TEK Series. Unique Expansion Possibilities. Power and Networking Expansion Module. Automation I/O Expansion Module

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1 TEK 40 BUS STOP VISA VISA

2 TEK Series TechNexion fanless industrial embedded computer series, TEK, has options for ARM or x86 technology, and a compact, fully aluminum ruggedized enclosure. To improve robustness the design is cable-less with all the I/O connectors on the main single board computer and expansion delivered through a high-speed board-to-board connector. In order to have multiple, versatile options for controlling end-equipment or connecting up to the cloud, it has 3G, LTE or Wi-Fi, supported by an internal mini-pcie socket with a SIM slot, or a M.2 expansion slot. Unique Expansion Possibilities The TEK series is also designed for easy and long-lasting, tightly integrated customization, enabling you to have a solution that better matches the requirements and therefore budget of your project. Expansion is made possible through a range of power and networking and I/O modules, while the board-to-board connectors ensure the expanded product can be used in environments with a high degree of friction. Power and Networking Expansion Module A range of off-the-shelf modules are available with in-built networking and single 12V DC, 24V DC, 8-36V DC wide power, or Power over Ethernet (PoE) with smart network switching capability options. Automation I/O Expansion Module Our I/O expansion modules have CAN Bus, UART, I2C, SPI, USB and GPIO interfaces. Presently, we have a galvanic isolated I/O model with RS-232/422/485 or as a non-galvanic version. Moreover, customers can take advantage of our in-house design and customization services. We have successfully delivered thousands of projects for our customers, ranging from small modifications to projects that needed expansion modules completely designed from the ground up with extremely complex requirements.

3 Longevity TechNexion TEK series embedded box PCs, that are designed for a variety of industrial and challenging uses, only incorporate components from suppliers who support our roadmaps. In addition, we support them with value added technical services such as life cycle management, revision control and end-of-life support. Automation I/O Expansion Modules Our I/O expansion modules have CAN Bus, UART, I2C, SPI, USB and GPIO interfaces. Presently, we have a galvanic isolated I/O model with RS-232/422/485 or as a non-galvanic version. Moreover, customers can take advantage of our in-house design and customization services. We have successfully delivered thousands of projects for our customers, ranging from small modifications to projects that needed expansion modules completely designed from the ground up with extremely complex requirements. TechNexion and Open Source Our industrial embedded computing devices come standard with source code and binary demo images for the following operating systems: Android binary demo images, instructions to make your own, as well as complete source code. Linux binary demo images, full source code, u-boot, and support packages. Yocto binary demo images, full source code, u-boot, and support packages. Ubuntu binary demo images. Windows support packages available on x86 models. TEK5-APL G H I J A. Power B. Mini-SIM cardslot C. LAN1 D. Mini-SIM cardslot E. microsd cardslot F. 2x USB 3.0 G. 2x USB 2.0 H. 4x LED I. Power LED J. Power button K. Antenna hole L. Grounding M. 2x USB 2.0 N. LAN2 O. Remote Power switch P. OPT-A Expansion hole Q. OPT-B Expansion hole R. 2.5 SATA SSD drive bay S. SATA LED T. Reset button U. Antenna hole 1. GPIO 2. 2x RS x RS-XXX 4. DVI-D 5. DP 6. Line out 7. Antenna hole 8. VGA 9. Antenna hole 10. Mic in 11. Antenna hole K L M N O P Q R S T U

4 OVERVIEW G G A: Reset Button B: S1 Button C: Micro-SIM cardslot D: microsd cardslot E: USB 2.0 OTG (Type-C) F: 4x LED G: Antenna Hole 1: LAN2 2: 2x USB 2.0 3: VGA 4: RS-232 5: GPIO 6: Power 7: LAN1 8: Expansion I/O G G A: Reset Button B: S1 Button C: Micro-SIM cardslot D: microsd cardslot E: USB 2.0 OTG (Type-C) F: 4x LED G: Antenna Hole 1: 2x USB 2.0 2: HDMI 3: VGA 4: Line out 5: Line in 6: Mic in 7: Power 8: LAN1 9. Expansion I/O E 7 8 F F A: Power Button B: Reset Button C: Micro-SIM cardslot D: microsd cardslot E: 4x LED F: Antenna Hole 1: 2x USB 3.0 2: HDMI 3: minidp 4: USB 3.0 OTG (Type-C) 5: LAN2 6: Line out 7: Line in 8: Mic in 9. Power 10. LAN1 11. Expansion I/O All specifications are subject to change without notice.

