TOSHIBA. Semiconductor company Ref. : H Asia Pacific Satelite Industries TO : APPROVAL SHEET FOR TC7SH04FU(T5L,JF,T.

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1 Date : 18 July'06 Semiconductor company Ref. : H TO : Asia Pacific Satelite Industries APPROVAL SHEET FOR TC7SH04FU(T5L,JF,T Contents : 1. Specification Data 2. General Specification 3. Marking Specification 4. Taping Specification (Mr. Winai Kasemwuttichai) Section Manager Quality Assurance Department (Mr. Hironobu Kurata) Department Manager Quality Assurance Department

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8 Semiconductor company General Product Specification 1) Generic Part Number 2) Materials : TC7SH04FU(T5L,JF,T Material Lead Frame Alloy 42 Type Molding Solder Epoxy resin Sn(Plating) 3) Marking Identification Type : Laser mark B H 5 C D E Factory dot : TST Monthly code : B,C,D,E Yearly code : ODD : (No dot) Even : (Dot) 4) Weight of finished product : g / piece 5) General Environment Storage : The storage area temperature should be kept within a temperature range of 5 o C to 35 o C and relative humidity should be maintained at between 45% and 75% 6) Country of Origin : Assemble in Thailand 7) Manufacturer Site and Location Process Manufacturer name Location Wafer Fabrication Toshiba Corporation Japan Semiconductor Company Himeji Operation-Semiconductor Assembly Toshiba Semiconductor(Thailand) Co.,Ltd. Thailand Testing Toshiba Semiconductor(Thailand) Co.,Ltd. Thailand Final Outgoing Inspection Toshiba Semiconductor(Thailand) Co.,Ltd. Thailand Toshiba Corporation Semiconductor Company Himeji Operation-Semiconductor 300, Ikaruga, Taishi-cho, Ibo-gun, Hyougo Pref. Toshiba Semiconductor (Thailand) Co., Ltd. 135 Moo 5, BIP, Tivanon Rd., T. Bangkadi, A. Muang, Pathumthani 12000, Thailand T49-07 TOSHIBA CORPORATION

9 Semiconductor company PRODUCT MARKING IDENTIFICATION Part No. : TC7SH04FU(T5L,JF,T Factory dot : TST B H 5 C D E Monthly code : B,C,D,E Yearly code : ODD : (No dot) Even : (Dot) Montly code No. Monthly Marking Dot 1 January 2 February 3 March 4 April 5 May 6 June 7 July 8 August 9 September 10 October 11 November 12 December T49-07 TOSHIBA CORPORATION

10 Semiconductor Company Taping Specification for TC7SH04FU(T5L,JF,T 1 Package USV 2 Product Naming Systems The type of package used for shipment is denoted by a symbol suffix after the product number. The classification method is shown below. (This method is not, however, used for products whose electrical characteristics differ from standard Toshiba specifications.) TC7SH04FU (T5L, JF, T Manufacture by TST Lead Pb-Free Taping type code Product code 3 Embossed-tape Packing Specification 3.1 Orientation of devices on carrier tape Device orientation on the carrier tape is as shown in figure 1. Figure 1 Device orientation on carrier tape 3.2 Packing quantity Packing quantity per reel is shown in table 1. Taping Spec. Package quantity(pcs.) T5L 3,000 T5R 3,000 Table 1 Embossed tape type 3.3 Missing devices(as shown in table 2) Parameter Specification Permissible percentage of adjacent missing devices 0% Permissible percentage of missing devices 0.2% Table 2 Specifications for missing devices T49-07 TOSHIBA CORPORATION

11 Semiconductor Company Taping Specification for TC7SH04FU(T5L,JF,T 3.4 Leader and trailer sections of tape The leader section should consist of a section of cover tape with a minimum length of 400 mm and an empty section of carrier tape at least 100 mm long. The trailer section should consist of a section of carrier tape with at least 10 empty device slots. Figure 2 Leader and trailer sections 3.5 Taping Dimensions (1) Cumulative pitch error tolerance is ± 0.2 mm / 10 devices. (2) Tape material is plastic with carbon (black) (3) Tape dimensions are as shown in Figure 3. (4) This type of tape has been designed for devices to fall off the tape if peeling off the cover tape from beneath. Figure 3 Tape appearance and dimensions T49-07 TOSHIBA CORPORATION

12 Semiconductor Company Taping Specification for TC7SH04FU(T5L,JF,T 3.6 Reel dimensions (1) Reel material is plastic. (2) Reel dimensions are as shown in Figure 4. Figure 4 Reel appearance and dimensions 3.7 Reel dimensions Peeling strength 300 mm/min 165 o ~ 180 o The cover tape has a peeling strength of between 0.1 N and 0.7 N when measured at an angle of between 165 o and 180 o with respect to the carrier tape along its longitudinal axis. The peel-off rate is 300 mm per minute. T49-07 TOSHIBA CORPORATION

13 Semiconductor Company Taping Specification for TC7SH04FU(T5L,JF,T 4 Reel Label The label markings may include the product number, tape type, packing quantity, lot number, Toshiba logo and country origin. The position of the label is as shown Figure 5. Figure 5 Reel front 5 Miscellaneous The electrical characteristics of taped devices are given in the relevant technical datasheet. 6 Packing Specification 1. Carton Dimension Figure Box A Box B Color of box : 5 reels packed : 10 reels packed : Brown Toshiba Guaranteed Tape Indicating label position 200 mm 75 mm (Box A) 135 mm (Box B) 190 mm 2. Material of box : Paper Figure 6 Carton Dimension T49-07 TOSHIBA CORPORATION

14 Semiconductor Company Taping Specification for TC7SH04FU(T5L,JF,T LABEL DEFINITION G A B C D P/N : TYPE ADD.C LOT NOTE 01/10 TC7SH04FU (T5L,JF,T 8216A1H-050 C/N : QTY 3,000 PCS KEY NO HA0783B TLC H5 TOSHIBA H I J E F [[G]]/RoHS COMPATIBLE YT UE004Z0D DIFFUSED IN JAPAN ASSEMBLED IN THAILAND 0602 K L A. Customer Part Name B. Toshiba Part Name C. Production Lot no A 1H Lot Serial Number Date Code 1H = 8th A B C D E F G H J K L Yearly / Monthly Code 6A = 2006 January Last Digit TST Factory Code D. Note reserved for multi-multi-monthly/weekly code and Quantity 6A = 1000 PCS. 6B = 2000 PCS. E. Notice for RoHS compatible F. Barcode information YT UE004Z0D G. Quantity H. 2-D Barcode I. Trace-ability Key number HA0783B J. Product Marking code K. Diffusion plant and Assembly process plant L. Barcode T49-07 TOSHIBA CORPORATION A B C D E F G H I J K Jan Feb Mar Apr May Jun Jan Feb Mar Apr May Jun Jan Feb Mar Apr May Jun L Jul Aug Sep Oct Nov Dec Jul Aug Sep Oct Nov Dec Jul Aug Sep Oct Nov Dec Internal Control code Quantity Product Code