QUICKSWITCH PRODUCTS HIGH-SPEED CMOS QUICKSWITCH DOUBLE-WIDTH BUS SWITCH

Similar documents
QUICKSWITCH PRODUCTS HIGH-SPEED CMOS QUICKSWITCH DOUBLE-WIDTH BUS SWITCH

QUICKSWITCH PRODUCTS HIGH-SPEED CMOS QUICKSWITCH 32-BIT MULTIWIDTH BUS SWITCHES

QUICKSWITCH PRODUCTS HIGH-SPEED CMOS 10-BIT BUS SWITCH WITH FLOW-THROUGH PINOUT

QUICKSWITCH PRODUCTS HIGH-SPEED CMOS QUADRUPLE BUS SWITCH WITH INDIVIDUAL ACTIVE LOW ENABLES

QUICKSWITCH PRODUCTS HIGH-SPEED CMOS 10-BIT BUS SWITCH

QUICKSWITCH PRODUCTS HIGH-SPEED CMOS QUICKSWITCH QUAD 2:1 MUX/DEMUX

IDTQS3257 QUICKSWITCH PRODUCTS HIGH-SPEED CMOS QUICKSWITCH QUAD 2:1 MUX/DEMUX DESCRIPTION: FUNCTIONAL BLOCK DIAGRAM FEATURES: APPLICATIONS:

QUICKSWITCH PRODUCTS 2.5V / 3.3V 16-BIT HIGH BANDWIDTH BUS SWITCH

QUICKSWITCH PRODUCTS 2.5V / 3.3V 32-BIT HIGH BANDWIDTH BUS SWITCH

QUICKSWITCH PRODUCTS 2.5V/3.3V 20-BIT HIGH BANDWIDTH BUS SWITCH

QUICKSWITCH PRODUCTS 2.5V / 3.3V 20-BIT DUAL PORT, HIGH BANDWIDTH BUS SWITCH

QUICKSWITCH PRODUCTS 2.5V / 3.3V 8-BIT HIGH BANDWIDTH BUS SWITCH

QUICKSWITCH PRODUCTS 2.5V / 3.3V 8:1 MUX / DEMUX HIGH BANDWIDTH BUS SWITCH

QUICKSWITCH PRODUCTS 2.5V / 3.3V 24-BIT HIGH BANDWIDTH BUS SWITCH

IDTQS3VH383 QUICKSWITCH PRODUCTS 2.5V/3.3V 8-BIT HIGH BANDWIDTH BUS EXCHANGE BUS SWITCH

QUICKSWITCH PRODUCTS 2.5V / 3.3V QUAD ACTIVE LOW, HIGH BANDWIDTH BUS SWITCH

3.3V CMOS OCTAL BIDIRECTIONAL TRANSCEIVER

IDT74FST BIT 2:1 MUX/DEMUX SWITCH

LOW-VOLTAGE OCTAL BUS SWITCH

LOW-VOLTAGE 10-BIT BUS SWITCH

LOW-VOLTAGE 24-BIT BUS EXCHANGE SWITCH

FAST CMOS OCTAL BUFFER/LINE DRIVER

3.3V CMOS 1-TO-5 CLOCK DRIVER

IDT74CBTLV3257 LOW-VOLTAGE QUAD 2:1MUX/DEMUX BUS SWITCH

IDT74LVC541A 3.3V CMOS OCTAL BUFFER/DRIVER WITH 3-STATE OUTPUTS AND 5 VOLT TOLERANT I/O

IDT74LVC245A 3.3V CMOS OCTAL BUS TRANSCEIVER WITH 3-STATE OUTPUTS AND 5 VOLT TOLERANT I/O

IDT74LVC244A 3.3V CMOS OCTAL BUFFER/DRIVER WITH 3-STATE OUTPUTS, 5 VOLT TOLERANT I/O

FAST CMOS OCTAL BUFFER/LINE DRIVER

3.3 Volt CMOS Bus Interface 8-Bit Latches

3.3V CMOS BUFFER/CLOCK DRIVER

IDT54/74FCT244/A/C FAST CMOS OCTAL BUFFER/LINE DRIVER DESCRIPTION: FUNCTIONAL BLOCK DIAGRAM FEATURES: OEA OEB DA1 OA1 DB1 OB1 DA2 OA2 OB2 DB2 DA3 OA3

