Product End-of-Life Disassembly Instructions Product Category: Monitors and Displays Marketing Name / Model [List multiple models if applicable.] HP Slate 21-k100/s100 All In One Purpose: The document is intended for use by end-of-life recyclers or treatment facilities. It provides the basic instructions for the disassembly of HP products to remove components and materials requiring selective treatment, as defined by EU directive 2002/96/EC, Waste Electrical and Electronic Equipment (WEEE). 1.0 Items Requiring Selective Treatment 1.1 Items listed below are classified as requiring selective treatment. 1.2 Enter the quantity of items contained within the product which require selective treatment in the right column, as applicable. Quantity Item Description Notes of items included in product Printed Circuit Boards (PCB) or Printed Circuit With a surface greater than 10 sq cm 3 Assemblies (PCA) Batteries All types including standard alkaline and lithium coin 0 or button style batteries Mercury-containing components For example, mercury in lamps, display backlights, scanner lamps, switches, batteries Liquid Crystal Displays (LCD) with a surface greater than 100 sq cm Cathode Ray Tubes (CRT) Includes background illuminated displays with gas discharge lamps Capacitors / condensers (Containing PCB/PCT) 430 Electrolytic Capacitors / Condensers measuring 2 greater than 2.5 cm in diameter or height External electrical cables and cords 1 Gas Discharge Lamps Plastics containing Brominated Flame Retardants 6 weighing > 25 grams (not including PCBs or PCAs already listed as a separate item above) Components and parts containing toner and ink, Include the cartridges, print heads, tubes, vent 2 including liquids, semi-liquids (gel/paste) and toner chambers, and service stations. Components and waste containing asbestos 0 Components, parts and materials containing refractory ceramic fibers 0 EL-MF877-00 Page 1 1
Components, parts and materials containing radioactive substances 2.0 Tools Required List the type and size of the tools that would typically be used to disassemble the product to a point where components and materials requiring selective treatment can be removed. Tool Description Description #1 Crossing Description #2 Crossing Description #3 Description #4 Description #5 0 Tool Size (if applicable) M3 M2 3.0 Product Disassembly Process 3.1 List the basic steps that should typically be followed to remove components and materials requiring selective treatment: 1. Unlock the 2 screws which fix the Bucket 2. I/O cover 3. bezel use hand 4. Camera FFC Cable with hand 5. Unlock the 1 screw and separate Ace tape then take out the camera board 6. Separate the Ace tape on the Bucket left top corner with hand 7. Unlock the 4screws then Speaker and Speaker EMI sheet 8. Separate the antenna from the Bucket and keypad cable 9. Bucket with hand 10. Unlock the 2 screws with #2 screw driver then Keypad PCBA with 11. Separate all Ace tape and electric tape from the panel and cable 12. Take out Touch camera cable backlight cable in the Panel 13. Take out Touch camera cable backlight cable keypad and Camera FFC cable in the chassis 14. chassis from the panel 15. Unlock 3 screw which fix the main chassis then take out the chssis sheet Thermal pad and Mylar 16. Unlock the 9 screws which fix the I/O board. Power board & control board 17. cable which is control board to the main board 18. cable which is I/O board to the main board 19. Get all PCB and wires 3.2 Optional Graphic. If the disassembly process is complex, insert a graphic illustration below to identify the items contained in the product that require selective treatment (with descriptions and arrows identifying locations). Below action which may easily damage product.please notice it Lay the Monitor on the desk, Unlock the 2 screws which fix the stand with the screw driver #1 Crossing Screw Driver EL-MF877-00 Page 2
I/O cover bezel with tool Notice the camera FFC cable Camera FFC Cable with hand Separate one Ace tape and unlock 1 screw then Take out the Camera PCBA with #2 Crossing Screw Driver Separate the Ace tape on the Bucket with hand Speaker with #1 Crossing EL-MF877-00 Page 3
Separate the antenna with Bucket and keypad cable Bucket with hand. Keypad PCBA with #2 Crossing Ace tape and Electric tape on the Cable &panel Take out Touch camera cable and backlight cable in the Panel chassis in the panel EL-MF877-00 Page 4
Unlock 3screw which fix the main chassis then take out the chssis sheet Thermal pad and Mylar #1 Crossing cable which is control board to the main board cable which is I/O board to the main board Get all PCB and wires EL-MF877-00 Page 5