Both flash device families have similar features and functions as shown in Table 2-1.

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Transcription:

1. Introduction This application note is a guide for migrating to the Macronix MX30LF1G08AA from the Spansion S34ML01G1 1Gb, 3V, NAND flash memory. The document does not provide detailed information on the individual devices, but highlights the major similarities and differences between them. The comparison covers the general features, performance, command codes and other differences. The information in this document is based on datasheets listed in Section 10. Newer versions of the datasheets may override the contents of this document. 2. Features Both flash device families have similar features and functions as shown in Table 2-1. Table 2-1: Feature Comparison Feature Macronix MX30LF1G08AA Spansion S34ML01G1 Vcc voltage range 2.7V ~ 3.6V 2.7V ~ 3.6V Bus Width x8 x8 Operating Temperature -40 C ~ 85 C -40 C ~ 85 C Interface Standard NAND Interface ONFI 1.0 Standard Block Size 128KB+4KB 128KB+4KB Page Size 2KB+64B 2KB+64B ECC Requirement 1b/528B 1b/528B OTP size - 128KB Guarantee Good blocks at shipping Block 0 Block 0 Unique ID - ONFI standard ID Code C2h/F1h/80h/1Dh 01h/F1h/00h/1Dh ONFI signature - 4Fh/4Eh/46h/49h Data Retention 10 Years 10 Years Package 48-TSOP (12x20mm) 63-VFBGA (9x11mm) 48-TSOP (12x20mm) 63-VFBGA (9x11mm) P/N: AN0257 1

3. Performance Table 3-1 and Table 3-2 show MX30LF1G08AA and S34ML01G1 Read/Write performance. Table 3-1: Read Function Performance (Read Latency time and Sequential Read) Read function Macronix MX30LF1G08AA Spansion S34ML01G1 Read Latency time (tr) 25us (max.) 25us (max.) Sequential Read time (trc) 30ns (min.) 25ns (min.) Table 3-2: Write Function Performance (Program and Erase) Write Function Macronix MX30LF1G08AA Spansion S34ML01G1 Page Program time (tprog) 250us (typ.)/700us (max.) 200us (typ.)/700us (max.) Block Erase time (terase) 2ms (typ.)/3ms (max.) 2ms (typ.)/3ms (max.) NOP 4 (max.) 4 (max.) Write/Erase Cycles* 1 (Endurance) 100,000 100,000 Note: 100K Endurance cycle with ECC protection. 4. DC Characteristics Read/Write power requirements (Table 4-1) and I/O voltage limits (Table 4-2) are similar. Table 4-1: Read / Write Current DC Characteristic Macronix MX30LF1G08AA Spansion S34ML01G1 Sequential Read Current (ICC1) 15mA (typ.)/30ma (max.) 15mA (typ.)/30ma (max.) Program Current (ICC2) 15mA (typ.)/30ma (max.) 15mA (typ.)/30ma (max.) Erase Current (ICC3) 15mA (typ.)/30ma (max.) 15mA (typ.)/30ma (max.) Standby Current CMOS 10uA (typ.)/50ua (max.) 10uA (typ.)/50ua (max.) Table 4-2: Input / Output Voltage DC Characteristic Macronix MX30LF1G08AA Spansion S34ML01G1 Input Low Voltage (VIL) -0.3V (min.) / 0.2 (max.) -0.3V (min.) / 0.2 (max.) Input High Voltage (VIH) 0.8 (min.) / +0.3V (max.) 0.8 (min.) / +0.3V (max.) Output Low Voltage (VOL) 0.4V (max.) 0.4V (max.) Output High Voltage (VOH) 2.4V (min.) 2.4V (min.) P/N: AN0257 2

