NAND Flash Memory / NAND

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1 SEMICONDUCTOR GENERAL CATALOG 東芝半導体製品総覧表 2017 年 1 月版 Memory メモリ NAND Flash Memory /NAND 型フラッシュメモリ SCA0004I

2 NAND Flash Memory / NAND SLC Small Block / SLC 512 Mbits (max) (μs) ZTC58DVM92A5TA K to to 70 TSOP I 48-P ZTC58DVM92A5TAI K to to 85 TSOP I 48-P ZTC58DVM92A5BAJ K to to 85 P-TFBGA AZ SLC Large Block / SLC 1 Gbits 2 Gbits 4 Gbits 8 Gbits 16 Gbits 32 Gbits (max) (μs) ZTC58NVG0S3HTA K + 8K to to 70 TSOP I 48-P ZTC58NVG0S3HTAI K + 8K to to 85 TSOP I 48-P ZTC58NVG0S3HBAI K + 8K to to 85 P-VFBGA Z TC58NVG0S3HBAI K + 8K to to 85 P-TFBGA CZ ZTC58NVG1S3HTA K + 8K to to 70 TSOP I 48-P ZTC58NVG1S3HTAI K + 8K to to 85 TSOP I 48-P ZTC58NVG1S3HBAI K + 8K to to 85 P-VFBGA ZTC58NVG1S3HBAI K + 8K to to 85 P-TFBGA CZ Z TC58NVG2S0HTA K + 16K to to 70 TSOP I 48-P ZTC58NVG2S0HTAI K + 16K to to 85 TSOP I 48-P ZTC58NVG2S0HBAI K + 16K to to 85 P-VFBGA ZTC58NVG2S0HBAI K + 16K to to 85 P-TFBGA CZ ZTH58NVG3S0HTA K + 16K to to 70 TSOP I 48-P ZTH58NVG3S0HTAI K + 16K to to 85 TSOP I 48-P ZTH58NVG3S0HBAI K + 16K to to 85 P-VFBGA ZTH58NVG3S0HBAI K + 16K to to 85 P-TFBGA CZ ZTH58NVG4S0FTA K K to to 70 TSOP I 48-P C ZTH58NVG4S0FTAK K K to to 85 TSOP I 48-P C ZTH58NVG4S0FBAID K K to to 85 P-TFBGA ZTH58NVG4S0HTA K + 16K to to 70 TSOP I 48-P C ZTH58NVG4S0HTAK K + 16K to to 85 TSOP I 48-P C ZTH58NVG5S0FTA K K to to 70 TSOP I 48-P C ZTH58NVG5S0FTAK K K to to 85 TSOP I 48-P C The above flash memories in BGA packages are also available in 1.8-V versions. For details, contact your local sales representative. BGA 1.8 V 2

3 SLC Large / SLC (Legacy Interface) 32 Gbits 64 Gbits (max) (μs) Z TC58NVG5H2HTA M + 128K to to 70 TSOP I 48-P C Z TC58NVG5H2HTAI M + 128K to to 85 TSOP I 48-P C Z TH58NVG6H2HTA M + 128K to to 70 TSOP I 48-P C Z TH58NVG6H2HTAK M + 128K to to 85 TSOP I 48-P C Z TH58NVG7H2HTA M + 128K to to 70 TSOP I 48-P C 128 Gbits Z TH58NVG7H2HTAK M + 128K to to 85 TSOP I 48-P C (Toggle Interface) 64 Gbits Access Time Program/Erase Time (typ.) (max) (μs) Supply Z TH58TEG6H2HBA4C M + 128K 5 to to 3.6 Z TH58TEG6H2HBAMC M + 128K 5 to to 3.6 Z TH58TEG7H2HBA8C M + 128K 5 to to Gbits Z TH58TEG7H2HBASC M + 128K 5 to to 3.6 Z TH58TEG8H2HBA M + 128K 5 to to Gbits Z TH58TEG8H2HBAS M + 128K 5 to to 3.6 I/O Port Power Supply 0 to 70 P-TFBGA to 85 P-TFBGA to 70 P-TFBGA to 85 P-TFBGA to 70 P-FBGA BZ 40 to 85 P-FBGA BZ 3

