HD74HC174. Hex D-type Flip-Flops (with Clear) ADE (Z) 1st. Edition Sep Description. Features. Function Table
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1 Hex D-type Flip-Flops (with Clear) ADE (Z) 1st. Edition Sep Description This device contains 6 master-slave flip-flops with a common clock and common clear. Data on the D input having the specified setup and hold times is transferred to the output on the low to high transition of the clock input. The clear input when low, sets all outputs to a low state. Features High Speed Operation: t pd (Clock to ) = 15 ns typ (C L = 50 pf) High Output Current: Fanout of 10 LSTTL Loads Wide Operating Voltage: V CC = 2 to 6 V Low Input Current: 1 µa max Low uiescent Supply Current: I CC (static) = 4 µa max (Ta = 25 C) Function Table Inputs Outputs Clear Clock D L X X L H H H H L L H L X no change H X no change
2 Pin Arrangement Clear 1 16 V CC 1 1D 2 3 D D D 2D D D D 5 3D D D D 4 GND 8 9 Clock (Top view) Logic Diagram Clock 1D 1 Clear 2D 2 3D 3 4D 4 5D 5 6D 6 2
3 DC Characteristics Ta = 40 to Ta = 25 C +85 C Item Symbol V CC (V) Min Typ Max Min Max Unit Test Conditions Input voltage V IH V V IL V Output voltage V OH V Vin = V IH or V IL I OH = 20 µa I OH = 4 ma I OH = 5.2 ma V OL V Vin = V IH or V IL I OL = 20 µa I OL = 4 ma I OL = 5.2 ma Input current Iin 6.0 ±0.1 ±1.0 µa Vin = V CC or GND uiescent supply current I CC µa Vin = V CC or GND, Iout = 0 µa 3
4 AC Characteristics (C L = 50 pf, Input t r = t f = 6 ns) Ta = 40 to Ta = 25 C +85 C Item Symbol V CC (V) Min Typ Max Min Max Unit Test Conditions Maximum clock f max MHz frequency Propagation delay t PLH ns Clock to time t PHL Clear to Setup time t su ns Data to Clock Hold time t h ns Clock to Data Removal time t rem ns Clear to Clock Pulse width t w ns Clock, Clear Output rise/fall t TLH ns time t THL Input capacitance Cin pf 4
5 Package Dimensions Max Max Max 2.54 ± ± Min 2.54 Min 5.06 Max DP g Max Max 1.27 *0.42 ± ± ± Max 0.15 *0.22 ± ± ± M *Dimension including the plating thickness Base material dimension FP-16DA 0.24 g 5
6 Max Max Max *0.22 ± ± *0.42 ± ± M *Dimension including the plating thickness Base material dimension FP-16DN 0.15 g * ± Max M 0.65 Max 6.40 ± Max 0.10 *0.17 ± ± ± 0.10 *Dimension including the plating thickness Base material dimension TTP-16DA 0.05 g 6
7 Cautions 1. Hitachi neither warrants nor grants licenses of any rights of Hitachi s or any third party s patent, copyright, trademark, or other intellectual property rights for information contained in this document. Hitachi bears no responsibility for problems that may arise with third party s rights, including intellectual property rights, in connection with use of the information contained in this document. 2. Products and product specifications may be subject to change without notice. Confirm that you have received the latest product standards or specifications before final design, purchase or use. 3. Hitachi makes every attempt to ensure that its products are of high quality and reliability. However, contact Hitachi s sales office before using the product in an application that demands especially high quality and reliability or where its failure or malfunction may directly threaten human life or cause risk of bodily injury, such as aerospace, aeronautics, nuclear power, combustion control, transportation, traffic, safety equipment or medical equipment for life support. 4. Design your application so that the product is used within the ranges guaranteed by Hitachi particularly for maximum rating, operating supply voltage range, heat radiation characteristics, installation conditions and other characteristics. Hitachi bears no responsibility for failure or damage when used beyond the guaranteed ranges. Even within the guaranteed ranges, consider normally foreseeable failure rates or failure modes in semiconductor devices and employ systemic measures such as failsafes, so that the equipment incorporating Hitachi product does not cause bodily injury, fire or other consequential damage due to operation of the Hitachi product. 5. This product is not designed to be radiation resistant. 6. No one is permitted to reproduce or duplicate, in any form, the whole or part of this document without written approval from Hitachi. 7. Contact Hitachi s sales office for any questions regarding this document or Hitachi semiconductor products. Hitachi, Ltd. Semiconductor & Integrated Circuits. Nippon Bldg., 2-6-2, Ohte-machi, Chiyoda-ku, Tokyo , Japan Tel: Tokyo (03) Fax: (03) URL NorthAmerica : Europe : Asia : Japan : For further information write to: Hitachi Semiconductor (America) Inc. 179 East Tasman Drive, San Jose,CA Tel: <1> (408) Fax: <1>(408) Hitachi Europe GmbH Electronic Components Group Dornacher Straβe 3 D Feldkirchen, Munich Germany Tel: <49> (89) Fax: <49> (89) Hitachi Europe Ltd. Electronic Components Group. Whitebrook Park Lower Cookham Road Maidenhead Berkshire SL6 8YA, United Kingdom Tel: <44> (1628) Fax: <44> (1628) Hitachi Asia Ltd. Hitachi Tower 16 Collyer uay #20-00, Singapore Tel : <65> / Fax : <65> / URL : Hitachi Asia Ltd. (Taipei Branch Office) 4/F, No. 167, Tun Hwa North Road, Hung-Kuo Building, Taipei (105), Taiwan Tel : <886>-(2) Fax : <886>-(2) Telex : HAS-TP URL : Hitachi Asia (Hong Kong) Ltd. Group III (Electronic Components) 7/F., North Tower, World Finance Centre, Harbour City, Canton Road Tsim Sha Tsui, Kowloon, Hong Kong Tel : <852>-(2) Fax : <852>-(2) URL : Copyright Hitachi, Ltd., All rights reserved. Printed in Japan. Colophon 2.0 7
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