SMD TYPE TOP VIEW WHITE COLOR LED

Transcription

1 SMD TYPE TOP VIEW WHITE COLOR LED TYPE : 5050 White Top LED MODEL : F4TV6P503Z1WH Force4 ISSUE REVIEW APPR L CUSTOMER ISSUE REVIEW APPR L , Daechon-dong, Buk-gu, Gwangju, Korea, Tel. : Fax. : Homepage : http : //

2 General Description (1) Features Package Size - 5.4(L) 5.0(W) 1.6(T) mm White Emission Package (Top View) Surface mount Top view type (2) Applications Lighting for Indoor & Outdoor General Lighting Optical indicator Interior automotive lighting (3) Outline Dimensions

3 FORCE4 Top View LED P/N ⑴ F4 : FORCE4 ⑵ TV : Top View LED. SMD Type ⑶ 6P : 6 PIN PKG ⑷ 50 : Package Size (5.0*5.0*1.6T) ⑸ 3 : Chip Quantity (One Chip [1], Two Chip [2], Three Chip[3]) ⑹ Z1 : Built Zener (X : No Zener / One Zener [Z1] / Two Zener [Z2] / Three Zener [Z3]) ⑺ WH : White Color (BW : Bluish White / PW : Pure White / NW : Neutral White / AW: Amber White / WW : Warm White) ⑻ 75 : CRI EX) F4 TV 6P 50 3 Z1 WH - 75 ⑴Force4 ⑵Top View ⑶6PIN PKG ⑷Package Size ⑸Chip Quantity ⑹Built Zener ⑺White Color ⑻CRI

4 Specifications Absolute maximum ratings Parameter Symbol Absolute maximum rating Unit Power Dissipation PD 300 mw Forward Current IF 90 ma Peak Pulse Current (1) IFP 180 ma Reverse Current IR 100 ma Operating Temperature TOPR -40 to +85 Storage Temperature TSTG -40 to +100 Notes (1) Duty ratio = 1/10, pulse with = 10msec Forward voltage & Luminous intensity rank Parameter Symbol Condition Min. Max. Unit Forward IF = VF Voltage 60mA V Luminous Intensity IV IF = 60mA mcd (Ta=25 ) CRI Nomal

5 Color Rank White Color CIE Characteristics & CCT RANKS Bluish White 8000K~11000K (Bluish White) 7000K~8000K (Pure White) 6500K~7000K (Pure White) I J K A0 A2 A K~6500K (Pure White) 5600K~6000K (Neutral White) A1 A3 A5 B0 B2 B K~5600K (Neutral White) 5000K~5300K (Neutral White) B1 B3 B5 C0 C2 C K~5000K (Amber White) 4500K~4700K (Amber White) C1 C3 C5 D0 D2 D K~4500K (Amber White) 4000K~4200K (Amber White) D1 D3 D5 E0 E2 E

6 3700K~4000K (Amber White) 2600K~2700K (Warm White) H1 H3 H5 Cx Cy Cx Cy Cx Cy K~3700K (Amber White) E1 E3 E5 F0 F2 F K~3500K (Warm White) 3000K~3200K (Warm White) F1 F3 F5 G0 G2 G K~3000K (Warm White) 2700K~2900K (Warm White) G1 G3 G5 H0 H2 H

7 White Color CIE Chromaticity Diagram

8 Characteristics Diagrams

9 Results of Reliability Tests Test Items and Results Item Test Condition Time No. of Damaged Steady State Operating Life #1 Ta = 25, IF = 20mA/Die 1000hr 0/50 Steady State Operating Life #2 Ta = 25, IF = 35mA/Die 500hr 0/50 Steady State Operating Life of High Ta = 85, IF = 8.5mA/Die 1000hr 0/50 Temperature#1 Steady State Operating Life of High Temperature#2 Ta = 85, IF = 20mA/Die 240hrs 0/50 Steady State Operating Ta = 60, RH = 90%, Life of High Humidity IF = 20mA/Die Heat#1 500hrs 0/50 Steady State Operating Life of Low Temperature Ta = -30, IF = 20mA/Die 1000hr 0/50 Moisture Resistance 25 ~65 ~-10 Cycle 90%RH 24hrs/1cycle 10Cycle 0/50 High Temperature Storage Ta = hr 0/50 Temperature Humidity Storage Ta = 85, RH=85% 1000hr 0/50 Low Temperature Storage Ta = hrs 0/50 Temperature Shock 0 ~ sec, 15sec. 20Cycle 0/50 Temperature Cycle '-40 ~25 ~100 ~25 (30min~5min~30min~5min) 100Cycle 0/50 Resistance to Soldering Tmax=260, 10sec Heat (Reflow Soldering) (Pre treatment 30, 70%) 2 times 0/50 Criteria for Judging the Damage Parameter Symbol Condition Criteria for Judgement Min. Max. Forward Voltage VF IF = 60mA - U.S.L.(1) * 1.1 Luminous Intensity IV IF = 60mA L.S.L.(6) * Reverse Current IR VR = 5V - 10mA Notes (1) U.S.L. : Upper Standard Level (2) L.S.L. : Lower Standard Level

10 Recommended Soldering Pattern Reflow Soldering Lead Solder Lead-Free Solder Pre-Heating 120 ~ ~ 200 Pre-Heat Time 120sec. Max. 120sec. Max. Peak Temperature 240 Max. 260 Max. Soldering Time 10sec. Max. 10sec. Max. * After reflow soldering, Rapid cooling should be Hand Soldering 350 Max. Temperature 3 sec. Max. Soldering time (one time only) Recommended Reflow Soldering profile Lead Solder Lead-Free Sol Recommended Soldering Pattern Soldering Cautions -. Reflow soldering should not be done more than two times. -. When soldering, do not put stress on the LEDs during heating. -. After soldering, do not wrap the circuit board. -. The LEDs can be soldered on place using the reflow soldering method. -. Occasionaly there is a brightness decrease cause by the influence of heat or ambient atmosphere during air reflow. It is recommend that the user use the nitrogen reflow method.

11 Carrier Tape & Carrier Reel Dimensions Carrier Tape (Material : PS conductive) Reel (Black Color) * Quantity : 1,000 pcs / Reel Label Spec * Size : 70.0(L) 60.0(W) mm

12 Box 규격및 Size < 大 Box> < 小 Box> < 大 Box Size> < 小 Box Size> Cautions On Use For the Handling (1) Over current proof Resistors must be applied for LED protection, otherwise slight voltage shift will cause huge current change. (Burn out will happen) (2) Fragile Mechanical stress on the surface should be minimized, because Wavein LED products are covered by soft silicone. Basically there is no restriction on the form of the pick and place nozzle during SMT process, but cautions need not to put heavy mechanical pressure on the package.

13 (3) Pick and Place Do not touch the silicone resin part with fingers. Use tweezers referring to below pictures. (4) Solvent When cleaning LED products, it is recommended to use isopropyl alcohol (IPA). Do not use water, oil, organic solvent for cleaning. For the Storage The LED products should be used within a year. The LED products should be kept at 5 C~35 C and 60%RH or less. The LEDs should be soldered within 168hours (7days) after opening the packages. If unused LED products remain, they should be stored in moisture proof packages, such as sealed containers with packages of desiccant (silica gel). If desiccant (silica gel) has faded away or the LEDs have exceeded the storage time, baking treatment should be performed using the following condition: more than 24hours at 65±5 C