B A. AW3000 Front View

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1 Product Overview Looking to simplify your complex IT environment? The Acer AW3000 Gemini Server integrates storage, computing, and networking to one system to simplify complex IT environments. Acer AW3000 offers a business-in-a-box with seamless installation, migration, and growth capabilities. This is a flexible and powerful system for the small to midsize business at an exceptional value. AW3000 Front View B A C A. AW370 F1 Compute modules (six) B. Storage enclosure: 14 hot-swap 2.5 hard disk drives C. I/O cooling module D. System Fault LED (amber) AW3000 Rear View D C A B D E A. Redundant Power supply (four, 3+1) B. Main cooling modules C. Ethernet switch modules D. Storage controllers E. Management module 1

2 AW370 F1 Server node Front view I A B C D E F G H A. USB 2.0 Ports B. VGA Port C. I/O Indicator D. Ethernet Indicator E. Storage Activity Indicator F. ID Indicator G. Power Switch H. Compute Module Fault Indicator I. Power Indicator AW370 F1 Server node Internal view E A. Up to Two Intel Xeon 5600 series processors D A B B. Up to Twelve ECC DDR MHz registered or un-buffered memory slots C. Intel 5520 Chipset D. PCI Express 2.0 x8 mezzanine card slot B A E. Mid-plane connectors C What's New Supports up to six server compute modules Shared storage hard drive bay supporting up to fourteen (14) 2.5 inch SATA or SAS hard drives Virtual, Integrated Shared Storage Full system management via Web browser 2

3 AW3000 Specifications Chassis Configuration Rack-mount Chassis with a height of 6U (10.5 inches) and a depth of 28 inches (706 mm) Pedestal (thru Optional Pedestal Kit) Expandability Front Shared storage hard drive bay supporting up to fourteen (14) 2.5-inch SATA or SAS hard drives Up to six (6) Acer AW370 F1 compute modules Rear Optional secondary Ethernet switch module up to 2 modules Optional secondary storage controller up to 2 modules. Four Power Supply Bays Two Hot swap Fan Modules Cooling Sub-System The cooling subsystem consists of three cooling zones. o I/O module cooling o Hard drives and power supplies o Compute Modules Each fan module contains a status LED to indicate a fan failure. Each cooling zone contains dedicated hot-swap fan modules. The front- and rear-accessible fan modules connect directly to the system mid-plane board. Mid Plane Connects subsystems to the Management Module Designed for multiple generations of Server Compute Modules Provides I/O for the system Storage Control Module RAID: 0, 1, 1E, 5, 6, 10 I/O: o External extended storage mini SAS port o Six internal 3Gb/s SAS channels Active-Active redundancy Battery Backup Ethernet Switch module Ports o Ten external 10/100/1000 GbE full-duplex ports o Twelve internal 1-GbE full-duplex ports Management o Port, VLAN, and Advanced Switch Configuration via the Management Module Layer 2+ features o ACL, QOS, Link Aggregation, 10K Jumbo Frame support, VLAN support, STP, and RSTP o Non-blocking I/O, wire-speed performance Storage Module Ethernet Switch Module 3

4 Availability Four 1000-W power supplies in a redundant (3+1) configuration with separate power cords. Up to six compute modules. Redundant networking and storage. Redundant cooling sub system. Serviceability Tool-less design features. Front access to optional hot-swap hard disk drives. Rear access to I/O slots, cooling, and hot-swap power supplies. Status and fault indicator LEDs. Front viewable compute module ID LEDs. Color-coded parts to identify hot-swap and non-hot-swap serviceable components. Management Module I/O o External 10/100 Ethernet port o External serial port Management Module System Manageability Remote management. Extensive system sensors and monitoring. Remote diagnostics support through serial and LAN ports. Web management console. KVM console redirection. The front of each individual compute module provides video, USB, a power button, and status LEDs that allow local monitoring and managing of the individual compute module. Full system management through Web browser. Configuration wizards assist in setup of storage and network. Regulatory Compliant Standards 1 Chassis Emission 1 FCC Class A CE Safety 1 UL CB 1 All Regulatory certifications are under the Manufacturer listings. 4

