JP2380 Sensor Module. JP Sensor. Features: MCU Embedded. Specifications. Sensor with total solution

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1 JP Sensor Sensor with total solution JP2380 is an ultra-thin CMOS fingerprint sensor combined with MCU which can be widely applied in smart card since it is neat and compact. Cermet-like coating provides up to 6H hardness and protects sensor against scratch, impact and daily wear-and-tear. The JP2380 is an enhanced version of JP2360 since algorithm inside MCU is integrated together with sensor. The highly integrated module can reduce the system complication and be easily applied in smart card. Sensor with total solution is always JP Sensor s commitment. Features: * Cermet-like coating up to 6H * UART, GPIO interface * 64-bit encrypted security key * 4KV ESD protection HBM MCU Embedded Algorithm included Specifications: Category Specifications Resolution 508 DPI Image capture Speed 8 frames/sec Sensor Type Capacitance Type Security Key 64-bit encrypted Hardness 6H Surface Cermet-like Coating Power input 3.3V Anti-ESD +/-4kV Environment -0~50 / < RH 90% Capture Area 192 x 192 pixels Pixel resolution 256 true gray scale values Module Dimension 13.5 x 25 x 0.61 mm (W x L x T) Interface UART, GPIO Certification

2 Contents: 1. Introduction 2. Revision history 3. Pinouts and Pin description 4. Electrical characteristics 5. Set 5-1. Introduction 5-2. Communication Protocol: Format 5-3. Communication Protocol: List 5-4. Communication Protocol: Code 5-5. detail 5-6. Procedure 6. Mechanical properties 7. Disclaimer 2

3 1. Introduction: JP2380 is an ultra-thin CMOS fingerprint sensor combined with MCU which can be widely applied in smart card since it is neat and compact. Cermet-like coating provides up to 6H hardness and protects sensor against scratch, impact and daily wear-and-tear. The JP2380 is an enhanced version of JP2360 since algorithm inside MCU is integrated together with sensor. The highly integrated module can reduce the system complication and be easily applied in smart card. Sensor with total solution is always JP Sensor s commitment. PARAMETER DESCRIPTION VALUE UNIT Dimension Sensor module 13.5 x 25 x 0.61 mm Weight Sensor module 0.3 gram Sensing Area 10 x 10 mm Sensing Array 192 x 192 Pixels Resolution 508 dpi Pixel Resolution 256 gray scale levels 8 bit Operating ISO ~ 50 C temperature Storage temperature -20 ~ 85 C ESD IEC level 2, air discharge ±4 KV Package type 12 pin, 0.5mm pitch, ACF 12 Pin Connector Internal Flash 384KB Up to 160 registered fingerprints (Based on 3 times enrollments) 3

4 2. Revision history: Date Revision # Description Total Page Nov 16, Preliminary spec 24 Dec 23, Update parameters 18 Dec 25, Modify pin description 19 Jan 19, Update command set 35 Jan 20, Update mechanical drawing 35 4

5 3. Pinouts and Pin description: Pinouts: J2 (PCB Top side Top View) Pin1 (PCB Bottom side Top View) Pin description: There are two modes used by J2: (1) Mode 1 IO configuration, (2) Mode 2 UART configuration. (See next page) 5

6 Mode 1 - IO Configuration: GPIO2 is pulled down by internal 10K Ohm Resistor when power-on. PIN NUMBER PIN DEFINITION ATTRIBUTE DESCRIPTION 1 GPIO1 Input Key In, Need a Pull-down Resistor 2 GPIO2 Output L : Default, H: After Verified 3 GPIO3 Output L : Default, H: After Verified 4 GPIO4 Output L : Default, H: After Verified 5 GPIO5 Output L : Default, H: After Verified 6 PWR_ON Output Latch Regulator CE. 7 LED Output LED Green 8 LED Output LED Red 9 3V3 Power 3.3 Volts Power Input 10 GND Power Ground 11 GND Power Ground 12 ESD Passive ESD Path, Connect to Ground 6

7 Mode 2 - UART Configuration: GPIO2 is pulled up by external 3K Ohm Resistor. JP2380 is configured as UART function according to the status of the GPIO2 during power-up. PIN NUMBER PIN DEFINITION ATTRIBUTE DESCRIPTION 1 GPIO1 Input Key In, Need a Pull-down Resistor 2 GPIO2 Output H : Default, L: After Verified 3 GPIO3 Output L : Default, H: After Verified 4 GPIO4 Output L : Default, H: After Verified 5 GPIO5 Output L : Default, H: After Verified 6 PWR_ON Output Latch Regulator CE. 7 UART_TX Output To Host RX 8 UART_RX Input To Host TX 9 3V3 Power 3.3 Volts Power Input 10 GND Power Ground 11 GND Power Ground 12 ESD Passive ESD Path, Connect to Ground 7

