Power Matters. TM. Why Embedded Die? Piers Tremlett Microsemi 22/9/ Microsemi Corporation. Company Proprietary 1
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1 Power Matters. TM Why Embedded Die? Piers Tremlett Microsemi 22/9/16 1
2 Introduction This presentation: Outlines our journey to make miniaturised SiP modules Compares : Embedded Die Technology (EDT) With Fan Out Wafer Level Packages (FOWLP) Deca Technologies Why Microsemi developed an embedded die process StJude Power Matters. TM 2
3 StJude Medical Pacemakers Power Matters. TM 3
4 Microsemi s Radio Communication Module Now an Internet of Things device Microsemi RF module WiFi Patient 3 metre range Doctor Power Matters. TM 4
5 Market Drivers for Hidden medical devices Miniaturization Patient comfort, aesthetics and wound healing Wireless Telemetry Remote monitoring and communication Low power 8 10 year life on one battery = fewer operations Lower cost Needed to increase sales Only 1 in 9 patients in emerging markets requiring pacemakers receive one These drivers are very similar to mobile phones! Power Matters. TM 5
6 Access to High Density die packaging Pacemaker vs mobile phone packaging requirements Lower volumes (2000 x smaller, 1M / year) Off shore subcontractors Don t want these smaller volumes This limits access to high density packaging eg 2.5D, TSV Hence Microsemi have created a miniaturised SiP process Power Matters. TM 6
7 Miniaturising Microsemi s radio module Power Matters. TM 7
8 2009 Miniaturisation Concept Place the die under the SMT components Size: 9mm x 20mm Could we embed the die in the PCB? Our target Power Matters. TM 8
9 Early Embedded Die Embedded die packaging from EU SHIFT project Cross section of a PCB PCB Embedded die Power Matters. TM 9
10 Embedded die Radio Module Our target Size: 9mm x 20mm The result: 4.5mm x 5.5mm Power Matters. TM 10
11 Fan Out Wafer Level Package (FOWLP) and Embedded Die Technology(EDT) compared Power Matters. TM 11
12 Existing EDT products GaN Systems GS66506T 650V transistor Texas Instruments TPS82674SIPT DC/DC step-down power supply Microsemi ZL70323 RF transceiver Although single die packages exist (eg GaN Systems) Microsemi make SiP packages And SiP also makes a good case study for the virtues of EDT Power Matters. TM 12
13 System in a Package (SiP) as a case study Images courtesy of TI Power Matters. TM 13
14 What SiP is good for Modularising and simplifying complex products eg mobile phones, pacemakers Physical shape is important Track length / impedance (RF/ high speed digital) Miniaturisation Power When you opt for a SiP Smaller BOM component count reduction It s a functional, tested, working block Less design support/ easier customer implementation Power Matters. TM 14
15 What package format for a SiP? Power Matters. TM 15
16 What package format for a SiP? Any package can be used if space requirements are low From PCB with pins To BGA packages Where space is a premium Fan Out Wafer Level Package Embedded die Power Matters. TM 16
17 FOWLP Uses Semiconductor & Packaging processes: Wafer carrier Uses moulding compound RDL with tracks >2um Made with a mask aligner and mask Additional passive SMT components are not common, limited types. The Murata GRU series' copper plated terminations are designed for copper via connection Source: Yole and Infineon Power Matters. TM 17
18 Embedded die technology PCB /SMT manufacturing processes Large panel size 12 x 18 or 18 x 24 Woven glass re-enforced PCB laminates Laser direct imaging ( software mask) Wet etching and plating with >75um wide tracks (but 15 50um thick) Optimised for adding SMT components Power Matters. TM 18
19 Embedded Die Process Large master panels 300 radio modules in one panel Power Matters. TM 19
20 FOWLP Deca Technologies Positives High density tracking Slim Very suited to high tracking density single die and multi die Areas for consideration Moulding compound / silicon die interface is a point of stress Limited capability for passive components Many high volumes suppliers Power Matters. TM 20
21 EDT Positives Rugged and reliable Capable of more current carrying thicker tracks More adapted to additional SMT components (eg reflowed) Easy to provide several layer of die Areas for consideration Less track resolution Often requires additional processing of the die Eg RDL Suppliers tend to be used to low volume fast turn around, lower NRE Power Matters. TM 21