5 AW370 F1 Node Specifications Processors and Chipset Up to two Intel Xeon 5600 series processors with up to 6 cores each Chipset: Intel 5520 Chipset with Intel ICH10R Memory 12 DIMM Slots Memory capacity: o Registered DIMM: 2, 4, 8 GB o Un-buffered DIMM: 2, 4 GB Up to 96 GB Registered DDRIII ECC Memory Up to 48 GB Un-buffered DDRIII ECC Memory 6 channel native (800/1066/1333 MHz) Memory RAS Features Channel mirroring Demand scrubbing Patrol scrubbing Channel independent mode Network Controllers On-board dual Intel 82575EB Gigabit Ethernet Controller Additional Dual Gigabit Controller using Optional mezzanine card Graphics controller Server Engines* LLC Pilot II* controller with 64MB DDR2 memory 8MB allocated to graphics Storage Type: Shared Storage Hard disk form factor: 2.5 HDD Type: SAS/SATA/SSD HDD Maximum capacity: o 2.5 SAS HDD capacity: 73 GB, 146 GB, 300 GB, 450 GB, 600 GB o 2.5 SATA HDD capacity: 500 GB o 2.5 SSD capacity: 32 GB and 64 GB Storage Controllers Integrated LSI * 1064e controller (access to shared storage) Expansion slots One PCIe 2.0 x8 mezzanine card slot Management Acer Smart Manager for AW3000 Operating Systems Supported Windows Server 2008, Windows Server 2008 R2, Windows Server 2003 Red Hat Enterprise Linux 5 SUSE Linux Enterprise Server 11 VMware ESXi 4, VMware ESX 4 5

6 Technical Specifications Chassis Dimension Height: 10.3 inches (6U) Width: 17.5 inches Depth: 28.4 inches Weight with full configuration: 187 lbs appx Chassis Power Requirements Up to four 1,000-watt DC output power supply modules with V AC input Full system configuration power requirements: 3,000 watts Chassis Acoustical Noise Emissions Sound power 70 db maximum Chassis Environment Temperature operating: 10 C to 35 C 50 F to 95 F Temperature non-operating: -40 C to 70 C -40 F to 158 F Altitude: -30 to 1,500 m -100 to 5,000 ft Dimensions Chassis mm(h) x mm(w) x mm(l) Compute module CMM I/O Storage Module HDD Bay Power supply module Main cooling module 41.7 mm(h) x mm(w) x mm(l) 25.0 mm(h) x mm(w) x mm(l) 38.0 mm(h) x mm(w) x mm(l) 32.0 mm(h) x mm(w) x mm(l) mm(h) x mm(w) x mm(l) 53.3 mm(h) x 115 mm(w) x mm(l) mm(h) x mm(w) x mm(l) I/O cooling module 49.4 mm(h) x mm(w) x mm(l) Environment Operating Temperature 10 C to 35 C/ 50 F to 95 F Temperature non-operating -40 C to 70 C / -40 F to 158 F Altitude -30 to 1,500 m / -100 to 5,000 ft Humidity non-operating 95%, non-condensing at temperatures of 25 C (77 F) to 30 C (86 F) Vibration non-operating Shock operating 2.2 g, 10 minutes per axis on each of the three axes Half-sine 2 G, 11 ms pulse, 100 pulses in each 6

7 Shock non-operating Electrostatic discharge direction, on each of the three axes Trapezoidal, 25 G, two drops on each of six faces DV : 175 inches/sec on bottom face drop, 90 inches/sec on other 5 faces Tested to ESD levels up to 15 kilovolts (kv) air discharge and up to 8 kv contact discharge without physical damage Acoustic Sound power: < 7.0 BA at ambient temperature < 23 C 7

8 Standard Features Processors Intel Xeon Six-Core processor X5675 (12 MB L3 cache, 3.06 GHz, 6.4 GT/s, DDR MHz, 95 W) X5650 (12 MB L3 cache, 2.66 GHz, 6.4 GT/s, DDR MHz, 95 W) Intel Xeon Quad-Core processor E5620 (12 MB L3 cache, 2.40 GHz, 5.86 GT/s, DDR MHz, 80 W) L5630 (12 MB L3 cache, 2.13 GHz, 5.86 GT/s, DDR MHz, 40 W) E5606 (8 MB L3 cache, 2.13 GHz, 4.8 GT/s, DDR MHz, 80 W) Chipset Intel 5520 Chipset Memory 1 Type 2 DDR MHz Registered memory DDR MHz Un-buffered memory Memory protection Network controller DIMM sockets 12 Capacity Registered DIMM: 2 / 4 / 8 GB Un-buffered DIMM: 2 / 4 GB Maximum capacity Registered DIMM: 96 GB Un-buffered DIMM: 48 GB ECC, Channel mirroring, Demand scrubbing, Patrol scrubbing, Channel independent mode On-board dual Intel 82575EB Gigabit Ethernet Controller Additional Dual Gigabit Controller using Optional mezzanine card Expansion slot One PCIe Generation 2 x 8 mezzanine card slot Storage controllers Integrated LSI * 1064e controller (access to shared storage) Integrated SAS Transfer rate 3 GB/s per channel synchronous (maximum theoretical) Drive support SAS, SATA Protocol SAS Feature NCQ (Native Command Queuing) RAID levels supported 0, 1, 1E, 5, 6, 10 RAID OS support Windows Server 2008 Windows Server 2008 R2 Red Hat Enterprise Linux 5.4 SUSE Linux Enterprise Server 11 1 Mixed use of registered memory and unbuffered ECC memory not supported. 2 Memory speed may run at 1333 MHz, 1066MHz, or 800 MHz depending on total memory modules installed and processor model. 8