5. Package Pin/Ball Definition Package physical dimensions are similar to each other. For detailed information, please refer to the individual datasheets. Tables 5-1 and 5-2 show differences in pin assignments between the Macronix and Spansion devices. However because the corresponding pins of the Macronix MX30LF1G08AA are NC (no connect / not bonded), the S34ML01G1 can be compared by the MX30LF1G08AA without pin conflicts. Only 48-TSOP pin #35 (ball G3 on VFBGA) may need special attention because the pin is designated DNU (Do Not Use) on the MX30LF1G08AA-TI. A DNU pin should not be connected to any signal or power trace on the board. Figure 5-1: 48-TSOP (12x20mm) Package and Pin Layout Comparison NC 1 48 NC NC 1 48 VSS*1 NC 2 47 NC NC 2 47 NC NC 3 46 NC NC 3 46 NC NC 4 45 NC NC 4 45 NC NC 5 44 IO7 NC 5 44 I/O7 NC 6 43 IO6 NC 6 43 I/O6 R/B# 7 42 IO5 R/B# 7 42 I/O5 RE# 8 41 IO4 RE# 8 41 I/O4 CE# 9 40 NC CE# 9 40 NC NC 10 39 NC NC 10 39 *1 NC 11 38 NC NC 11 38 NC 12 37 12 37 VSS 13 MX30LF1G08AA 36 VSS VSS 13 S34ML01G1 36 VSS NC 14 35 DNU NC 14 35 NC NC 15 34 NC NC 15 34 *1 CLE 16 33 NC CLE 16 33 NC ALE 17 32 IO3 ALE 17 32 I/O3 WE# 18 31 IO2 WE# 18 31 I/O2 WP# 19 30 IO1 WP# 19 30 I/O1 NC 20 29 IO0 NC 20 29 IO0 NC 21 28 NC NC 21 28 NC NC 22 27 NC NC 22 27 NC NC 23 26 NC NC 23 26 NC NC 24 25 NC NC 24 25 VSS*1 Pin35: DNU (Do Not Use) Note: 1. These pins should be connected to power supply or ground (as designated) following the ONFI specification, however they might not be bonded internally. Macronix is NC for those pinout. It is fine to connect to or VSS Table 5-1: 48-TSOP Package Pin Definition Brand Macronix Spansion Part Name MX30LF1G08AA-TI S34ML01G1 #48 pin NC #39 pin NC VSS #35 pin DNU NC #34 pin NC #25 pin NC VSS P/N: AN0257 3

Figure 5-2: 63-VFBGA (9x11mm) Package and Pin Layout Comparison MX30LF1G08AA S34ML01G1 1 2 3 4 5 6 7 8 9 10 1 2 3 4 5 6 7 8 9 10 A NC NC NC NC A NC NC NC NC B NC NC NC B NC NC NC C WP# ALE VSS CE# WE# R/B# C WP# ALE VSS CE# WE# R/B# D NC RE# CLE NC NC NC D *1 RE# CLE NC NC NC E NC NC NC NC NC NC E NC NC NC NC NC NC F NC NC NC NC NC NC F NC NC NC NC VSS *1 NC G DNU NC NC NC NC NC G NC *1 NC NC NC NC H NC IO0 NC NC NC H NC I/O0 NC NC NC Vcc J NC IO1 NC IO5 IO7 J NC I/O1 NC Vcc I/O5 I/O7 K VSS IO2 IO3 IO4 IO6 VSS K Vss I/O2 I/O3 I/O4 I/O6 Vss L NC NC NC NC L NC NC NC NC M NC NC NC NC M NC NC NC NC G3: DNU (Do Not Use) Note: 1. These pins should be connected to power supply or ground (as designated) following the ONFI specification, however they might not be bonded internally. Macronix is NC for those pinout, and it is fine to connect to Vcc or Vss Table 5-2: 63-VFBGA Package Ball Definition Brand Macronix Spansion Part Name MX30LF1G08AA-XKI S34ML01G1 #D3 ball NC #G3 ball DNU NC #G4 ball NC #F7 ball NC VSS P/N: AN0257 4

6. Command Set Basic command sets and status checking methods are similar. The Read and Write operation commands are identical, but the devices have different command sequences when accessing the cache read function. Additionally, Macronix supports a cache program function and Spansion does not (Table 6-1). Table 6-1: Command Table Command Macronix MX30LF1G08AA Spansion S34ML01G1 1st Cycle 2nd Cycle 1st Cycle 2nd Cycle Random Data Input 85h - 85h - Random Data Output 05h E0h 05h E0h Cache Read Begin 00h 31h 31h - Read Mode 00h 30h 00h 30h Cache Read End 34h - 3Fh - Read ID 90h - 90h - Reset FFh - FFh - Page Program 80h 10h 80h 10h Cache Program 80h 15h - - Block Erase 60h D0h 60h D0h Read Status 70h - 70h - Read Parameter Pg. - - ECh - P/N: AN0257 5

6-2 Status Register When a flash read/program/erase operation is in progress, either the Ready/Busy# pin checking or Status output checking may be used to monitor the operation. Both are standard NAND flash algorithms and can be used for both device families. Table 6-2 shows that Status output content provided by the Read Status command (70h) is compatible. Table 6-2: Status Output Status Output Macronix MX30LF1G08AA Spansion S34ML01G1 SR[0] PGM/ERS status: Pass/Fail PGM/ERS status: Pass/Fail SR[1] Cache Program status: Pass/Fail Cache Program status: Pass/Fail SR[2] Reserved Reserved SR[3] Reserved Reserved SR[4] Reserved Reserved SR[5] PGM/ERS/Read internal controller: Ready/Busy PGM/ERS/Read internal controller: Ready/Busy SR[6] PGM/ERS/Read status: Ready/Busy PGM/ERS/Read status: Ready/Busy SR[7] Write Protect Write Protect P/N: AN0257 6

