Striking the Balance Driving Increased Density and Cost Reduction in Printed Circuit Board Designs

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1 Striking the Balance Driving Increased Density and Cost Reduction in Printed Circuit Board Designs Tim Swettlen & Gary Long Intel Corporation Tuesday, Oct 22, 2013

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3 OUTLINE Introduction HDI Market Growth and Trends HDI Technology Envelopes and Design Rules HDI Capability Benefits and Dependencies of HDI Design HDI Cost Analysis Intel HDI Design Conversion Study Conclusion Question and Answer 3

4 HDI Market Growth and Trends Source: Prismark Aug 2013 Report The top growth segments in the PCB industry are all utilizing HDI designs

5 HDI Market Growth and Trends Source: Prismark Aug 2013 Report Handsets are dominated by HDI and Flex designs

6 HDI Market Growth and Trends Source: Prismark Aug 2013 Report Personal computer applications are a fast growing segment for HDI and flex designs

7 HDI Technology Envelopes Mainstream = Entry level low cost technology for HDI designs Advanced = Best technology available in high volume

8 Basic HDI Design Rules Design rules will get more difficult even as cost per area reduces.

9 HDI capability levels used for analysis 10 layer anylayer design

10 % of suppliers capable at the defined HDI excellent capability levels 10 layer anylayer design

11 % of suppliers capable at the defined HDI moderate capability levels 10 layer anylayer design Better capability = better yields, lower cost, better technology

12 Benefits and Dependencies of HDI Design Less via perforations in power planes for improved power delivery Tighter coupling between power and ground planes reducing spreading inductance Elimination of via stubs for improved signal performance Ability to ground stitch without dramatic impact to routing density HDI allows for smaller form factors which are needed to offset the higher cost/area for HDI PCBs

13 HDI Cost Analysis HDI costs are still reducing year over year, while PTH costs remain flat requiring less reduction in area to achieve equivalent costs

14 HDI Cost Analysis Intel should cost analysis of 17 current Ultrabook, 2 in1, or tablet designs HDI can achieve similar cost/pcb to PTH designs

15 HDI Cost Analysis Intel should cost analysis of 17 current Ultrabook, 2 in1, or tablet designs HDI can achieve similar cost/pcb to PTH designs by reducing total board area

16 Intel HDI Design Conversion Study Form Factor reduction requires analyzing the total BOM for reduction opportunities

17 Conclusion HDI capability and capacity is on a rapid growth curve. There are power delivery and signaling benefits which can be utilized. The key to cost equalization is form factor reduction. Industry should drive conversion to HDI to accelerate cost reduction and utilize benefits to HDI technology even faster than today s predictions.

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