SN5476, SN54LS76A SN7476, SN74LS76A DUAL J-K FLIP-FLOPS WITH PRESET AND CLEAR
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1 SN5476, SN54LS76A SN7476, SN74LS76A DUAL J-K FLIP-FLOPS WITH PRESET AND CLEAR SDLS121 DECEMBER 1983 REVISED MARCH 1988 PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. Copyright 1988, Texas Instruments Incorporated POST OFFICE BOX DALLAS, TEXAS
2 SN5476, SN54LS76A SN7476, SN74LS76A DUAL J-K FLIP-FLOPS WITH PRESET AND CLEAR SDLS121 DECEMBER 1983 REVISED MARCH POST OFFICE BOX DALLAS, TEXAS 75265
3 SN5476, SN54LS76A SN7476, SN74LS76A DUAL J-K FLIP-FLOPS WITH PRESET AND CLEAR SDLS121 DECEMBER 1983 REVISED MARCH 1988 POST OFFICE BOX DALLAS, TEXAS
4 SN5476, SN54LS76A SN7476, SN74LS76A DUAL J-K FLIP-FLOPS WITH PRESET AND CLEAR SDLS121 DECEMBER 1983 REVISED MARCH POST OFFICE BOX DALLAS, TEXAS 75265
5 SN5476, SN54LS76A SN7476, SN74LS76A DUAL J-K FLIP-FLOPS WITH PRESET AND CLEAR SDLS121 DECEMBER 1983 REVISED MARCH 1988 POST OFFICE BOX DALLAS, TEXAS
6 SN5476, SN54LS76A SN7476, SN74LS76A DUAL J-K FLIP-FLOPS WITH PRESET AND CLEAR SDLS121 DECEMBER 1983 REVISED MARCH POST OFFICE BOX DALLAS, TEXAS 75265
7 PACKAGE OPTION ADDENDUM 26-Sep-2005 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Drawing Pins Package Qty Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3) QEA ACTIVE CDIP J 16 1 TBD Call TI Level-NC-NC-NC QFA ACTIVE CFP W 16 1 TBD Call TI Level-NC-NC-NC QFA ACTIVE CFP W 16 1 TBD Call TI Level-NC-NC-NC EA ACTIVE CDIP J 16 1 TBD Call TI Level-NC-NC-NC EA ACTIVE CDIP J 16 1 TBD Call TI Level-NC-NC-NC JM38510/00204BEA ACTIVE CDIP J 16 1 TBD Call TI Level-NC-NC-NC JM38510/00204BEA ACTIVE CDIP J 16 1 TBD Call TI Level-NC-NC-NC SN5476J ACTIVE CDIP J 16 1 TBD Call TI Level-NC-NC-NC SN5476J ACTIVE CDIP J 16 1 TBD Call TI Level-NC-NC-NC SN54LS76AJ ACTIVE CDIP J 16 1 TBD Call TI Level-NC-NC-NC SN54LS76AJ ACTIVE CDIP J 16 1 TBD Call TI Level-NC-NC-NC SN7476N OBSOLETE PDIP N 16 TBD Call TI Call TI SN7476N OBSOLETE PDIP N 16 TBD Call TI Call TI SN7476N3 OBSOLETE PDIP N 16 TBD Call TI Call TI SN7476N3 OBSOLETE PDIP N 16 TBD Call TI Call TI SN74LS76AD OBSOLETE SOIC D 16 TBD Call TI Call TI SN74LS76AD OBSOLETE SOIC D 16 TBD Call TI Call TI SN74LS76ADR OBSOLETE SOIC D 16 TBD Call TI Call TI SN74LS76ADR OBSOLETE SOIC D 16 TBD Call TI Call TI SN74LS76AN OBSOLETE PDIP N 16 TBD Call TI Call TI SN74LS76AN OBSOLETE PDIP N 16 TBD Call TI Call TI SN74LS76AN3 OBSOLETE PDIP N 16 TBD Call TI Call TI SN74LS76AN3 OBSOLETE PDIP N 16 TBD Call TI Call TI SNJ5476J ACTIVE CDIP J 16 1 TBD Call TI Level-NC-NC-NC SNJ5476J ACTIVE CDIP J 16 1 TBD Call TI Level-NC-NC-NC SNJ5476W ACTIVE CFP W 16 1 TBD Call TI Level-NC-NC-NC SNJ5476W ACTIVE CFP W 16 1 TBD Call TI Level-NC-NC-NC SNJ54LS76AJ ACTIVE CDIP J 16 1 TBD Call TI Level-NC-NC-NC SNJ54LS76AJ ACTIVE CDIP J 16 1 TBD Call TI Level-NC-NC-NC SNJ54LS76AW ACTIVE CFP W 16 1 TBD Call TI Level-NC-NC-NC SNJ54LS76AW ACTIVE CFP W 16 1 TBD Call TI Level-NC-NC-NC (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS) or Green (RoHS & no Sb/Br) - please check for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Addendum-Page 1
8 PACKAGE OPTION ADDENDUM 26-Sep-2005 Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. Addendum-Page 2
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13 IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements, improvements, and other changes to its products and services at any time and to discontinue any product or service without notice. Customers should obtain the latest relevant information before placing orders and should verify that such information is current and complete. All products are sold subject to TI s terms and conditions of sale supplied at the time of order acknowledgment. TI warrants performance of its hardware products to the specifications applicable at the time of sale in accordance with TI s standard warranty. Testing and other quality control techniques are used to the extent TI deems necessary to support this warranty. Except where mandated by government requirements, testing of all parameters of each product is not necessarily performed. TI assumes no liability for applications assistance or customer product design. Customers are responsible for their products and applications using TI components. To minimize the risks associated with customer products and applications, customers should provide adequate design and operating safeguards. TI does not warrant or represent that any license, either express or implied, is granted under any TI patent right, copyright, mask work right, or other TI intellectual property right relating to any combination, machine, or process in which TI products or services are used. Information published by TI regarding third-party products or services does not constitute a license from TI to use such products or services or a warranty or endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property of the third party, or a license from TI under the patents or other intellectual property of TI. Reproduction of information in TI data books or data sheets is permissible only if reproduction is without alteration and is accompanied by all associated warranties, conditions, limitations, and notices. Reproduction of this information with alteration is an unfair and deceptive business practice. TI is not responsible or liable for such altered documentation. Resale of TI products or services with statements different from or beyond the parameters stated by TI for that product or service voids all express and any implied warranties for the associated TI product or service and is an unfair and deceptive business practice. TI is not responsible or liable for any such statements. Following are URLs where you can obtain information on other Texas Instruments products and application solutions: Products Applications Amplifiers amplifier.ti.com Audio Data Converters dataconverter.ti.com Automotive DSP dsp.ti.com Broadband Interface interface.ti.com Digital Control Logic logic.ti.com Military Power Mgmt power.ti.com Optical Networking Microcontrollers microcontroller.ti.com Security Telephony Video & Imaging Wireless Mailing Address: Texas Instruments Post Office Box Dallas, Texas Copyright 2005, Texas Instruments Incorporated
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