22 SiP : FOWLP and EDT Deca Technologies Semiconductor and Packaging industry processes Requirement for functional circuit block System in a Package PCB and SMT industry processes FOWLP Dense tracks / pins Slim 2D only (except PoP) eg digital? Covergence Eg LDI, large panels EDT Reflowable SMT components Higher reliability spec. s Higher current / thermals eg analogue? RF and power? Power Matters. TM 22
23 EDT suppliers COB / SMT industry Competencies: - Functional test - Die placement - SMT Convergence Embedded die PCB industry Competencies: - Substrate manufacturing Power Matters. TM 23
24 The design flexibility of EDT Power Matters. TM 24
25 Embedded Die Offers Design Flexibility Power Matters. TM 25
26 Design Flexibility: - Layering Heat sinking to solderable Cu pad Short interconnect Low parasitics>low inductance Favours: power packages, RF Miniaturisation Power Matters. TM 26
27 No Fixed Tooling Odd shapes and sizes 250mm embedded sensor ring Any package foot print Also top components Low NRE no fixed tooling eg moulds Lower costs at lower volumes Fast turnarounds Power Matters. TM 27
28 Heterogeneous Component Mix Any termination SMT Edge connectors Soldered wires Any components Microelectronics SMT Through hole From: single die packages many die to System in a Package Wire bonded embedded die 3 x 3 die package Power Matters. TM 28
29 summary Power Matters. TM 29
30 Embedded die offers Low costs at lower volumes, fast turnaround Great design flexibility Miniaturisation Any size and any shape Single die to System in a Package Rugged and reliable Tends to suit: lower track density lower pin counts analogue circuits eg RF, power Power Matters. TM 30
31 Thank You Piers Tremlett Microsemi Microsemi Corporate Headquarters One Enterprise, Aliso Viejo, CA USA Within the USA: +1 (800) Outside the USA: +1 (949) Sales: +1 (949) Fax: +1 (949) Microsemi Corporation. All rights reserved. Microsemi and the Microsemi logo are registered trademarks of Microsemi Corporation. All other trademarks and service marks are the property of their respective owners. Microsemi Corporation (Nasdaq: MSCC) offers a comprehensive portfolio of semiconductor and system solutions for aerospace & defense, communications, data center and industrial markets. Products include high-performance and radiation-hardened analog mixed-signal integrated circuits, FPGAs, SoCs and ASICs; power management products; timing and synchronization devices and precise time solutions, setting the world's standard for time; voice processing devices; RF solutions; discrete components; enterprise storage and communication solutions, security technologies and scalable anti-tamper products; Ethernet solutions; Power-over-Ethernet ICs and midspans; as well as custom design capabilities and services. Microsemi is headquartered in Aliso Viejo, Calif., and has approximately 4,800 employees globally. Learn more at Microsemi makes no warranty, representation, or guarantee regarding the information contained herein or the suitability of its products and services for any particular purpose, nor does Microsemi assume any liability whatsoever arising out of the application or use of any product or circuit. The products sold hereunder and any other products sold by Microsemi have been subject to limited testing and should not be used in conjunction with mission-critical equipment or applications. Any performance specifications are believed to be reliable but are not verified, and Buyer must conduct and complete all performance and other testing of the products, alone and together with, or installed in, any end-products. Buyer shall not rely on any data and performance specifications or parameters provided by Microsemi. It is the Buyer s responsibility to independently determine suitability of any products and to test and verify the same. The information provided by Microsemi hereunder is provided as is, where is and with all faults, and the entire risk associated with such information is entirely with the Buyer. Microsemi does not grant, explicitly or implicitly, to any party any patent rights, licenses, or any other IP rights, whether with regard to such information itself or anything described by such information. Information provided in this document is proprietary to Microsemi, and Microsemi reserves the right to make any changes to the information in this document or to any products and services at any time without notice. Power Matters. TM 31
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