9 Integrated Gigabit LAN Controller On-board dual Intel 82575EB Gigabit Ethernet Controller Additional Dual Gigabit Controller using Optional mezzanine card Storage HDD Bays 0-13 Storage Type Shared Storage Up to SAS/SATA Hot-plug HDD s 2.5 Maximum capacity Up to 7 TB SATA Up to 8.4 TB SAS Up to 896 GB SSD Graphics Industry standard compliance Security Operating systems and virtualization software support Server Engines* LLC Pilot II* controller with 64MB DDR2 memory IPMI 2.0 Compliant SMBIOS 2.5 Compliant ACPI v3.0b Compliant PCI 2.3 Compliant PXE support WOL support Microsoft Windows Hardware Logo Program Requirements Administrator password Power-on password USB port control Windows Server 2008 Windows Server 2008 R2 Red Hat Enterprise Linux 5.4 SUSE Linux Enterprise Server 11 VMware ESXi 4 VMware ESX 4 9

10 Server Management Utilities and Applications Comprehensive management solutions deliver powerful and intuitive management features to simplify server set ups, configuration, management, monitoring, and reporting for the entire lifecycle of servers. Centralized administration and automatic management with remote access control free the IT resources and meet the complex business environment. Proactive monitoring and notification lead higher customers satisfaction and higher levels of operational efficiency. Acer Smart CMM for AW3000 Baseboard Management Controllers Acer Smart Chassis Management Module: A default bundle management tool offering complete Manageability of the system including remote management for system health and performance for the entire Acer server nodes within the managed network. Each compute module contains an Integrated Baseboard Management Controller (BMC) that is responsible for all management local to the module, including power control, reset, sensor reading, remote KVM, remote media and remote serial console. The Integrated BMC also gathers events to be stored in the server event log. However, the compute module s Integrated BMC is managed by the chassis management module and must communicate with the chassis management before providing any of these management features. This architecture allows the chassis management module to control the security of all components in the system. Intelligent manageability The Acer Smart Chassis Management Module (CMM) monitors platform management events and logs their occurrence. This includes events such as over-temperature and over-voltage conditions, fan failures, and so on. The CMM also provides the interface to this monitored information so that system management software can poll and retrieve the present status of the platform. The following is a list of the major functions of the CMM: System power control - Storage controllers, Ethernet switch modules & Compute modules System initialization and System fan management System Event Log (SEL) interface Field Replaceable Unit inventory Event message generation and reception Serial over LAN (SOL) Sensor monitoring - Temperature, Voltage, Fan speed, Processor status, & Power supplies IPMB communication interface Checks and forces automatic update of firmware of newly installed system boards to versions stored in the SD (secure digital) card on the midplane. Acer Smart CMM GUI provides remote KVM to the compute modules External serial port connector for local/remote management access External Ethernet connector for local/remote management Environment-friendly products and approach Acer offers end-of-life product return, trade-in, and recycling programs in many geographic areas. Products returned to will be recycled, recovered or disposed of in a responsible manner. 10