4 BENAND TM BENAND (Built-in ECC NAND) is a family of flash memories with ECC functionality that provides a standard raw NAND flash interface. As is the case with traditional NAND flash memories, wear leveling and bad-block management are the responsibility of a host controller. However, BENAND removes the burden of ECC from the host controller, simplifying the use of advanced SLC NAND flash memories. BENAND Built-in ECC NAND ECC NAND NAND ECC SLC NAND (typ.) (μs) ZTC58BVG0S3HTA K + 4K to to 70 TSOP I 48-P Gbits ZTC58BVG0S3HTAI K + 4K to to 85 TSOP I 48-P ZTC58BVG0S3HBAI K + 4K to to 85 P-VFBGA Z TC58BVG0S3HBAI K + 4K to to 85 P-TFBGA CZ ZTC58BVG1S3HTA K + 4K to to 70 TSOP I 48-P Gbits ZTC58BVG1S3HTAI K + 4K to to 85 TSOP I 48-P ZTC58BVG1S3HBAI K + 4K to to 85 P-VFBGA ZTC58BVG1S3HBAI K + 4K to to 85 P-TFBGA CZ ZTC58BVG2S0HTA K + 8K to to 70 TSOP I 48-P Gbits ZTC58BVG2S0HTAI K + 8K to to 85 TSOP I 48-P ZTC58BVG2S0HBAI K + 8K to to 85 P-VFBGA ZTC58BVG2S0HBAI K + 8K to to 85 P-TFBGA CZ ZTH58BVG3S0HTA K + 8K to to 70 TSOP I 48-P Gbits ZTH58BVG3S0HTAI K + 8K to to 85 TSOP I 48-P ZTH58BVG3S0HBAI K + 8K to to 85 P-VFBGA ZTH58BVG3S0HBAI K + 8K to to 85 P-TFBGA CZ BENAND TM is a trademark of TOSHIBA CORPORATION. The above flash memories in BGA packages are also available in 1.8-V versions. For details, contact your local sales representative. BENAND BGA 1.8 V Serial Interface NAND Serial Interface NAND flash memories are compatible with Serial Peripheral Interface (SPI) that is commonly used as a general interface. Serial Interface NAND SLC NAND SPI Access Time Supply (min)(ns) TC58CVG0S3 HQAIE * K + 4K 2.7 to to 85 P-SOP Gbits TC58CVG0S3 HRAIG * K + 4K 2.7 to to 85 P-WSON TC58CYG0S3 HQAIE * K + 4K 40 to 85 P-SOP TC58CYG0S3 HRAIG * K + 4K 40 to 85 P-WSON TC58CVG1S3 HQAIE * K + 4K 2.7 to to 85 P-SOP Gbits TC58CVG1S3 HRAIG * K + 4K 2.7 to to 85 P-WSON TC58CYG1S3 HQAIE * K + 4K 40 to 85 P-SOP TC58CYG1S3 HRAIG * K + 4K 40 to 85 P-WSON TC58CVG2S0 HQAIE * K + 8K 2.7 to to 85 P-SOP Gbits TC58CVG2S0 HRAIG * K + 8K 2.7 to to 85 P-WSON TC58CYG2S0 HQAIE * K + 8K 40 to 85 P-SOP TC58CYG2S0 HRAIG * K + 8K 40 to 85 P-WSON *: New product / 4