7. Read ID Command The ID of the Macronix MX30LF1G08AA begins with a one-byte Manufacturer Code followed by a three-byte Device ID. While the same command set is used to read the Manufacturer ID, Device ID, and flash structure, the IDs are different, allowing software to identify the device manufacturer and device type (Table 7-1). Table 7-1: Manufacturer and Device IDs 3 rd Code 4 th Code ID code Macronix MX30LF1G08AA Spansion S34ML01G1 Value C2h/F1h/80h/1Dh 01h/F1h/00h/1Dh 1 st Code Manufacturer Code Manufacturer Code 2 nd Code Device Identifier Device Identifier IO1, IO0 Number of Die per Chip Enable Number of Die per Chip Enable IO3, IO2 Cell Structure Cell Structure IO5, IO4 Number of Simultaneously Number of Simultaneously Programmed Pages Programmed Pages IO6 Interleaved Programming Interleaved Programming Between Multiple Chips Between Multiple Chips IO7 Cache Program Cache Program IO1, IO0 Page Size (exclude Spare Area) Page Size (exclude Spare Area) IO2 Size of Spare Area (Byte per 512Byte) Size of Spare Area (Byte per 512Byte) IO7, IO3 Sequential Read Cycle Time (trc) Serial Access Time (trc) IO5, IO4 Block Size (exclude Spare Area) Block Size (exclude Spare Area) IO6 Organization Organization P/N: AN0257 7

8. Power-Up Timing Macronix and Spansion power-up sequences are similar, but the timing is slightly different. Macronix defines 2.5V (Vth) as the measurement point while Spansion uses 2.7V (Vcc min.) as the measurement point. Check the system timing to determine if adjustments are needed. Table 8-1: Power-Up Timing H/W Timing Characteristic Macronix MX30LF1G08AA Spansion S34ML01G1 Vth (2.5V) to WE# low 1us (min.) N/A Vcc (min.) to WE# low N/A 100us (max.) Vth (2.5V) to R/B# low 1ms (max.) N/A Vcc (min.) to R/B# low N/A 5ms (max.) Vth/Vcc(min. WE# R/B# Figure 8-1: Power-Up Timing 9. Summary Macronix MX30LF1G08AA and Spansion S34ML01G1 NAND have similar features and pinouts. While basic read/program/erase commands are the same, more advanced features such as cache access are implemented slightly differently. Overall, device migration may require minimal or no firmware modifications. P/N: AN0257 8

10. Reference Table 10-1 shows the datasheet versions used for comparison in this application note. For the most current, detailed Macronix specification, please refer to the Macronix Website at http://www.macronix.com Table 10-1: Datasheet Version Datasheet Location Date Issue Revision MX30LF1G08AA - MAR. 28, 2013 Rev. 1.2 S34ML01G1_04G1 - MAR. 7, 2013 Rev. 15 Note: Macronix data sheet is subject to change without notice. 11. Appendix Cross Reference Table 11-1 shows basic part number and package information for the Macronix MX30LF1G08AA and Spansion S34ML01G1 product families. Table 11-1: Part Number Cross Reference Density Macronix Part No. Spansion Part No. Package Dimension MX30LF1G08AA-TI S34ML01G100TFI00 48-TSOP 12x20mm 1Gb MX30LF1G08AA-XKI S34ML01G100BHI00 63-VFBGA 9x11x1.0mm 12. Revision History Revision Description Date 1.0 Initial Release Sep. 11, 2013 P/N: AN0257 9

Except for customized products which have been expressly identified in the applicable agreement, Macronix's products are designed, developed, and/or manufactured for ordinary business, industrial, personal, and/or household applica- tions only, and not for use in any applications which may, directly or indirectly, cause death, personal injury, or severe property damages. In the event Macronix products are used in contradicted to their target usage above, the buyer shall take any and all actions to ensure said Macronix's product qualified for its actual use in accordance with the applicable laws and regulations; and Macronix as well as it s suppliers and/or distributors shall be released from any and all liabil- ity arisen therefrom. Copyright Macronix International Co., Ltd. 2013. All rights reserved, including the trademarks and tradename thereof, such as Macronix, MXIC, MXIC Logo, MX Logo, Integrated Solutions Provider, NBit, Nbit, NBiit, Macronix NBit, elite- Flash, HybridNVM, HybridFlash, XtraROM, Phines, KH Logo, BE-SONOS, KSMC, Kingtech, MXSMIO, Macronix vee, Macronix MAP, Rich Audio, Rich Book, Rich TV, and FitCAM. The names and brands of third party referred thereto (if any) are for identification purposes only. For the contact and order information, please visit Macronix s Web site at: http://www.macronix.com P/N: AN0257 10