FREEING HPC FROM THE DATACENTRE ku:l sistem TM COOLING REDEFINED www.iceotope.com
ku:l sistem removes the need for inefficient air cooling technologies FREEING HPC FROM THE DATACENTRE Iceotope s patented and highly unique immersive liquid- cooling technology provides unrivalled benefits, freeing hpc from the datacentre. At Iceotope we harvest the heat generated by power electronics at source, directly into our engineered fluid; removing the need for inefficient air cooling and its associated infrastructure, cost, space and complexity. DEPLOYMENT SIMPLIFIED BUILT TO LAST RELIABLE AND CONSISTENT SMART CITY READY SUBSTANTIAL SAVINGS
Figure 1 - Cross-section through 1U chassis shows coolant recirculation We have no need for chilled air, fans, CRAC units, hot-aisles, cold-aisles and all the space-hungry infrastructure of traditional air cooling. KEY POINTS Within a sealed, 1U chassis, we create a protective cooling environment for precious electronics, surrounding them with dielectric coolant. Heat is harvested from every component and we deliver the coolest coolant where it is needed the most, minimising coolant volume. A gently recirculating coolant flow inside the sealed chassis enables the harvested heat to be transferred to a building circuit via a plate heat exchanger. Our dielectric coolant is non-oily, non-solvent, non-toxic, leaves no residue and does not affect the electronics. Building coolant can enter the heat exchanger at up to 45oC and exit at up to 50oC. With these high operating temperatures we have no need for chillers and heat can be rejected to ambient using drycoolers, or captured and reused for heating. Using dry-coolers means that our system consumes no water. We have no need for chilled air, fans, CRAC units, hotaisles, cold-aisles and all the space-hungry infrastructure of traditional air cooling. In short, we can take high performance computing out of the datacentre and run it, silently, where it is needed.
Figure 2 - Plan view of 1U chassis shows coolant recirculation
Figure 3 - Shows building blocks of the system
REDUCE COSTS Up to 25% CapEx reduction Up to 75% less floor space Up to 70% energy reduction Up to 35% overall TCO reduction PUE of 1.03 Facility-level cooling water in at up to 45oC Facility-level cooling water out at up to 50oC No requirement for water chillers Losing 5degC from 50oC output water is easily achieved using a cost effective, lightweight dry cooler IMPROVE PERFORMANCE Increase s the life cycle of your IT Maximise the memory bandwidth by 30% Do not suffer from any of the thermal shock or heat fatigue all components are kept at the same temperature Maximises the performance of the CPU allowing them to run at full capacity (boost Turbo mode) without throttling, so more power IT can run at max performance continuously
IMPROVE RELIABILITY Full server heat capture -Total Immersion cooling covers all IT, power and mainboard components Immersion cooling provides a protective environment for the IT Immersion cooling tackles the problem of heat at source IT does not become contaminated with airborne dust System is tier-3 compliant, straight out of the box Twin power feeds can be easily incorporated into chassis design Redundancy for cooling can be easily facilitated at the rack-level with A & B feeds in to the rack-level manifold Failure domain of 1 chassis REDUCE INFRASTRUCTURE Up to 66% reduction in floor space No requirement for additional air handling equipment or air cooling infrastructure (Chillers & CRACS) thus the expensive maintenance and support of such units No requirement for cold isle containment Deploy in the harshest environments, as we use no fans nothing can be contaminated Less Complex Data Centre designs with less building infrastructure, no raised reinforced floors, ducting, or the requirement for false ceilings etc Maximise Data Centre real estate, deploy anywhere, utilise dead space, use un-used brownfield sites Increase density more power per rack up to 40KW per rack Easy implementation into existing air-cooled environment, (chassis, rail kit manifold)
FLEXIBILITY Retrofits into Standard 19 rack Can live alongside existing air-cooled kit 1U chassis can be configured to accommodate a range of IT / server form factors Can cool high-power processors in 1U that would otherwise require 2 or 3U heatsinks if cooled with air IT agnostic ADDITIONAL BENEFITS Silent in operation Highly secure Clean, environmentally friendly dielectric coolant (unlike other solutions on the market) Coolant is Factory Mutual approved Zero flash point Hot output water can be used for heating Easy to incorporate into an existing cabinet Ability to recapture the waste heat, to re-use with-in the building Lightweight heat rejection means less structural load on roof Facility-level cooling system recirculates so it consumes no water Dealing direct with manufacturer 1 point of contact and responsibility We can fit into a customer s supply chain by icensing design
GET IN TOUCH T: +44 (0)114 224 5500 E: info@iceotope.com E: sales@iceotope.com AMP Technology Centre Advanced Manufacturing Park Brunel Way, Sheffield S60 5WG, UK COOLING REDEFINED www.iceotope.com