IDT54/74FCT541/A/C FAST CMOS OCTAL BUFFER/LINE DRIVER DESCRIPTION: FUNCTIONAL BLOCK DIAGRAM

3.3V CMOS HEX BUFFER/DRIVER WITH OPEN-DRAIN OUTPUTS AND 5 VOLT TOLERANT I/O

CMOS SyncFIFO 64 x 8, 256 x 8, 512 x 8, 1,024 x 8, 2,048 x 8 and 4,096 x 8 LEAD FINISH (SnPb) ARE IN EOL PROCESS - LAST TIME BUY EXPIRES JUNE 15, 2018

BUS SWITCHES PROVIDE 5V AND 3V LOGIC CONVERSION WITH ZERO DELAY. Figure 1. 5V & 3V Logic Mixture in PC Design

IDT74LVCH16373A TRANSPARENT D-TYPE LATCH WITH 3-STATE OUTPUTS, 5 VOLT TOLERANT I/O AND BUS-HOLD

CMOS Static RAM 1 Meg (128K x 8-Bit) Revolutionary Pinout

IDT74FCT299/A/C FAST CMOS 8-INPUT UNIVERSAL SHIFT REGISTER DESCRIPTION: FUNCTIONAL BLOCK DIAGRAM

FAST CMOS SYNCHRONOUS PRESETTABLE BINARY COUNTERS

DatasheetArchive.com. Request For Quotation

D0 - D8 INPUT REGISTER. RAM ARRAY 64 x 9, 256 x 9, 512 x 9, 1,024 x 9, 2,048 x 9, 4,096 x 9, 8,192 x 9 OUTPUT REGISTER RESET LOGIC RCLK REN1

LOW SKEW CMOS PLL CLOCK DRIVER WITH INTEGRATED LOOP FILTER

3.3V ZERO DELAY CLOCK BUFFER

IDT71016S/NS. CMOS Static RAM 1 Meg (64K x 16-Bit)

CMOS PARALLEL-TO-SERIAL FIFO 1,024 x 16

IDT71V124SA/HSA. 3.3V CMOS Static RAM 1 Meg (128K x 8-Bit) Center Power & Ground Pinout

2.5 V/3.3 V, 1-Bit, 2-Port Level Translator Bus Switch in SOT-66 ADG3241

2.5 V/3.3 V, 2-Bit Common Control Level Translator Bus Switch ADG3242

ICS548A-03 LOW SKEW CLOCK INVERTER AND DIVIDER. Description. Features. Block Diagram DATASHEET

CMOS SyncFIFO 64 X 9, 256 x 9, 512 x 9, 1,024 X 9, 2,048 X 9, 4,096 x 9 and 8,192 x 9

3.3V CMOS Static RAM for Automotive Applications 4 Meg (256K x 16-Bit)

1.8V to 3.3V LVCMOS High Performance Clock Buffer Family

CMOS SyncFIFO TM 256 x 18, 512 x 18, 1,024 x 18, 2,048 x 18, and 4,096 x 18 INPUT REGISTER WRITE CONTROL LOGIC

T1/E1 CLOCK MULTIPLIER. Features

IDT54/74FCT373T/AT/CT

SN54LVTH16374, SN74LVTH V ABT 16-BIT EDGE-TRIGGERED D-TYPE FLIP-FLOPS WITH 3-STATE OUTPUTS

SN54LVTH16240, SN74LVTH V ABT 16-BIT BUFFERS/DRIVERS WITH 3-STATE OUTPUTS

PI74FCT373T PI74FCT573T Octal Transparent Latches

ZLED7002. Toggle (Side-Step) Dual-Channel LED Driver. Datasheet. Features. Brief Description. Benefits. Available Support. Physical Characteristics

IDTVP386. General Description. Features. Block Diagram DATASHEET ADVANCE INFORMATION 8/28-BIT LVDS RECEIVER FOR VIDEO

AT29C K (32K x 8) 5-volt Only CMOS Flash Memory. Features. Description. Pin Configurations

