QCA Bluetooth and WLAN

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1 Qualcomm Technologies, Inc. QCA Bluetooth and WLAN 80-YC636-2 Rev. D September 7, 2018 All Qualcomm products mentioned herein are products of Qualcomm Technologies, Inc. and/or its subsidiaries. Qualcomm is a trademark of Qualcomm Incorporated, registered in the United States and other countries. Other product and brand names may be trademarks or registered trademarks of their respective owners. This technical data may be subject to U.S. and international export, re-export, or transfer ( export ) laws. Diversion contrary to U.S. and international law is strictly prohibited. Qualcomm Technologies, Inc Morehouse Drive San Diego, CA U.S.A Qualcomm Technologies, Inc. and/or its subsidiaries. All rights reserved.

2 Revision history Revision Date Description A March 2018 Initial release B April 2018 Added legal statement Removed Section 1 Purpose Renamed Section 1.1 Identification to Section 1 Introduction Updated Section 2 Supported hardware with current board information Updated Table 4 WLAN features with current feature set Updated Table 5 Bluetooth features with current hands-free profile and A2DP/AVDTP information Added Table 6 Wi-Fi Alliance precertification/bluetooth SIG Updated Section 5 Installation to reference the specific porting guide and removed information about the AIO command line option Deleted parameter k information for Android from Table 7 Parameters to use in AIO script Deleted Section 6.1 Test coverage Deleted Section 6.2 Certification C May 2018 Updated Section 5 Features with WLAN enhancements and Bluetooth enhancements information D September 2018 Chapter 3 Supported OS: Added kernel 4.11 Chapter 5 Features: Added the list of major features supported in this release, and updated Table 5 and Table 6 with Bluetooth 5.0 support details Chapter 6 Installation: Updated te-f20 to te-f30, and added kernel YC636-2 Rev. D MAY CONTAIN U.S. AND INTERNATIONAL EXPORT CONTROLLED INFORMATION 2

3 Contents 1 Introduction Supported hardware Supported OS Firmware binary files Features Installation YC636-2 Rev. D MAY CONTAIN U.S. AND INTERNATIONAL EXPORT CONTROLLED INFORMATION 3

4 1 Introduction The software package contains firmware binary code for QCA WLAN, Bluetooth with Fluoride Bluetooth stack, and All In One (AIO) software code for x86 Linux platform. 2 Supported hardware Table 1 Supported hardware Board WLAN interface Bluetooth interface SX-SDMAC-2831S-SP SDIO UART 3 Supported OS Table 2 Supported OS Linux Embedded Linux kernel version Linux kernel version Linux kernel version Firmware binary files Table 3 Firmware binary files WLAN SDIO bdwlan30.bin, otp30.bin, qwlan30.bin, utf30.bin Bluetooth UART rampatch_tlv_tf_1.1.tlv and nvm_tlv_tf_1.1.bin 80-YC636-2 Rev. D MAY CONTAIN U.S. AND INTERNATIONAL EXPORT CONTROLLED INFORMATION 4

5 QCA Bluetooth and WLAN 5 Features The major features supported in this release are as follows: Support for the 64-bit, 4.11 kernel with a Linux OS Support for the multiple BSSID feature, where two SoftAPs can operate concurrently with a STA. All three interfaces must operate on the same channel. This feature is not available when the WLAN host interface is USB. WLAN Tx throughputs that are more stable and show lower throughput variations during thermal throttling, if preset temperatures are exceeded. Table 4 WLAN features Category Basic HT (802.11n) support Basic VHT (802.11ac) support Encryption/decryption Security modes Description 2.4/5 GHz STA mode Soft AP mode 20/40 MHz channel width A-MPDU A-MSDU SGI STBC LDPC 5 GHz STA mode Soft AP mode 20/40/80 MHz channel width A-MPDU A-MSDU SGI STBC LDPC WEP TKIP AES Open Shared key WPA-PSK/WPA2-PSK 80-YC636-2 Rev. D MAY CONTAIN U.S. AND INTERNATIONAL EXPORT CONTROLLED INFORMATION 5

6 QCA Bluetooth and WLAN Feature set Category Description Legacy power save WMM WMM-PS WPS/WPS2.0 P2P group owner and client WoW DFS- master & client TxBFee MU-MIMO Tx power-saving feature (GreenTx) Roaming ai (FILS-SK in STA mode; roaming between APs is not supported) ETSI compliance STA mode: EN V2.1.1 and EN V2.1.1 Regulatory Concurrency mode (STA+SAP, STA+P2P/GO, STA+P2P/CLI) WLAN Bluetooth coexistence on chip and external Bluetooth Table 5 Bluetooth features Profile/protocol Service discovery protocol Bluetooth 5.0 Logical link control and adaptation protocol Bluetooth 5.0 Generic Access Profile Bluetooth 5.0 RFCOMM with TS Serial Port Profile 1.2 Device ID Profile 1.3 Hands-Free Profile A2DP/AVDTP Source 1.2 Sink 1.2 HID over GATT Profile 1.0 SPP Over BR/EDR 1.2 BLE Concurrent Central/Peripheral Bluetooth 4.1 BLE Secure Connection Bluetooth 4.2 Role/version Audio Gateway (AG)/1.7 Hands-Free (HF)/1.6 CVSD audio coding over SCO msbc audio coding over esco 80-YC636-2 Rev. D MAY CONTAIN U.S. AND INTERNATIONAL EXPORT CONTROLLED INFORMATION 6

7 QCA Bluetooth and WLAN Table 6 Wi-Fi Alliance precertification/bluetooth SIG Product Characteristics WLAN 11n Interop Test Plan STA/AP, v2.12 WPS2.0 STA, v ac Interop Test Plan STA/AP, v2.3 PMF AP/STA, v1.4 Wi-Fi Direct, v1.4 Bluetooth Bluetooth SIG certification Controller component (BT 5.0 QDID ) Host subsystem (BT 5.0 QDID ) 6 Installation For more information on building and installing the QCA software package, see QCA6174A/QCA WLAN and Bluetooth on Linux x86 Porting Guide (80-YC636-1). Table 7 Parameters to use in AIO script Parameter Description Value t Board type option for the script te-f30 k Kernel version (Linux) v4.9.11, v4.4.15, or v4.11 i Interface type SDIO w WLAN driver version b Bluetooth stack FLUORIDE r Picks up the release configuration for w, b, and I, as specified in release.te-f30 80-YC636-2 Rev. D MAY CONTAIN U.S. AND INTERNATIONAL EXPORT CONTROLLED INFORMATION 7

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