5 e MMC TM e MMC TM is a family of NAND flash memories with control functionality such as ECC, wear leveling and bad-block management. e MMC TM also provides a high-speed memory card interface compliant with JEDEC/MMCA Version 5.0/5.1, eliminating the need for users to be concerned about directly controlling NAND flash memories. Thus, e MMC TM can easily be used as a storage device for embedded applications. NAND JEDEC/MMCA Ver. 5.0/5.1 NAND Class 4 GBytes 8 GBytes 16 GBytes 32 GBytes 64 GBytes e MMC Version Max Data Rate (MB/s) Supply VCC VCCQ Size (mm) Code THGBMDG5D1LBAIT Premium to 3.6, 2.7 to to x 10 x 0.8 P-WFBGA THGBMDG5D1LBAIL Premium to 3.6, 2.7 to to x 13 x 0.8 P-WFBGA THGBMHG6C1LBAIL Premium 5.1 (1) to 3.6, 2.7 to to x 13 x 0.8 P-WFBGA THGBMHG6C1LBAU6 Industrial 5.1 (1) to 3.6, 2.7 to to 105 (2) 11.5 x 13 x 0.8 P-WFBGA THGBMHG7C2LBAIL Supreme 5.1 (1) to 3.6, 2.7 to to x 13 x 0.8 P-WFBGA THGBMHG7C1LBAIL Premium 5.1 (1) to 3.6, 2.7 to to x 13 x 0.8 P-WFBGA THGBMHG7C2LBAU7 Industrial 5.1 (1) to 3.6, 2.7 to to 105 (2) 11.5 x 13 x 1.0 P-VFBGA THGBMHG8C4LBAIR Supreme 5.1 (1) to 3.6, 2.7 to to x 13 x 1.0 P-VFBGA THGBMHG8C2LBAIL Premium 5.1 (1) to 3.6, 2.7 to to x 13 x 0.8 P-WFBGA THGBMHG8C4LBAU7 Industrial 5.1 (1) to 3.6, 2.7 to to 105 (2) 11.5 x 13 x 1.0 P-VFBGA THGBMHG9C4LBAIR Supreme 5.1 (1) to 3.6, 2.7 to to x 13 x 1.0 P-VFBGA THGBMGG9U4 LBAIR Premium to 3.6, 2.7 to to x 13 x 1.0 P-VFBGA THGBMHG9C8LBAU8 Industrial 5.1 (1) to 3.6, 2.7 to to 105 (2) 11.5 x 13 x 1.2 P-TFBGA GBytes THGBMHT0C8LBAIG Supreme 5.1 (1) to 3.6, 2.7 to to x 13 x 1.2 P-TFBGA THGBMGT0U8 LBAIG Premium to 3.6, 2.7 to to x 13 x 1.2 P-TFBGA Note (1): Compliant with the optional command queuing feature and the secure write protection feature of JEDEC e MMC Ver 5.1 / e JEDEC e MMC TM Version 5.1 (2): Tc = 115 C max. MMC TM is a trademark of JEDEC/MMCA. Contact the Toshiba sales representative for sample schedule about products under development. Details about your intended usage would be checked before submitting samples of the industrial class product. e MMC JEDEC/MMCA Industrial UFS Toshiba s Flash memories with an integrated controller provide error correction, wear leveling, bad-block management, etc. They have an interface compliant with JEDEC/UFS Version 2.1, eliminating the need for users to perform NAND-specific control. This simplifies integration of Flash memory storage into embedded applications. NAND JEDEC/UFS Ver. 2.1 NAND UFS Max Data Rate Supply Version (MB/s) VCC VCCQ VCCQ2 Size (mm) Code 32 GBytes THGAF4G8N2LBAIR to 3.6 (1) 25 to x 13 x 1.0 P-VFBGA GBytes THGAF4G9N4LBAIR to 3.6 (1) 25 to x 13 x 1.0 P-VFBGA GBytes THGAF4T0N8LBAIR to 3.6 (1) 25 to x 13 x 1.0 P-VFBGA Note (1): This product supports dual-supply operation at VCC and VCCQ2. VCCQ need not be supplied. / VCC VCCQ2 2 VCCQ Contact the Toshiba sales representative for sample schedule about products under development. 5