11 Memory Support Specification Registered type 3 DDR MHz registered Un-buffered type Capacity: Voltage: 2, 4, 8GB 1.5 V Maximum: 96 GB per node DDR MHz Un-buffered ECC Capacity: Voltage: 2, 4 GB 1.5 V Maximum: 48 GB per node ECC, Channel mirroring, Demand scrubbing, Patrol scrubbing, Channel Memory Protection independent mode * Mixed use of registered memory and unbuffered ECC memory not supported. Memory Population The systems have twelve DIMM slots. Each CPU controls six slots. The DIMM slots support DDR registered/unbuffered ECC memory modules. Each CPU has three memory channels (channel 1, 2 and 3) Each channel has 2 slots The socket farthest from the CPU is socket A (DIMM1A, DIMM2A, DIMM3A in blue color), while the nearest is socket B (DIMM1B, DIMM2B, DIMM3B in black). For all memory modes, socket A in each channel needs to be populated first. If socket A is empty, socket B cannot be used. It is recommended that the higher rank and largest capacity DIMM be installed in slot A. NOTE: In a single-processor server, memory modules are installed into the DIMMxx slots. The P2DIMMxx slots are enabled when a second CPU is installed on the main board. For the system to function properly, DIMM modules must be installed following the slot sequence listed below. DIMM modules of the same type, size and manufacturer must be installed in the same DIMM colored slots. CPU 1 populate DIMM slot DIMM1A first, followed by slots DIMM2A, DIMM3A, DIMM1B, DIMM2B, DIMM3B. CPU 2 populate DIMM slot P2DIMM1A first, followed by slots P2DIMM2A, P2DIMM3A, P2DIMM1B, P2DIMM2B, P2DIMM3B. DIMM slot notation illustrated in table below: CPU1 DIMM1B DIMM1A DIMM2B DIMM2A DIMM3B DIMM3A (Rear CPU) Black Blue Black Blue Black Blue CPU2 (Front CPU) P2DIMM1B P2DIMM1A P2DIMM2B P2DIMM2A P2DIMM3B P2DIMM3A Black Blue Black Blue Black Blue 3 *Memory speed may run at 1333 MHz, 1066MHz, or 800 MHz depending on total memory modules installed and processor model. 11

12 Independent mode (please refer to the User Guide for more information) In this mode all memory is accessible and ECC protected Single-processor configuration Total Memory 1B 1A 2B 2A 2GB 2GB 4GB 2GB 2GB 3B 3A 6GB 2GB 2GB 2GB 8GB 2GB 2GB 2GB 2GB 12GB 2GB 2GB 2GB 2GB 2GB 2GB 4GB 4GB 8GB 4GB 4GB 12GB 4GB 4GB 4GB 16GB 4GB 4GB 4GB 4GB 24GB 4GB 4GB 4GB 4GB 4GB 4GB 8GB 8GB 16GB 8GB 8GB 24GB 8GB 8GB 8GB 32GB 8GB 8GB 8GB 8GB 48GB 8GB 8GB 8GB 8GB 8GB 8GB Dual-processor configuration Total Memory 1B 1A 2B CPU1 2A 4GB 2GB 2GB 3B 8GB 2GB 2GB 2GB 2GB 3A 12GB 2GB 2GB 2GB 2GB 2GB 2GB 16GB 2GB 2GB 2GB 2GB 2GB 2GB 2GB 2GB 18GB 2GB 2GB 2GB 2GB 2GB 2GB 2GB 2GB 2GB 24GB 2GB 2GB 2GB 2GB 2GB 2GB 2GB 2GB 2GB 2GB 2GB 2GB 8GB 4GB 4GB 16GB 4GB 4GB 4GB 4GB 24GB 4GB 4GB 4GB 4GB 4GB 4GB 32GB 4GB 4GB 4GB 4GB 4GB 4GB 4GB 4GB 36GB 4GB 4GB 4GB 4GB 4GB 4GB 4GB 4GB 4GB 48GB 4GB 4GB 4GB 4GB 4GB 4GB 4GB 4GB 4GB 4GB 4GB 4GB 16GB 8GB 8GB 32GB 8GB 8GB 8GB 8GB 48GB 8GB 8GB 8GB 8GB 8GB 8GB 72GB 8GB 8GB 8GB 8GB 8GB 8GB 8GB 8GB 8GB 96GB 8GB 8GB 8GB 8GB 8GB 8GB 8GB 8GB 8GB 8GB 8GB 8GB Mirroring mode: In mirroring mode, the memory contains a primary image and a copy of the primary image therefore the effective size of memory is reduced by one half. Channel 3 has no function in these modes. Follow the population rules described in independent mode. Mirroring mode needs the channel 1 & channel 2 DIMMs to be identical. DIMM slot populations within a channel do not have to be identical but the same DIMM slot location across channel 1 and channel 2 must be the same. DIMM1A and DIMM2A should be the same type, size and manufacturer. DIMM1B and DIMM2B memory should be the same type, size and manufacturer. DIMM1C and DIMM2C memory should be the same type, size and manufacturer. Same rules apply to CPU2. Please refer to the User Guide for complete population rules for both single& dual processor configs. P2 1B P2 1A P2 2B CPU2 P2 2A P2 3B P2 3A 12