AT28C16. 16K (2K x 8) CMOS E 2 PROM. Features. Description. Pin Configurations

74AC11240 OCTAL BUFFER/LINE DRIVER WITH 3-STATE OUTPUTS

DUAL TTL-to-DIFFERENTIAL PECL TRANSLATOR

8K X 8 BIT LOW POWER CMOS SRAM

2:1 MULTIPLEXER CHIP FOR PCI-EXPRESS ICS Features

SN54ALS20A, SN54AS20, SN74ALS20A, SN74AS20 DUAL 4-INPUT POSITIVE-NAND GATES

FST3257 Quad 2:1 Multiplexer / Demultiplexer Bus Switch

Rev. No. History Issue Date Remark

Am27C128. Advanced Micro Devices. 128 Kilobit (16,384 x 8-Bit) CMOS EPROM DISTINCTIVE CHARACTERISTICS GENERAL DESCRIPTION BLOCK DIAGRAM FINAL

2.5 V/3.3 V, 2-Bit, Individual Control Level Translator Bus Switch ADG3243

2:1 MULTIPLEXER CHIP FOR PCI-EXPRESS ICS Description. Features. Block Diagram DATASHEET

AT24C01A/02/04/08/16. 2-Wire Serial CMOS E 2 PROM. Features. Description. Pin Configurations. 1K (128 x 8) 2K (256 x 8) 4K (512 x 8) 8K (1024 x 8)

EFA PAEA WCLKB WENB1 WENB2 FFA WRITE CONTROL LOGIC WRITE POINTER RESET LOGIC RSB

My-MS. MM27C ,072 x 8 CMOS EPROM PRELIMINARY INFORMATION ISSI IS27C010 FEATURES DESCRIPTION FUNCTIONAL BLOCK DIAGRAM

AS6C6264 8K X 8 BIT LOW POWER CMOS SRAM REVISION HISTORY. Feb

Am27C512. Advanced Micro Devices. 512 Kilobit (65,536 x 8-Bit) CMOS EPROM DISTINCTIVE CHARACTERISTICS GENERAL DESCRIPTION BLOCK DIAGRAM FINAL

2 TO 4 DIFFERENTIAL CLOCK MUX ICS Features

AS6C K X 8 BIT LOW POWER CMOS SRAM

MX27C K-BIT [32K x 8] CMOS EPROM FEATURES GENERAL DESCRIPTION BLOCK DIAGRAM PIN CONFIGURATIONS PIN DESCRIPTION

Features. Applications

CMOS SyncFIFO 64 X 9, 256 x 9, 512 x 9, 1024 X 9, 2048 X 9 and 4096 x 9

LP621024E-I Series 128K X 8 BIT CMOS SRAM. Document Title 128K X 8 BIT CMOS SRAM. Revision History. AMIC Technology, Corp.

PI2PCIE2214. PCI Express 2.0, 1-lane, 4:1 Mux/DeMux Switch. Features. Description. Application. Pin Description. Block Diagram.

Am27C020. Advanced Micro Devices. 2 Megabit (262,144 x 8-Bit) CMOS EPROM DISTINCTIVE CHARACTERISTICS GENERAL DESCRIPTION BLOCK DIAGRAM FINAL

A23W8308. Document Title 262,144 X 8 BIT CMOS MASK ROM. Revision History. Rev. No. History Issue Date Remark

NOT RECOMMENDED FOR NEW DESIGNS SINGLE SUPPLY QUAD PECL/TTL-TO-PECL

The S1F77330 series is the bus switch suitable for USB applications. The adopted CMOS process technology characterizes

1-Megabit (128K x 8) Low Voltage Paged Parallel EEPROMs AT28LV010

512K bitstwo-wire Serial EEPROM

Am27C Megabit (131,072 x 8-Bit) CMOS EPROM DISTINCTIVE CHARACTERISTICS GENERAL DESCRIPTION BLOCK DIAGRAM

A4711 SINGLE SPDT ANALOG SWITCH 2.7Ω, LOW-VOLTAGE

D0-D17 INPUT REGISTER WRITE CONTROL LOGIC. RAM ARRAY 256 x 18, 512 x 18 1,024 x 18, 2,048 x 18 4,096 x 18 Q0-Q17

3.3 VOLT LOGIC CHARACTERISTICS AND APPLICATIONS

SEIKO EPSON CORPORATION

HIGH-SPEED 4K x 8 FourPort TM STATIC RAM

A24C08. AiT Semiconductor Inc. ORDERING INFORMATION

2-Megabit (256K x 8) 5-volt Only CMOS Flash Memory AT29C020. Features. Description. Pin Configurations