8 4. Electrical characteristics: Voltage characteristics SYMBOL DESCRIPTION MIN TYP MAX UNIT 3V3 Vcc Volt Current characteristics (Power consumption in different mode) SYMBOL DESCRIPTION MIN TYP MAX UNIT I_3V3(op) Current in operating mode 9 ma Thermal characteristics SYMBOL DESCRIPTION VALUE UNIT T_STG Storage temperature range -40 to +85 C RH_STG Relative humidity range < 90 % 8

9 5. Set 5-1. Introduction Features: Embedded algorithm Capacitance sensor Functions: Accurate and fast fingerprint recognition. Thin capacitance sensor. Verify (1:1) and Identify (1:N). Image download. Access to Template UART GPIO interface Specifications: Item Description MCU Atmel SAMG55G19A Sensor Capacitance Sensor Sensing Area 10 x 10 (mm) Sensing Array 192 x 192 pixels Resolution 508 dpi Fingerprint Storage 500 Fingerprint templates Authentication Verify (1:1) or Identify (1:N) Template Size Bytes Interface UART, Initial baud rate 9600 FAR < 0.001% FRR < 1% Enrollment Time < 10 sec (6 times) Identifying Time < 1 sec (1) 9

10 5-2. Communication Protocol: Format JP2360 provides multiple UART commands for developers to communicate the sensor module. This section will list detail usage and description of these UART commands. UART default settings is as follows: Description Vaule Note. Baud rate 9600 bits/sec Adjustable via proper command Character length 8 Parity type N None parity check Stop bits 1 Number of bits between two characters Communication Format: There are three types of communication formats. Format is used for host sending to client (sensor module). Format is used for client (sensor module) replying to host. Furthermore, Additional Data Format is used for huge binary data sending from client to host. Format: Format consists of 8 bytes HEX words. Byte 0 means MSB and Byte 7 means LSB. Check Sum: Byte1(MSB) Check Sum: Byte2(LSB) Parameter: Byte1(MSB) Parameter: Byte2 Parameter: Byte3 Parameter: Byte4(LSB) Header: see List UART Header: 0x02 10

11 Format: Format consists of 8 bytes HEX words. Byte 0 means MSB and Byte 7 means LSB. Check Sum: Byte1(MSB) Check Sum: Byte2(LSB) Result: Byte1(MSB) Result: Byte2 Result: Byte3 Result: Byte4(LSB) Header: see List UART Header: 0x02 Additional Data Format: Additional Data Format consists of a dynamic data size and two bytes check sum. The length of data is assigned by specific. Description Length (byte) Note. Data Len See Detail Check Sum 2 11

12 5-3. Communication Protocol: List Biometric command Code (HEX) Description CAPTURE_IMAGE 0x60 Capture image from sensor CAPTURE_AND_VERIFY 0x50 Capture image from sensor and then verify the specific ID CAPTURE_AND_IDENTIFY ENROLL_INTO_RAM ENROLL_INTO_FLASH 0x51 0x23 0x24 Capture image from sensor and then identify whether the fingerprint match some specfic ID Capture image from sensor and enroll the fingerprint into RAM Capture image from sensor and enroll the fingerprint into FLASH Image transfer command Code (HEX) Description UPLOAD_IMAGE 0x63 Upload image to Host DOWNLOAD_IMAGE 0x64 Download image from Host to RAM/FLASH (TBD) Template handling command Code (HEX) Description DELETE_ID 0x40 Delete the template of the specific ID DELETE_ALL 0x41 Delete all template UPLOAD_TEMPLATE_FROM_RAM 0x42 Upload template from RAM (TBD) UPLOAD_TEMPLATE_FROM_FLASH 0x43 Upload template form FLASH (TBD) DOWNLOAD_TEMPLATE_TO_RAM 0x44 Download template to RAM (TBD) DOWNLOAD_TEMPLATE_TO_FLASH 0x45 Download template to FLASH (TBD) COPY_TEMPLATE_RAM_TO_FLASH 0x46 Copy template from RAM to FLASH (TBD) Firmware command Code (HEX) Description READ_FIRMWARE 0x01 Read strings of firmware information UPDATE_FIRMWARE 0x02 Update the firmware (TBD) Communication command Code (HEX) Description CHANGE_BAUDRATE 0x04 Change the baudrate of UART connection TEST_HARDWARE 0x05 Test the hardware component (e.g., connection status, sensor status, security status, etc.) (TBD) 12

