Product Press Release Taipei, Taiwan November, 2007
DDR2 GAMING SERIES BD EVO ONE GeIL is proud to announce the launch of BD (Black Dragon) EVO ONE high performance gaming memory module of the DDR2 Gaming Series. Like its predecessor, the BD EVO ONE delivers the perfect blend of performance, high capacity and stability in its wide range of gaming memory modules for gamer of all levels. Newly added feature is the superior cooling of the BD EVO ONE, which is achieved by GeILs latest *EVO ONE Heat-sink System with MTCD Technology. GeIL has been actively involved in the world of esports for years. Not only is GeIL Involved in various international, regional competitions, sponsoring of game teams, but also interacting with gamers on a deeper level in understanding the real needs of gamers when it comes to gaming memory. GeILs Gaming Series is exactly the result from such experience. The industry s first and leading DDR2 memory module dedicated for gaming, designed to maximize the overall in-game experience with enhanced stability. The BD EVO ONE is available in both Dual Channel and Quad Channel with maximum capacity of up to 8GB per kit. EVO ONE PACKAGING FRONT *see Page 4 & 5 for details on EVO ONE Heat-sink System with MTCD Technology0
0 DDR2 GAMING SERIES BD EVO ONE SPECIFICATIONS: Capacity: 2GB, 4GB, 8GB Dual & Quad Channel Kit Speed: 800 and 1066MHz CAS Latency: 4-4-4-12 and 5-5-5-15 GeIL certified FBGA 64Mx8 and 128Mx8 DDR2 IC Chips 240pin, Non-ECC, Un-buffered DIMM 8-Layered Custom Black Dragon PCB Heat Spreader: EVO ONE Heat-sink System Working Voltage: - 800MHz CL5 1.8V - 800MHz CL4 1.9~2.0V - 1066MHz CL5 2.1~2.3V Retail Package GeIL Lifetime Warranty CAPACITY CHANNEL PRODUCT/SPEED SPD SKU 2 GB (1GB x 2) DUAL PC2 6400 800Mhz BD EVO ONE 5-5-5-15 GE22GB800C5DC 4 GB (1GB x 4) QUAD PC2 6400 800Mhz BD EVO ONE 5-5-5-15 GE24GB800C5QC 4 GB (2GB x 2) DUAL PC2 6400 800Mhz BD EVO ONE 5-5-5-15 GE24GB800C5DC 8 GB (2GB x 4) QUAD PC2 6400 800Mhz BD EVO ONE 5-5-5-15 GE28GB800C5QC 2 GB (1GB x 2) DUAL PC2 6400 800Mhz BD EVO ONE 4-4-4-12 GE22GB800C4DC 4 GB (1GB x 4) QUAD PC2 6400 800Mhz BD EVO ONE 4-4-4-12 GE24GB800C4QC 4 GB (2GB x 2) DUAL PC2 6400 800Mhz BD EVO ONE 4-4-4-12 GE24GB800C4DC 8 GB (2GB x 4) QUAD PC2 6400 800Mhz BD EVO ONE 4-4-4-12 GE28GB800C4QC 2 GB (1GB x 2) DUAL PC2 8500 1066MHz BD EVO ONE 5-5-5-15 GE22GB1066C5DC 4 GB (1GB x 4) QUAD PC2 8500 1066MHz BD EVO ONE 5-5-5-15 GE24GB1066C5QC 4 GB (2GB x 2) DUAL PC2 8500 1066MHz BD EVO ONE 5-5-5-15 GE24GB1066C5DC 8 GB (2GB x 4) QUAD PC2 8500 1066MHz BD EVO ONE 5-5-5-15 GE28GB1066C5QC(TBA)
EVO ONE Heat Sink System with MTCD Technology Thermal Conduction and Dissipation Path AIRFLOW FROM THE CHASSIS THROUGH WIND TUNNEL Heat generated by the IC is efficiently being conducted through the heat sink and heat pipe to the copper fins, where heat is successfully dissipated. Thus leaving the IC cool through nature convection. IC on memory module without the EVO ONE Heat Sink System suffers from clogging up of heat thus affect memory performance A lateral view of the Quad Channel EVO ONE lined up as it would on a mother board. The airflow inside the chassis will pass through the copper fin openings of the EVO ONE modules, creating a wind tunnel effect. Taking away the heat dissipated from the EVO ONE Heat Sink System.
EVO ONE Heat Sink System with MTCD Technology MTCD Maximized Thermal Conduction & Dissipation The EVO ONE Heat Sink System with MTCD (Maximized Thermal Conduction & Dissipation) Technology is the latest heat sink solution by GeIL. The EVO ONE Heat Sink System is composed of high thermal conductive aluminum (237 W/(m K) at 300 K) heat sink, copper (401 W/(m K) at 300 K) heat pipe and fins. MTCD Technology The maximized-flat-surface heat sink is made from aluminum, which is the base contacting the IC chips through the enhanced thermal adhesive. The higher thermal energy (heat) generated from the IC chips is efficiently transferred to the lower temperature heat sink, which has a much greater heat capacity. This rapid transfer of thermal energy quickly brings the IC into thermal equilibrium with the heat sink, thus lowering the temperature of the working IC chips. The thermal energy on the heat sink is then transferred to the copper heat pipe, a hollow tube containing water. As the liquid inside the heat pipe carry heat to the cool end, where it condenses to the center of the heat pipe under capillary force. There, the heat is transferred to an array of copper fins located in the center of the heat pipe. The array of fins with its maximized surface area contacting the air is where high coefficient heat dissipation takes place. While the EVO ONE Heat Sink System is static, the airflow created by the fans inside the computer chassis will aid the heat sink by providing increased airflow over and through the heat sink thus maximize heat dissipation. Thus leaving the working IC cool through natural convection. The EVO ONE Heat Sink System with MTCD Technology provides highly efficient cooling solution for performance memory modules with no extra power cable, water tube, electric fans and maintenance. Conserving your system power for maximum performance!