirstchip, each10 bitregisterisindependentlyaccessiblethroughanaddressdecoder.thegroupimplemented thedigitalportionsofeachoftheintegratedcircuitsusingastandardcelllibraryprovidedbyamis.the designwassynthesizedusingverilogandthenplaced and routedusingtoolsfromthecadencedesign Suite. Therearethreeserialcontrollersonthefirstchip.Onecontrollerhasonly10bits,andisasimpleshift register(noaddressing).theothertwocontrollersuseaddressing.oneisa100 bitdesignwithten10 bitregisters,whiletheotheris1000bitsor100registers. Adesignrequirementfortheprojectisthattheinterfacebesuitableforimplementationinother (shorter length)cmosprocesses,andweusedourdigitalsynthesissoftwaretoimplementourdigital circuitryinourprocessaswellasa45nmprocess(notfabricated). Manyprocessesunfortunatelydonothaveastandardcelllibraryavailableforusebyoutsidecustomers, suchasgraduatestudents.inthiscase,anydigitalcellusedinthedesignmustbedesignedbyhand.in ordertoreducethecomplexityofthelibraryforoursecondrun,weimplementedasimpleshiftregister digitalarchitecture.theshiftregisterarchitecturedoesnotuseaddressing,butsimplyshiftsthedata downtheregisteroneachsuccessiveclockcycle.thisshiftregisterdesignonlyuses3logicgates NOR, NOT,andasimpleDflip flop. 3of12
4 Edmonds,Keese,Przybyla Figure3:Darkfieldmicroscopyimageof100bitserialcontroller(center),10bitserialcontroller(smallsquare, centerright),and1000bitserialcontroller(bottomright,onlyaportionisvisible),implementedonourfirstchip in.5 μmcmos. Figure4:Imageofsecondchip'sserialcontroller,whichoutputs60bits.Thiscellonlyuses3digitalcells:aNOT, anor,andadflip flop. 4of12
5 USER INTERFACE In order to aid implementation of the MTI the group created a graphical software tool. This tool allows a user with a digital cell library for their process to implement the digital portions of the MTI (the serial controller) in a straightforward and standardized manner. The group chose to divide the user interface into four panes for ease of use. Figure 5: Panes of the user interface. In order to create a GDSII layout of the digital portions of the chip the user must simply fill in all of the requested fields. In the first pane of the user interface, the user must provide information about the number of outputs that the serial controller should have and its clock frequency. In the second pane, the locations of library definition files are requested. In the third pane, the user must provide information about power routing. This includes how many power rings the digital cell should have, which layer(s) they should be in and how wide the power rings should be. Finally, after inputting all of the prerequisite information, the user hits the build button. This button activates scripts that coordinate the actions of three separate tools in the background generating verilog code, synthesizing the code into gates and then place and routing the design into a final layout. At each step of the process the design is checked against test vectors to ensure proper operation of the final layout. The serial controllers on both chips were designed using the serial interface in order to ensure the correctness of its output. In addition, the user interface has been used to create designs with three different cell libraries of different geometries, complexities, and cell contents. These libraries ranged from one designed for a 45nm process to the 0.5um process used in this project. In all cases, the layout produced by the user interface proved to be correct. 5 of 12
6 Figure 6: Build window of the MTI user interface. This shows the progress of implementation of the MTI digital block. 6 of 12
7 Figure 7: Normal microscope image of a current mode DAC, implemented on first run. At left, the thermometer decoder, which is (mostly) obscured by metal fill. At right, the 1024 current sources (small red squares) are visible along with the control signals (gold color) that control them. The operational amplifier is at near the top of the photo, with the compensation capacitor easily visible (green rectangle) DIGITAL TO ANALOG CONVERTERS The digital to analog converter is 10 bits, and is designed to be used in low frequency calibration applications. For the first chip, a current steering architecture was used. The DAC has 1024 (2 10 ) individual current sources (long channel transistors) which are turned on or off, forming an analog current, which is then converted to an analog voltage using an operational amplifier. The current sources are controlled through a segmented architecture which uses 5 thermometer bits and 5 binary bits. The five least significant bits (LSBs) are binary and directly control 1, 2, 4, 8, and 16 current sources, respectively. The five MSBs are digitally decoded into 31 thermometer (unary) signals which each control 32 current sources. The segmented architecture ensures excellent linearity while keeping the size of the binary to thermometer decoder small. Five DACs were implemented on the first chip. Four of them are identical, with their inputs connected to the various serial controllers, while the fifth DAC is isolated from the rest of the chip to allow modular testing. 7 of 12
8 Edmonds,Keese,Przybyla Onthesecondchip,a10bitdelta sigmadacwithanerror feedback,2ndordernoiseshapingloopwas implemented.inthisadesign,10bitsarequantizedtotwobits,whichareswitchedathighfrequencyto synthesizethedesiredsignal.thequantizationnoiseisshiftedoutofthesignal sfrequencybandbythe noiseshapingloop.thisnoisecanthenberemovedwithalow passfilter.whilethistopologyofdacis notsuitableforcalibration,becauseitdoesnotguaranteeaone to onerelationshipbetweeninputcode andoutputvoltage,itprovedavaluablelearningexerciseforthemembersofthegroup,andtheoutput issuitableforuseinmanyotherapplications. Figure8:Darkfieldmicroscopyimageoffirstchipshowing4currentmodedigitaltoanalogconverters(center). OneachDAC,thedenseareaontheleftisthethermometerdecoder,andthecurrentcellsaretotherightofthe decoder.theopampisbarelyvisibleabovethecurrentsources.totheleft,aportionofthe1000bitserial controllerisvisible. 8of12