13 Memory Identification Generally, there is memory information printed on the label of the DIMM, but different vendors may have different formats. For example: 4GB 2Rx4 PC R xx xx xxx 1. Density 2GB, 4GB, 8GB, 16GB Intel Xeon 5600 series processors support DIMMs organized by 1Gb, 2Gb or 4Gb DRAM chips 2. Rank 1R = Single Rank 2R = Dual Rank 4R = Quad Rank 3. Bit Organization This platform supports x4 and x8 Note: It is not recommended to mix DIMMs with different bit organizations in one system 4. Speed PC => DDR3-800 PC => DDR PC => DDR

14 Hardware Key Options CPU Intel Xeon 5600 series HDD SAS 2.5 : 73 GB, 146 GB, 300 GB, 450 GB, 600 GB SATA 2.5 : 150 GB, 300 GB, 500 GB SATA SSD 2.5 : 32GB, 64GB Memory DDR MHz Unbuffered ECC 2/4 GB DDR MHz Registered memory 2/ 4/ 8GB Rack kit Tool-less sliding rails Networking Mezzanine card Enclosure components Chassis Management Module Optional Storage Controller Module Optional Ethernet Switch Module Redundant 1000 W Power Supply Module with cooling fan 14

15 Power Supply Module Specifications The power supply module in Acer AW3000 System is a 1000-W DC output supply with V AC input. Each power supply includes two fans that provide cooling for optional hot-swap disk drives. All four power supply bays must be populated with either a power supply module or a power supply blank. The power supply blank has two fans that ensure proper system cooling. The power subsystem is configured as follows: With four power supply modules installed, a fully configured system has (3+1) power redundancy. With three power supply modules installed, a fully configured system would not have redundant power. Three power supply modules are capable of handling the maximum power requirements for fully configured platforms, which includes six compute modules, two storage controllers, two Ethernet switch modules, one chassis management module, and fourteen hot-swap 2.5-inch hard disk drives. When four power supply modules are installed, the user can replace a failed power supply module without affecting system functionality. Power supplies have two LEDs to identify failure o Power good o AC OK. Single compute node requires minimum of 2 power supplies for redundancy, 2~3 Compute nodes requires minimum 3 power supplies for redundancy, Fully loaded system requires 4 power supplies for redundancy The power subsystem receives AC power through four power cords. 15

16 Power and Heat Dissipation Specifications of Chassis Power Supply Input 1240 W Power Supply Output 1050 W System Power Input 3720 W System Power Output 3150 W System Power VAC, VAC System Heat Dissipation 3720 W (12,701 BTU/hr) maximum System Heat Dissipation 428 W (1461 BTU/hr) minimum Power Budget of Hardware Components Compute module Mezzanine card Chassis management module Chassis management module 2 I/O Switch 406 W 5 W 5 W 24 W 40 W Note: The total power requirement for the platforms exceeds the 240 VA energy hazard limits that define an operator accessible area. As a result, only qualified technical individuals should access the processor and non-hot-plug I/O areas while the system is energized. Power cords should be removed from the system before accessing non-hot-plug areas. 16

17 Acer AW3000 Gigabit Ethernet Switch Module (ESM) C B D A A. Ethernet switch module 1-Gb Ethernet connectors (10) with LEDs B. Ethernet switch module power LED Green C. Ethernet switch module fault LED Amber D Serial cable connectors Features and benefits High Performance External Connectivity Internal Connectivity Intelligent Switching Integrated Management Redundancy Non-blocking, wire-speed performance Ten external 10/100/1000 GbE full-duplex ports to provide enough performance to handle demanding applications Twelve internal 1 GbE full-duplex ports (2 per compute module) Layer 2+ features Preconfigured switch ready to work out of the box Optional second Gigabit Ethernet Switch for redundancy and performance 17

18 Acer AW 3000 Chassis Management Module (CMM) Specifications The Acer AW3000 CMM provides a virtual presence GUI for managing the entire system. It allows in-band and out-of-band management of the compute modules, integrated shared storage, and Ethernet switch The server platform s chassis management module provides chassis-wide system management. It interfaces with all system components either through the I 2 C bus or through the Ethernet Switch Module. (The CMM connects through Ethernet directly to the storage controller module(s) and the Ethernet Switch Module, and indirectly to the compute modules. There are no Ethernet connections to the power supply modules, cooling modules, or LED boards.) The main components of the CMM2 are the Intel EP80579 Integrated Processor, which runs the Linux OS in addition to the built-in server control GUI, and the FPGA, which provides I²C bus expansion among other functionality. C B D A F E A. CMM Reset Switch B. CMM power LED Green C. CMM Fault LED Amber D. I/O Indicator E. CMM NIC connectors w/ LEDs F. Serial cable connectors 18