5 KEY FEATURES Model Name Core System Architecture Connectivity Network LAN PoE Expansion Interfaces M.2 Slot mini-pcie + SIM External Connectors External Display Audio Network USB TEK3-IMX6UL ARM Cortex-A7 NXP i.mx6 UltraLite 528MHz NXP PF3000 up to 1GB DDR3L emmc 2x Micrel KSZ8081RNBCA 10/100 LAN optional 1x (USB signals only) 1x (USB signals only) 1x VGA 15-pin D-SUB 2x RJ45 2x USB 2.0 Host/1x USB 2.0 OTG (Type-C) TEK3-IMX6 ARM Cortex-A9 NXP i.mx6 Solo 1GHz NXP i.mx6 DualLite 1GHz NXP i.mx6 Dual 1GHz NXP i.mx6 Quad 1GHz NXP MMPF0100 up to 4GB DDR3 emmc/m.2 SSD (optional) 1x Atheros AR8035 Gigabit LAN optional 1x 1x 1x HDMI/1x VGA 15-pin D-SUB 3x 3.5mm jack 1x RJ45 2x USB 2.0 Host/1x USB 2.0 OTG (Type-C) CAN Bus 2x Flex CAN version 2.0B compliant * 2x Flex CAN version 2.0B compliant * Serial GPIO Buttons Indicators SIM Cardslot SD Cardslot 2x RS x RS-XXX* 4x GPIO + 8x GPIO* 1x Boot Select/1x Reset 4x Programmable LED's 1x Micro-SIM 1x microsd 2x RS-XXX* 8x GPIO* 1x Boot Select/1x Reset 4x Programmable LED's 1x Micro-SIM 1x microsd Others Power Connector OS Support Certification 2-pin Micro-Fit pin Micro-Fit 3.0 Linux, Yocto, Ubuntu Linux, Yocto, Ubuntu, Android Compliant with CE / FCC / RoHS / REACH Compliant with CE / FCC / RoHS / REACH Mechanical Dimensions Weight 168(W) x 109(H) x 55(D) mm 705 grams 168(W) x 109(H) x 55(D) mm 705 grams *Available on I/O Expansion Board

6 Model Name Core System Architecture TEK3-BSW Atom x5-e8000 (4x 1.04GHz) Pentium N3710 (4x 1.60GHz) TEK5-APL Intel x86 Apollo Lake Atom x5-e3930 (4x 1.8GHz) Atom x5-e3940 (4x 1.8GHz) Atom x7-e3950 (4x 2.0GHz) Connectivity Network LAN PoE Expansion Interfaces M.2 Slot mini-pcie + SIM External Connectors External Display Audio Network USB CAN Bus Serial GPIO Buttons Indicators SIM Cardslot SD Cardslot Others Power Connector OS Support Certification Mechanical Dimensions up to 8GB SO-DIMM DDR3L emmc/m.2 SSD (optional) 2x Intel i211 Gigabit LAN optional 2x (WiFi/SATA or LTE) 1x HDMI/1x minidp 3x 3.5mm jack 2x RJ45 2x USB 3.0 Host/1x USB 3.0 OTG (Type-C) 2x RS-XXX* 8x GPIO* 1x Power/1x Reset 4x Programmable LED's 1x Micro-SIM 1x microsd 2-pin Micro-Fit 3.0 Ubuntu, Windows Compliant with CE / FCC / RoHS / REACH 168(W) x 109(H) x 55(D) mm up to 16GB SO-DIMM DDR3L emmc/sata/m.2 SSD (optional) 2x Intel i210-it Gigabit LAN 4x (1x WiFi/1x SATA/2x LTE) 1x (no SIM cardslot) 1x DP/1x DVI-D/1x VGA 15-pin D-SUB 2x 3.5mm jack 2x RJ45 2x USB 3.0 Host/4x USB 2.0 Host 2x RS x RS-XXX 8x GPIO 1x Power/1x Reset 4x Programmable LED's 2x Mini-SIM 1x microsd 3-pin 5.08mm Terminal Block Ubuntu, Windows Compliant with CE / FCC / RoHS / REACH 250(W) x 180(H) x 65(D) mm Weight 700 grams 2600 grams

7 TEK3 EXPANSION MODULES TXB-P1-12V-LAN1 12V DC power input 1x RJ45 LAN connector TXB-I2-GS2-GC2-GG8 1x galvanic isolated serial port RS-232/422/485 1x galvanic isolated serial port RS-232 2x galvanic isolated CAN bus controller 4x galvanic isolated GPIO input 4x galvanic isolated GPIO output TXB-P1-24V-LAN1 24V DC power input 1x RJ45 LAN connector TXB-I2-S2-C2-G8 2x Serial ports RS-232 2x CAN bus controller 8x GPIO TXB-P1-1030V-LAN1 8-36V DC wide power input 1x RJ45 LAN connector TXB-P1-12V-POE1 12V DC power input 1x RJ45 connector Power over Ethernet (802.3at)

8 INNOVATORS OF TECHNOLOGY TechNexion Ltd. 16F-5, No. 736, Zhongzheng Rd., Zhonghe Dist., New Taipei City,23511,Taiwan. Tel: Fax:

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