9 Figure 9: The Delta Sigma DAC on the second chip. In a Delta Sigma DAC, the quantization, noise shaping, and error feedback is accomplished in the digital domain (largest block, center left). The output of the modulator controls 3 differential current sources. 9 of 12
10 Figure 10: The daughter board, which was hand loaded. The packaged chip is the large IC in the center. Jumpers are used for modular testing and to test power consumption. A precision TI reference is near upper right. TEST AND DEMONSTRATION BOARD We designed a printed circuit board (PCB) that will allow us to test both chips. The PCB is designed in a modular arrangement. The mother board contains a USB to SPI chip, which allows us to use a computer to communicate with our chips, and is compatible with two daughter cards, one of which is designed for our first chip and one designed that s for our second chip. On the daughter board, the analog portion of the chip is biased using TI precision references. The analog outputs of the DACs are buffered using TI operational amplifiers, which drive TI audio amplifiers. In the demonstration of the chip the audio amplifiers are used to play music using the digital interface and the DACs. We have four DACs connected to two stereo audio amplifiers, so we can produce two channels of stereo audio. The test and demonstration board uses a TI part for onboard power regulation, ensuring clean and accurate supply voltages for the chip under test. 10 of 12
11 II. DESCRIPTION OF EACH ANALOG TI PART USED IN DESIGN 1. REG102 5: Provides on board voltage regulation for the test and demonstration board. Input power is from a 9V wall wart, through a protection diode and a switch. The design group selected the REG102 5 because of its low noise operation, small footprint, and internal current limit circuitry. The regulator outputs 5V at up to 250mA, and current limits at 400mA. The use of an onboard regulator allows us to maintain an accurate, low noise voltage supply. This is very important when characterizing our DACs, as it is likely that supply voltage noise would couple to the DAC output through the on chip opamp. The group selected a linear regulator because power efficiency was not important, and we wanted low noise operation, which is hard to achieve with switching regulators. We used a separate analog and digital grounds, as well as separate analog and digital supply voltages. We separated the supplies with an LC filter consisting of a ferrite bead and decoupling capacitors. This ensures that very little of the noise generated by digital transitions in the digital portion of our chip will couple (through the supply) to the analog portion. 2. REF5020/REF5030/REF5045: Provides a low noise reference for reference current generation. This reference is connected, through a potentiometer, to diode connected devices on the chip which are used bias the DAC s opamp as well as its current sources. The use of a low noise reference in this application was important, because a portion of any noise present at the potentiometer will couple to the DAC output through the on chip bias voltages. If, for example, we had just used the supply voltage and a potentiometer to bias the DACs, we would have expected to see much more power supply noise on the bias voltage nets. We selected the 2.048V part (for the first chip) because we expected our bias voltages to be between 1V and 1.5V, depending on process variations of our specific run. Choosing a higher voltage output would have meant a larger resistor for the same bias current. This would have lead to increased Johnson noise contribution from the resistor, as Johnson noise is proportional to the square root of the resistance. To further reduce the noise, we used a.1uf capacitor on each of the bias nets, to limit the noise bandwidth of the bias net to BW noise gm Ω = =.25 = 36.25Hz, (1) 4 C 0.1μ F where g m is the g m of the mirroring transistor. For the second chip, we selected the 3V part to bias our operational amplifiers, and a 4.5V part to bias the DAC current sources. Again, the group selected these parts in an effort to minimize noise contribution from the supply and to limit the size of the resistor required to bias the mirroring transistors. 11 of 12
12 3. TLV2771/TLV2772/TLV2774: Buffers the outputs of the DACs as close to the chip as possible, limiting the amount of capacitance the on chip opamps must drive. These parts were selected because they are unity gain stable, and they can drive the input impedance of the audio amplifiers. They have 5.1MHz unity gain bandwidth, which is ample for our configuration. They have 17nV/ Hz input referred noise, but this is tolerable because they are in a unity gain configuration on the test PCB. Without a buffer for the output of each DAC, it is possible that the operational amplifier in the DAC could become unstable and oscillate at high frequency. For the second chip, we needed an operational amplifier with a slew rate of greater than 5V/μ sec, for the outputs of the delta sigma DAC. Since the TLV2771/2/4 provides 10.5V/ μ sec, and since we were already using it for our first system, it was an obvious choice. TPA302: Audio amplifier used for audio demonstration of our chip s serial interface and digital to analog converters. We chose this audio amplifier because it provides enough power to drive headphones or the input of powered speakers, but does not draw too much power, which would increase the requirements for our power supply. We connected this part in a unity gain configuration, because the full scale (peak to peak) output of the DAC is already sufficiently large to drive powered computer speakers. 12 of 12
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