6 SEMICONDUCTOR GENERAL CATALOG RESTRICTIONS ON PRODUCT USE Toshiba Corporation, and its subsidiaries and affiliates (collectively TOSHIBA ), reserve the right to make changes to the information in this document, and related hardware, software and systems (collectively Product ) without notice. This document and any information herein may not be reproduced without prior written permission from TOSHIBA. Even with TOSHIBA s written permission, reproduction is permissible only if reproduction is without alteration/omission. Though TOSHIBA works continually to improve Product's quality and reliability, Product can malfunction or fail. Customers are responsible for complying with safety standards and for providing adequate designs and safeguards for their hardware, software and systems which minimize risk and avoid situations in which a malfunction or failure of Product could cause loss of human life, bodily injury or damage to property, including data loss or corruption. Before customers use the Product, create designs including the Product, or incorporate the Product into their own applications, customers must also refer to and comply with (a) the latest versions of all relevant TOSHIBA information, including without limitation, this document, the specifications, the data sheets and application notes for Product and the precautions and conditions set forth in the "TOSHIBA Semiconductor Reliability Handbook" and (b) the instructions for the application with which the Product will be used with or for. Customers are solely responsible for all aspects of their own product design or applications, including but not limited to (a) determining the appropriateness of the use of this Product in such design or applications; (b) evaluating and determining the applicability of any information contained in this document, or in charts, diagrams, programs, algorithms, sample application circuits, or any other referenced documents; and (c) validating all operating parameters for such designs and applications. TOSHIBA ASSUMES NO LIABILITY FOR CUSTOMERS' PRODUCT DESIGN OR APPLICATIONS. PRODUCT IS NEITHER INTENDED NOR WARRANTED FOR USE IN EQUIPMENTS OR SYSTEMS THAT REQUIRE EXTRAORDINARILY HIGH LEVELS OF QUALITY AND/OR RELIABILITY, AND/OR A MALFUNCTION OR FAILURE OF WHICH MAY CAUSE LOSS OF HUMAN LIFE, BODILY INJURY, SERIOUS PROPERTY DAMAGE AND/OR SERIOUS PUBLIC IMPACT ("UNINTENDED USE"). Except for specific applications as expressly stated in this document, Unintended Use includes, without limitation, equipment used in nuclear facilities, equipment used in the aerospace industry, medical equipment, equipment used for automobiles, trains, ships and other transportation, traffic signaling equipment, equipment used to control combustions or explosions, safety devices, elevators and escalators, devices related to electric power, and equipment used in finance-related fields. IF YOU USE PRODUCT FOR UNINTENDED USE, TOSHIBA ASSUMES NO LIABILITY FOR PRODUCT. For details, please contact your TOSHIBA sales representative. Do not disassemble, analyze, reverse-engineer, alter, modify, translate or copy Product, whether in whole or in part. Product shall not be used for or incorporated into any products or systems whose manufacture, use, or sale is prohibited under any applicable laws or regulations. The information contained herein is presented only as guidance for Product use. No responsibility is assumed by TOSHIBA for any infringement of patents or any other intellectual property rights of third parties that may result from the use of Product. No license to any intellectual property right is granted by this document, whether express or implied, by estoppel or otherwise. ABSENT A WRITTEN SIGNED AGREEMENT, EXCEPT AS PROVIDED IN THE RELEVANT TERMS AND CONDITIONS OF SALE FOR PRODUCT, AND TO THE MAXIMUM EXTENT ALLOWABLE BY LAW, TOSHIBA (1) ASSUMES NO LIABILITY WHATSOEVER, INCLUDING WITHOUT LIMITATION, INDIRECT, CONSEQUENTIAL, SPECIAL, OR INCIDENTAL DAMAGES OR LOSS, INCLUDING WITHOUT LIMITATION, LOSS OF PROFITS, LOSS OF OPPORTUNITIES, BUSINESS INTERRUPTION AND LOSS OF DATA, AND (2) DISCLAIMS ANY AND ALL EXPRESS OR IMPLIED WARRANTIES AND CONDITIONS RELATED TO SALE, USE OF PRODUCT, OR INFORMATION, INCLUDING WARRANTIES OR CONDITIONS OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE, ACCURACY OF INFORMATION, OR NONINFRINGEMENT. Product may include products using GaAs (Gallium Arsenide). GaAs is harmful to humans if consumed or absorbed, whether in the form of dust or vapor. Handle with care and do not break, cut, crush, grind, dissolve chemically or otherwise expose GaAs in Product. Do not use or otherwise make available Product or related software or technology for any military purposes, including without limitation, for the design, development, use, stockpiling or manufacturing of nuclear, chemical, or biological weapons or missile technology products (mass destruction weapons). Product and related software and technology may be controlled under the applicable export laws and regulations including, without limitation, the Japanese Foreign Exchange and Foreign Trade Law and the U.S. Export Administration Regulations. Export and re-export of Product or related software or technology are strictly prohibited except in compliance with all applicable export laws and regulations. Product may include products subject to foreign exchange and foreign trade control laws. Please contact your TOSHIBA sales representative for details as to environmental matters such as the RoHS compatibility of Product. Please use Product in compliance with all applicable laws and regulations that regulate the inclusion or use of controlled substances, including without limitation, the EU RoHS Directive. TOSHIBA ASSUMES NO LIABILITY FOR DAMAGES OR LOSSES OCCURRING AS A RESULT OF NONCOMPLIANCE WITH APPLICABLE LAWS AND REGULATIONS. In addition to the above, the following are applicable only to development tools. Though TOSHIBA works continually to improve Product s quality and reliability, Product can malfunction or fail. Use the Product in a way which minimizes risk and avoid situations in which a malfunction or failure of Product could cause loss of human life, bodily injury or damage to property, including data loss or corruption. For using the Product, customers must also refer to and comply with the latest versions of all relevant TOSHIBA information, including without limitation, this document, the instruction manual, the specifications, the data sheets for Product. Product is provided solely for the purpose of performing the functional evaluation of a semiconductor product. Please do not use Product for any other purpose, including without limitation, evaluation in high or low temperature or humidity, and verification of reliability. Do not incorporate Product into your products or system. Products are for your own use and not for sale, lease or other transfer Storage & Electronic Devices Solutions Company

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