Application Specification Miniature Spring Socket Contacts 03 MAY 11 Rev C

Transcription

1 Applcaton Specfcaton Mnature Sprng Socket Contacts 03 MAY 11 Rev C All numercal values are n metrc unts [wth U.S. customary unts n brackets]. Dmensons are n mllmeters [and nches]. Unless otherwse specfed, dmensons have a tolerance of [+.005] and angles have a tolerance of +2_. Fgures and llustratons are fordentfcaton only and are not drawn to scale. 1. INTRODUCTION Ths specfcaton covers the applcaton of Mnature Sprng Socket Contacts. These requrements are applcable to the product wth hand or automatc applcaton toolng. When correspondng wth TE Connectvty Personnel, use the termnology provded on ths specfcaton to help facltate your nqury for nformaton. Basc terms and features of the socket s provded n Fgure 1. Typcal Mnature Sprng Contact Eyelet Seres 1 Seres 2 Sprng Knockout Bottom (As Applcable) Seres 3 Seres 4 Seres 5 Fgure 1 2. REFERENCE MATERIAL 2.1. Revson Summary S Updated document to corporate requrements 2.2. Customer Assstance Reference Product Base Part Number and Product Code 3076 are representatve numbers of Mnature Sprng Socket Contacts. Use of these numbers wll dentfy the product lne and expedte your nqures through a servce network establshed to help you obtan product and toolng nformaton. Such nformaton can be obtaned through a local TE Representatve or, after purchase, by callng the Toolng Assstance Center or Product Informaton number at the bottom of ths page. E2011 Tyco Electroncs Corporaton, a TE Connectvty Ltd. Company All Rghts Reserved *Trademark TOOLING ASSISTANCE CENTER PRODUCT INFORMATION Ths controlled document s subject to change. For latest revson and Regonal Customer Servce, vst our webste at TE Connectvty, TE connectvty (logo), and TE (logo) are trademarks. Other logos, product and/or Company names may be trademarks of ther respectve owners. 1 of 7 LOC B

2 2.3. Drawngs Customer Drawngs for specfc products are avalable from the servce network. The nformaton contaned n Customer Drawngs takes prorty f there s a conflct wth ths specfcaton or wth any other techncal documentaton suppled by TE Manuals Manual s avalable upon request and can be used as a gude to solderng. Ths manual provdes nformaton on varous flux types and characterstcs wth the commercal desgnaton and flux removal procedures. A checklst s ncluded n the manual as a gude for nformaton on solderng problems Instructonal Materal The followng lst ncludes avalable nstructon sheets (408--seres) that provde assembly procedures for operaton, mantenance and repar of toolng; and customer manuals (409--seres) that provde setup, operaton, and mantenance of machnes. Document Number Document Ttle Mnature Sprng Socket Inserton Tool Mnature Sprng Socket Inserton Machnes (MSSIM & SCSIM) No [ ] 2.6. Specfcatons Product Specfcaton provdes nformaton about performance, test results, and qualty requrements for the Mnature Sprng Socket Contacts. 3. REQUIREMENTS 3.1. Safety Do not stack socket contact packages so hgh that the shppng contaners buckle or deform Materal The eyelet s made of copper and the sprng s made of beryllum--copper. The socket contacts are avalable n tnorgoldplate Storage A. Shelf Lfe The sockets should reman n the shppng contaners untl ready for use to prevent deformaton to the contacts. The sockets should be used on a frst n, frst out bass to avod storage contamnaton that could adversely affect performance. B. Chemcal Exposure Do not store sockets near any chemcal lsted below as they may cause stress corroson crackng n the contacts. Alkales Ammona Ctrates Phosphates Ctrates Sulfur Compounds Amnes Carbonates Ntrtes Sulfur Ntrtes Tartrates 3.4. PC Board Requrements A. Materal and Thckness The pc board materal must be glass epoxy (FR--4 or G--10). The pc board thckness shall be mm [ n.] thck. Contact the Product Informaton Center at the number lsted at the bottom of page 1 for sutablty of other board materals and thcknesses. B. Hole Dmensons The pc board may be sngle--sded or double--sded, wth or wthout plated--thru holes. See Fgure 2. 2 of 7 Rev C

3 Board Thckness [ ] Trace Wdth (As Requred) Pad Wdth (As Requred) Drlled Hole Dameter (As Requred) Refer to the Customer Drawng for Fnshed Hole Dameter After Platng Tn Lead Platng (As Requred) Fgure 2 C. Layout (Fgure 3) For components other than Mnature Sprng Socket Contacts mounted on the pc board, the clearance envelope for applcaton toolng shall be 5.03 mm [.198 n.] mnmum dameter on the head sde of the pc board and 2.90 mm [.114 n.] mnmum dameter on the other sde. For plated through holes, tn or tn--lead platng shall not exceed 0.03 mm [.001 n.] to ensure mnmum retenton. The pc board should be supported around the hole when nsertng sockets. Refer to Instructon Sheet Refer to 3.4.D 2.54 [.100] Mn. Refer to the Customer Drawng for Fnshed Hole Dameter After Platng 2.54 [.100] Mn. Edges Shall Be Free of Burrs and Fbers Fgure Inserton Usng the recommended toolng and related documentaton provded n Secton 5, TOOLING, nsert the socket contacts nto the pc board Solderng Socket Contacts The Mnature Sprng Socket Contacts can be soldered wth wave, vapor phase, or nfrared reflow processes, provded the temperatures and exposure tme are wthn the ranges specfed n Fgure 4. TE recommends the use of SN60 or SN62 solder for the socket contacts. Refer to Paragraph 2.4 for nstructonal materal that s avalable for establshng solderng gudelnes. Rev C 3 of 7