1.8V PHASE LOCKED LOOP DIFFERENTIAL 1:10 SDRAM CLOCK DRIVER

PAL22V10 Family, AmPAL22V10/A

Transcription:

QUICKSWITCH PRODUCTS HIGH-SPEED CMOS QUICKSWITCH DOUBLE-WIDTH BUS SWITCH IDTQS32X2245 FEATURES: Enhanced N channel FET with no inherent diode to Vcc Dual '245 function 25Ω resistor for low noise Low propagation delay, zero ground bounce Undershoot clamp diodes on all switch and control inputs TTL-compatible control inputs Available in 40-pin QVSOP package DESCRIPTION: The QS32X2245 provides a set of 16 high-speed CMOS TTL-compatible bus switches in a flow-through pinout. The QS32X2245 includes internal 25Ω resistors to reduce reflection noise in high speed applications. The Output Enable (OEn) signals turn the switches on similar to the OEn signal of the 74'245. QuickSwitch devices provide an order of magnitude faster speed than conventional logic devices. The QS32X2245 is characterized for operation at -40 C to +85 C. APPLICATIONS: Hot-swapping, hot-docking Voltage translation (5V to 3.3V) Bus switching and isolation Power conservation Clock gating Logic replacement FUNCTIONAL BLOCK DIAGRAM A0 A1 A2 A3 A4 A5 A6 A7 OE1 B0 B1 B2 B3 B4 B5 B6 B7 A8 A9 A10 A11 A12 A13 A14 A15 OE2 B8 B9 B10 B11 B12 B13 B14 B15 The IDT logo is a registered trademark of Integrated Device Technology, Inc. FEBRUARY 2011 1 c 2011 Integrated Device Technology, Inc. DSC-5724/5

PIN CONFIGURATION NC A0 A1 A2 A3 A4 A5 A6 A7 GND NC A8 A9 A10 A11 A12 A13 A14 A15 GND 1 40 2 39 3 38 4 37 5 36 6 35 7 34 8 33 9 32 10 31 11 30 12 29 13 28 14 27 15 26 16 25 17 24 18 23 19 22 20 21 QVSOP TOP VIEW VCC OE1 B0 B1 B2 B3 B4 B5 B6 B7 Vcc OE2 B8 B9 B10 B11 B12 B13 B14 B15 ABSOLUTE MAXIMUM RATINGS (1) Symbol Description Max Unit VTERM (2) Supply Voltage to Ground 0.5 to +7 V VTERM (3) DC Switch Voltage Vs 0.5 to +7 V VTERM (3) DC Input Voltage VIN 0.5 to +7 V VAC AC Input Voltage (pulse width 20ns) 3 V IOUT DC Output Current 120 ma PMAX Maximum Power Dissipation (TA = 85 C) 0.92 W TSTG Storage Temperature 65 to +150 C 1. Stresses greater than those listed under ABSOLUTE MAXIMUM RATINGS may cause permanent damage to the device. This is a stress rating only and functional operation of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect reliability. 2. Vcc terminals. 3. All terminals except Vcc. CAPACITANCE (TA = +25 C, f = 1.0MHZ, VIN = 0V, VOUT = 0V) Pins Typ. Max. (1) Unit Control Pins 3 5 pf Quickswitch Channels (Switch OFF) 5 7 pf 1. This parameter is measured at characterization but not tested. PIN DESCRIPTION Pin Names I/O Description OE1, OE2 I Bus Enable An I/O Bus A Bn I/O Bus B FUNCTION TABLE (1) OE1 OE2 A0 - A7 A8 - A15 Function H H Z Z Disconnect L H B0 - B7 Z Connect H L Z B8 - B15 Connect L L B0 - B7 B8 - B15 Connect 1. H = HIGH Voltage Level L = LOW Voltage Level Z = High-Impedance 2