13 Misc. command Code (HEX) Description CANCEL 0xE0 Cancel the previous command, such as ENROLL_INTORAM, CAPTURE_AND_VERIFY, CAPTURE_AND_IDENTIFY (On going) CHECK_IF_ENROLLED 0x21 Check if the specific ID is enrolled ENTER_SLEEP_MODE ADVANCE_SETTING 0x70 0x71 Enter sleep mode for power-saving (wake up by activating specific pin) (TBD) Advance configurations, such as voltage control, Main Clock, Baud rate setting, etc. (TBD) 5-4. Communication Protocol: List Code (HEX) Description ACK 0x30 ACK is sent if command was successfully executed NACK 0x31 NACK is sent if command was executed with failure 13

14 5-5. Communication Protocol: Detail Biometric command CAPTURE_IMAGE An image is captured from the fingerprint sensor. The fingerprint image is placed in RAM and can be uploaded by the command Upload Image. Calculation is done on the image to determine if a finger is present or not present on the sensor. 0x02 0x CS_LSB CS_MSB 0x02 0x30 Result CS_LSB CS_MSB B2: 0x30 = no finger detected B2: 0x31 = finger present 14

15 5-5-2 CAPTURE_AND_VERIFY The respond is return and images are captured in a loop from the sensor until a finger is present. After enrolment, the template is compared with the enrolled finger ID template stored in the flash and the result is return. 0x02 0x50 ID CS_LSB CS_MSB B2: ID from 1 to 80 0x02 0x CS_LSB CS_MSB Additional Data 0x02 0x30 Result CS_LSB CS_MSB B2: 0x36 = successful to match a specific ID assigned by user B2: 0x37 = failure 15

16 5-5-3 CAPTURE_AND_IDENTIFY The respond is return and images are captured in a loop from the sensor until a finger is present. After enrolment, the template is compared with all the enrolled finger ID templates stored in the flash and the result is return. 0x02 0x CS_LSB CS_MSB 0x02 0x CS_LSB CS_MSB Additional Data 0x02 0x30 Result ID 0 0 CS_LSB CS_MSB B2: 0x36 = successful to match a specific ID B2: 0x37 = failure B3: ID from 1 to 80, and 0 for identification failure 16

17 5-5-4 ENROLL_INTO_RAM The respond is return and images are captured in a loop from the sensor until a finger is present. After enrolment, the template is stored in RAM and the result is return. 0x02 0x23 Count CS_LSB CS_MSB B2: 0x31 for 1 st press B2: 0x32 for 2 nd press B2: 0x33 for 3 rd press 0x02 0x CS_LSB CS_MSB Additional Data 0x02 0x30 Result CS_LSB CS_MSB B2: 0x36 = successful B2: 0x37 = failure 17

18 5-5-5 ENROLL_INTO_FLASH Save the enrollment data in SRAM to the Flash according to the finger ID. 0x02 0x24 ID CS_LSB CS_MSB B2: ID from 1 to 80 0x02 0x30 Result CS_LSB CS_MSB B2: 0x36 = successful B2: 0x37 = failure 18

19 Image transfer command UPLOAD_IMAGE 0x02 0x CS_LSB CS_MSB 0x02 0x30 Len_LSB Len_MSB 0 0 CS_LSB CS_MSB Additional Data B0 B(Len-1) B(Len) B(Len+1) Image data CS_LSB CS_MSB 19

20 5-5-7 DOWNLOAD_IMAGE 0x02 0x CS_LSB CS_MSB 0x02 0x30 Len_LSB Len_MSB 0 0 CS_LSB CS_MSB Additional Data B0 B(Len-1) B(Len) B(Len+1) Image data CS_LSB CS_MSB Template handling command DELETE_ID 0x02 0x40 ID CS_LSB CS_MSB B2: ID from 1 to 80 0x02 0x30 Result CS_LSB CS_MSB B2: 0x30 = successful B2: 0x31 = failure 20

21 5-5-9 DELETE_ALL 0x02 0x CS_LSB CS_MSB 0x02 0x30 Result CS_LSB CS_MSB B2: 0x30 = successful B2: 0x31 = failure UPLOAD_TEMPLATE_FROM_RAM 0x02 0x CS_LSB CS_MSB 0x02 0x30 Result CS_LSB CS_MSB B2: 0x30 = successful B2: 0x31 = failure 21

22 UPLOAD_TEMPLATE_FROM_FLASH 0x02 0x CS_LSB CS_MSB 0x02 0x30 Result CS_LSB CS_MSB B2: 0x30 = successful B2: 0x31 = failure DOWNLOAD_TEMPLATE_TO_RAM 0x02 0x CS_LSB CS_MSB 0x02 0x30 Result CS_LSB CS_MSB B2: 0x30 = successful B2: 0x31 = failure 22

23 DOWNLOAD_TEMPLATE_TO_FLASH 0x02 0x CS_LSB CS_MSB 0x02 0x30 Result CS_LSB CS_MSB B2: 0x30 = successful B2: 0x31 = failure COPY_TEMPLATE_RAM_TO_FLASH 0x02 0x CS_LSB CS_MSB 0x02 0x30 Result CS_LSB CS_MSB B2: 0x30 = successful B2: 0x31 = failure 23