4 D Wave Temperature SOLDERING PROCESS CELSIUS TEMPERATURE FAHRENHEIT TIME (At Max Temperature) Wave Solderng 265 D 509 D 12 Seconds Vapor Phase Solderng Mnutes Infrared Reflow Solderng Mnutes Fgure 4 A. Flux Selecton The socket contact must be fluxed pror to solderng wth a mldly actve, rosn base flux. Selecton of the flux wll depend on the type of pc board and other components mounted on the board. Addtonally, the flux must be compatble wth the wave solder lne, manufacturng, health, and safety requrements. Call the Product Informaton phone number at the bottom of page 1 for consderaton of other types of flux. Some fluxes that are compatble wth these contacts are provded n Fgure 5. FLUX TYPE ACTIVITY RESIDUE Type RMA (Mldly Actvated) COMMERCIAL DESIGNATION KESTERS ALPHAS Mld Noncorrosve Fgure 5 B. Cleanng After solderng, removal of fluxes, resdues, and actvators s necessary. Consult wth the suppler of the solder and flux for recommended cleanng solvents. The followng s a lstng of common cleanng solvents that wll not affect the contacts for the tme and temperature specfed. See Fgure 6. DANGER Consderaton must be gven to toxcty and other safety requrements recommended by the solvent manufacturer. Refer to the manufacturer s Materal Safety Data Sheet (MSDS) for characterstcs and handlng of cleaners. Trchloroethylene and Methylene Chlorde can be used wth no harmful affect to the contacts; however TE does not recommend them because of the harmful occupatonal and envronmental effects. Both are carcnogenc (cancer -causng) and Trchloroethylene s harmful to the earth s ozone layer. If you have a partcular solvent that s not lsted, contact the Toolng Assstance Center or Product Informaton number at the bottom of page 1. TEMPERATURES CLEANER TIME (Maxmum) (Mnutes) NAME TYPE CELSIUS FAHRENHEIT ALPHAS 2110 Aqueous BIOACTS EC -7 Solvent Butyl CARBITOLS Solvent 1 Room Ambent Isopropyl Alcohol Solvent KESTERS 5778 Aqueous KESTER 5779 Aqueous LONCOTERGES 520 Aqueous LONCOTERGE 530 Aqueous Terpene Solvent Solvent C. Dryng Fgure 6 When dryng cleaned socket contacts, make certan that temperature lmtatons are not exceeded: --65 to 125 C [--85 to 257 F]. Excessve temperatures may cause degradaton. SALPHA, BIOACT, Butyl CARBITOL, KESTER, and LONCOTERGE are trademarks. 4 of 7 Rev C

5 3.7. Checkng Installed Socket Contact All solder jonts should conform to those specfed n Workmanshp Specfcaton The socket contact must seat on the pc board to wthn the tolerance shown n Fgure 7. There shall be no deformaton of the socket contact durng the nserton operaton that wll affect the performance. PC Board Installed Socket Contact Pn Contact 0.76 [.030] Max. Eyelet Sprng 3.8. Repar/Replacement Solder (SolderFllet Should be Evenly Formed Around Socket) Fgure 7 Knockout Bottom (As Applcable) Socket contacts are not reparable f damaged. Damaged socket contacts must be removed and replaced. The socket contact can be removed from the pc board by standard de--solderng methods. 4. QUALIFICATIONS Mnature Sprng Socket Contacts are not requred to be agency approved. 5. TOOLING TE has exstng toolng for applyng these socket contacts. Part numbers of avalable toolng and the applcable nstructonal materal s provded n Fgure 8. A customer suppled support fxture should be used n conjuncton wth the applcaton of the Mnature Sprng Socket Contacts. SERIES SIZE MINIATURE SPRING SOCKETS PIN DIAMETER [.001] [.012] [.014] MINIATURE SPRING SOCKET TOOLING (DOCUMENT) INSERTION MACHINE ( ) HAND INSERTION TOOL ( ) [.025] [.035] [.042] Fgure 8 (cont d) Rev C 5 of 7

6 PC Board Support (Customer Suppled) Holes (Ref) Channel (Ref) Mnature Sprng Socket Inserton Tool Mnature Sprng Socket Inserton Machne (MSSIM & SCSIM) [ ] Fgure 8 (end) 6 of 7 Rev C

7 6. VISUAL AID Fgure 9 shows a typcal applcaton of a Mnature Sprng Socket Contact. Ths llustraton should be used by producton personnel to ensure a correctly appled product. Applcatons whch DO NOT appear correct should be nspected usng the nformaton n the precedng pages of ths specfcaton. PC BOARD MUST NOT BE CRACKED OR DAMAGED IN ANY WAY PC BOARD HOLE SHOULD BE CLEAN AND FREE OF BURRS TYPICAL MINIATURE SPRING SOCKET CONTACT BODY SHOULD FIT SNUGLY INTO PC BOARD HOLE SOLDER FILLET SHOULD BE EVENLY FORMED AROUND SOCKET TAIL SHOULD BE ROUND WITH NO FLAT OR DEPRESSED AREAS SOCKET SHOULD BE STRAIGHT FIGURE 9. VISUAL AID Rev C 7 of 7