DC ELECTRICAL CHARACTERISTICS OVER OPERATING RANGE Following Conditions Apply Unless Otherwise Specified: Industrial: TA = 40 C to +85 C, VCC = 5.0V ±5% Symbol Parameter Test Conditions Min. Typ. (1) Max. Unit VIH Input HIGH Level Guaranteed Logic HIGH for Control Pins 2 V VIL Input LOW Level Guaranteed Logic LOW for Control Pins 0.8 V IIN Input LeakageCurrent (Control Inputs) (2) 0V VIN VCC ±0.01 ±1 μa IOZ Off-State Output Current (Hi-Z) 0V VOUT VCC, Switches OFF ±0.01 ±1 μa RON (3) Switch ON Resistance VCC = Min., VIN = 0V, ION = 30mA 18 23 35 Ω VCC = Min., VIN = 2.4V, ION =15mA 18 25 40 VP Pass Voltage (2) VIN = VCC = 5V, IOUT = -5μA 3.7 4 4.2 V 1. Typical values are at VCC = 5.0V, TA = 25 C. 2. Pass Voltage is guaranteed but not production tested. 3. ROUT changed on March 8, 2002. See rear page for more information. TYPICAL ON RESISTANCE vs VIN AT VCC = 5V 80 RON (ohms) 70 60 50 40 30 20 10 0 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 VIN (Volts) 3

POWER SUPPLY CHARACTERISTICS Symbol Parameter Test Conditions (1) Max. Unit ICCQ Quiescent Power Supply Current VCC = Max., VIN = GND or Vcc, f = 0 6 μa ΔICC Power Supply Current per Control Input HIGH (2) VCC = Max., VIN = 3.4V, f = 0 1.5 ma ICCD Dynamic Power Supply Current per MHz (3) VCC = Max., A and B pins open 0.25 ma/mhz Control Inputs Toggling at 50% Duty Cycle 1. For conditions shown as Min. or Max., use the appropriate values specified under DC Electrical Characteristics. 2. Per TLL driven input (VIN = 3.4V, control inputs only). A and B pins do not contribute to ΔIcc. 3. This current applies to the control inputs only and represents the current required to switch internal capacitance at the specified frequency. The A and B inputs generate no significant AC or DC currents as they transition. This parameter is guaranteed but not production tested. SWITCHING CHARACTERISTICS OVER OPERATING RANGE TA = -40 C to +85 C, VCC = 5.0V ± 5%; CLOAD = 50pF, RLOAD = 500Ω unless otherwise noted. Symbol Parameter Min. (1) Typ. Max. Unit tplh Data Propagation Delay (2,3) 1.25 ns tphl An to/from Bn tpzl Switch Turn-on Delay 0.5 6.6 ns tpzh OE to An/Bn tplz Switch Turn-off Delay (2) 0.5 4.5 ns tphz OE to An/Bn 1. Minimums are guaranteed but not production tested. 2. This parameter is guaranteed but not production tested. 3. The bus switch contributes no propagation delay other than the RC delay of the ON resistance of the switch and the load capacitance. The time constant for the switch alone is of the order of 1.25ns for CL = 50pF. Since this time constant is much smaller than the rise and fall times of typical driving signals, it adds very little propagation delay to the system. Propagation delay of the bus switch, when used in a system, is determined by the driving circuit on the driving side of the switch and its interaction with the load on the driven side. 4

ORDERING INFORMATION QS XXXXX XX Device Type Package X Process X Blank 8 Tube or Tray Tape and Reel Blank Industrial (-40 C to +85 C) Q2G 40-Pin QVSOP - Green 32X2245 High Speed CMOS QuickSwitch Double Width Bus Switch As per PCN L0201-02, the Output Resistance (RON) specifications have changed as of March 8, 2002. The original specifications were: Parameter Description Min. Typ. Max. Unit RON VCC = Min, VIN = 0V, ION = 30mA 20 28 40 Ω VCC = Min, VIN = 2.4V, ION = 15mA 20 35 48 Datasheet Document History 02/16/2011 Pg. 5 Updated the ordering information by removing the "IDT" notation, non RoHS part and by adding Tape and Reel information. CORPORATE HEADQUARTERS for SALES: for Tech Support: 6024 Silver Creek Valley Road 800-345-7015 or 408-284-8200 logichelp@idt.com San Jose, CA 95138 fax: 408-284-2775 www.idt.com 5