24 Image transfer command READ_FIRMWARE Host can get current firmware information via response of command Read Firmware. Typically, the length of firmware information is 25 bytes. 0x02 0x CS_LSB CS_MSB 0x02 0x30 Len_LSB Len_MSB 0 0 CS_LSB CS_MSB Additional Data B0 B(Len-1) B(Len) B(Len+1) Firmware information CS_LSB CS_MSB Len: typically set as 25 bytes 24

25 UPDATE_FIRMWARE Host can update (usually, upgrade) current firmware to a newer version. The length of firmware information is typically 25 bytes. B0 B1 B2 B3 B4 B(Len+3) B(Len+4) B(Len+5) 0x02 0x02 Len_LSB Len_MSB Firmware Information CS_LSB CS_MSB Len: typically set as 25 bytes 0x02 0x CS_LSB CS_MSB 25

26 Communication command CHANGE_BAUDRATE Host can change the baud rate of UART connection and not need of restarting the device. 0x02 0x01 Baudrate CS_LSB CS_MSB B2: 0x10 for 9600 bits/sec B2: 0x20 for bits/sec B2: 0x30 for bits/sec B2: 0x40 for bits/sec B2: 0x50 for bits/sec B2: 0x60 for bits/sec B2: 0x70 for bits/sec B2: 0x80 for bits/sec 0x02 0x CS_LSB CS_MSB 26

27 TEST_HARDWARE Host will execute hardware testing, e.g., connection test, sensor status, firmware version check, and (TBD: security key check) 0x02 0x CS_LSB CS_MSB 0x02 0x CS_LSB CS_MSB Misc. command CANCEL Cancel the previous command, such as ENROLL_INTORAM, CAPTURE_AND_VERIFY, and CAPTURE_AND_IDENTIFY (On going) 0x02 0xE CS_LSB CS_MSB 0x02 0x CS_LSB CS_MSB 27

28 CHECK_IF_ENROLLED 0x02 0x21 ID CS_LSB CS_MSB B2: ID from 1 to 80 0x02 0x30 Result CS_LSB CS_MSB B2: 0x30 = ID is not enrolled B2: 0x31 = ID is enrolled ENTER_SLEEP_MODE 0x02 0x21 0x CS_LSB CS_MSB 0x02 0x CS_LSB CS_MSB 28

29 ADVANCE_SETTING 0x02 0x71 Voltage Control Baudrate Main Clock 0 CS_LSB CS_MSB B3: 0x10 for 2.7V B2: 0x20 for 3.0V B2: 0x30 for 3.3V B3: 0x10 for 9600 bits/sec B2: 0x20 for bits/sec B2: 0x30 for bits/sec B2: 0x40 for bits/sec B2: 0x50 for bits/sec B2: 0x60 for bits/sec B2: 0x70 for bits/sec B2: 0x80 for bits/sec B4: 0x10 for 6 MHz B2: 0x20 for 12 MHz B2: 0x30 for 24 MHz B2: 0x40 for 48 MHz B2: 0x50 for 80 MHz B2: 0x60 for 120 MHz 0x02 0x30 Result CS_LSB CS_MSB B2: 0x30 = successfully setting B2: 0x31 = failure 29

30 5-6. Procedure Enrollment Procedure 30

31 5-6-2 Verify Procedure 31

32 5-6-3 Identification Procedure 32

33 6. Mechanical properties: 33

34 7. Disclaimer The information appearing in this publication is believed to be accurate. Integrated circuits sold by JP Sensor are covered by the warranty and patent indemnification provisions stipulated in the terms of sale only. JP Sensor makes no warranty, express, statutory implied or by description regarding the information in this publication or regarding the freedom of the described chip(s) from patent infringement. FURTHERMORE, JP SENSOR MAKES NO WARRANTY OF MERCHANTABILITY OR FITNESS FOR ANY PURPOSE. JP Sensor reserves the right to halt production or alter the specifications and prices at any time without notice. Accordingly, the reader is cautioned to verify that the data sheets and other information in this publication are current before placing orders. Products described herein are intended for use in normal commercial applications. Applications involving unusual environmental or reliability requirements, e.g. military equipment or medical life support equipment, are specifically not recommended without additional processing by JP Sensor for such applications. Please note that application circuits illustrated in this document are for reference purposes only. 34

35 JP Sensor Sensor with total solution If any question, please feel free to let us know. JP Sensor Corporation Limited 6F., No.618, Ruiguang Rd., Neihu Dist., Taipei City 114, Taiwan TEL: FAX: ; Web Site : 35