19 Features and benefits Complete System control Remote management Integrated KVM Hardware monitoring Unified updates System control A highly integrated management console that allows the user to configure all aspects of the system from a single interface. Full remote management of the system including virtual presence allows you to see your configuration and system from a remote location. Remote Media allows easy remote installs from anywhere and intuitive navigation allows you to configure your storage, network and servers within minutes. The Management Module includes an integrated KVM to allow you to control all compute modules concurrently. Real time hardware information and alert notifications on all components within the system. Take the pain out of firmware updates with the unified firmware update feature, allowing you to update all components and servers in the system through one interface and one update package. A highly integrated management console that allows the user to configure all aspects of the system from a single interface. 19

20 Acer AW3000 Storage Controller Module The Acer AW3000 enables up to six diskless compute modules to interface through SAS connections to one or two (for redundancy) internal storage controller modules. The storage controller modules include RAID and storage virtualization functionality with connections to back-end shared internal SAS disk drives. Connectivity between the storage controller modules and the disk drive backplane is achieved through an interposer card to a 14-drive backplane. In combination, these components allow up to inch SAS drives in to be shared between all compute modules. The Acer AW3000 CMM is used to configure drive arrays and to match LUNs to specific compute modules. D C B E A A. SCM Ethernet SAS connector B. SCM dirty cache LED Green C. SCM fault LED Amber D. SCM Power LED - Green E. Serial cable connectors Storage Controller Module Interface The Interposer SAS signals from the storage controller module (SCM) originate from the LSI * 1068 and PM8399 devices. A hardware reset line for each expander originates from each SCM. One SAS expander on the Interposer is managed by one SCM; the second expander is managed by the second SCM (if installed). 20

21 An I²C bus connects the SCM(s) to the Interposer VPD SEEPROM and each expander. The SCM(s) can retrieve hardware monitor and drive backplane IDROM information from the expanders, which are connected through I²C to these devices. Disk drive status is communicated through SES pages to the expanders from the RAID stack in the SCM, and this status is exported to GPIO LED signals, one for each disk drive. One overall RAID status LED is also sent through SES and exported to a single LED. Expander firmware can be downloaded from the SCM. Interposer Card Functionality Interposer card connects HDD Back-Plane to System mid-plane.sas expander-1 provides connectivity to all disk drive A ports; SAS expander-2 provides connectivity to all disk drive B ports. A port SAS traffic originates only from SCM-1, and B port SAS traffic originates only from SCM-2. The SAS connection from SCM-1 to expander-2 (and SCM-2 to expander-1) is intended for high-speed controller to controller traffic only (write cache mirroring). Features and benefits RAID levels RAID 0, 1, 1E, 5, 6, 10, 50, 60 Expansion Redundancy Data protection Hot spares Connectivity Ease of management Expansion to connect an external SAS RAID array through a mini x4 external SAS port to allow sharing of external storage with all server compute modules Optional second storage controller for redundancy and performance Battery backup for the cache included Global or dedicated hot spares Six internal 6Gb/s SAS full-duplex ports Intuitive SAN storage management included in the System Management Module 21

22 Service and Support Acer Servers offers a comprehensive service suite to take care of your hardware investment. Users can select the 3-year standard warranty or choose extended warranties and services 4. The standard warranty for the AW3000- AW370 F1 includes three years Parts coverage with all three years including Labor and On-Site coverage. Warranty repairs may be accomplished through the use of Customer Replacement Unit (CRU) parts. CRU parts include: Hot Plug Hard Drives and Hot Plug Power Supplies. These parts are designed for easy replacement without tools. Travel and labor charges may apply if customers decline to replace a CRU part. In a continuing effort to improve the quality of our products, information in this document is subject to change without notice. Images shown are only representations of some of the configurations available for this model. Availability may vary depending on region All rights reserved. Microsoft and Windows are registered trademarks of Microsoft Corporation. Intel, the Intel logo, Pentium, Xeon and Xeon Inside are trademarks of Intel Corporation. 4 Extension warranty services vary by country. Please contact Acer authorized resellers for more information. 22