NXP AN11528 sensor Application note

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NXP sensor Application note http://www.manuallib.com/nxp/an11528-sensor-application-note.html This application note will illustrate the new features of the LPC11U6x device family compared to the LPC11U3x device family. ManualLib.com collects and classifies the global product instrunction manuals to help users access anytime and anywhere, helping users make better use of products. http://www.manuallib.com

Rev. 1 11 March 2014 Application note Document information Info Content Keywords LPC11U67JBD48 LPC11U68JBD64 LPC11U68JBD100 LPC11U6x Abstract This application note will illustrate the new features of the LPC11U6x device family compared to the LPC11U3x device family.

Revision history Rev Date Description 1 20140311 Initial version. Contact information For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: salesaddresses@nxp.com All information provided in this document is subject to legal disclaimers. NXP B.V. 2014. All rights reserved. Application note Rev. 1 11 March 2014 2 of 11

1. Introduction 2. Processor (M0+, MTB) 3. Memory size The LPC11Uxx are an ARM Cortex-M0/M0+ based 1, low-cost 32-bit MCU family, designed for 8/16-bit microcontroller applications, offering performance, low power, simple instruction set and memory addressing together with reduced code size compared to existing 8/16-bit architectures. The LPC11U3x and LPC11U6x are two series in the LPC11Uxx family that stand out due to their feature set, with the LPC11U6x being the latest series. An important feature common to both the series is that they are equipped with highly flexible and configurable Full Speed USB 2.0 device controllers. The LPC11U6x has some new features compared to the LPC11U3x; the details of the new features are described in the following sections: Processor (M0+, MTB) Memory size Operating temperature range Package and pin out (GPIO, Glitch free pads, XTAL w/gpio, RSTOUT) I2C interface MinUART (wake up feature) USB (circuit design notice, Low-speed mode) 12-bit A/D converter State Configurable Timers (SCT) DMA controller Real-Time Clock (RTC) On-chip temperature sensor Cyclic Redundancy Check (CRC) engine The LPC11U3x is integrated with an ARM Cortex-M0 processor, whereas the LPC11U6x is integrated with an ARM Cortex-M0+ processor with the addition of the following features: Two-stage pipeline Single-cycle multiplier Fast single-cycle I/O port External debug request input is supported from MTB (Micro Trace Buffer) The LPC11U3x supports up to 128 kb of on-chip flash program memory and up to 12 kb of SRAM data memory. The LPC11U6x supports up to 256 kb of on-chip flash program memory, up to 32 kb of SRAM data memory (SRAM0) with two additional SRAM blocks of 2 kb each (SRAM1, USB SRAM). 1. LPC11U1X/2X/3X M0-based, LPC11U6X M0+ based. All information provided in this document is subject to legal disclaimers. NXP B.V. 2014. All rights reserved. Application note Rev. 1 11 March 2014 3 of 11

4. Operating temperature range The operating temperature range of LPC11U3x is 40 C to +85 C. The operating temperature range of LPC11U6x is 40 C to +105 C. 5. Package and pin out (GPIO, glitch-free pads, XTAL w/gpio, RSTOUT) 6. I2C interface 5.1 LPC11U3x The LPC11U3x is available in LQFP64, LQFP48, TFBGA48, and HVQFN33 packages and has up to 54 General Purpose I/O (GPIO) pins. Select pins (pins PIO0_22, PIO0_23, and PIO0_11 to PIO0_16) provide the option of turning on or off a 10 ns input glitch filter. The glitch filter is turned on by default. The RESET pin has a 20 ns glitch filter (not configurable). XTALIN and XTALOUT are provided with dedicated pins. If an external crystal is not used, these two pins cannot be used as GPIOs. 5.2 LPC11U6x The LPC11U6x is available in LQFP48, LQFP64, and LQFP100 packages and has up to 80 General-Purpose I/O (GPIO) pins. All GPIO pins are equipped with a programmable digital glitch filter. XTALIN pin is shared with GPIO PIO2_0 and XTALOUT pin is shared with GPIO PIO2_1. An RSTOUT pin is added to indicate the internal reset status. The LPC11U3x contains one I2C interface. LPC11U6x contains two I2C interfaces. I2C0 is the same as LPC11U3x and supports fast mode plus with bit rates up 1Mbits/s. I2C1 uses standard digital pins. The I2C1 interface supports fast mode with bit rates up to 400 Kbits/s. 7. MinUART (wake up feature) The LPC11U3x contains one USART. The LPC11U6x contains five USARTs. USART0 is the same as LPC11U3x. USART1 to USART4 are MinUART which use a different register interface to achieve the same UART functionality as UART0 except for modem and smart card control. USART3 and USART4 are available only on part LPC11U68JBD100. Interrupts generated by the USART1/2/3/4 peripherals can wake up the processor from Deep-sleep and power-down modes if the USART is in synchronous mode or the 32 khz mode is enabled or the CTS interrupt is enabled. This wake-up mechanism is not available with USART0. All information provided in this document is subject to legal disclaimers. NXP B.V. 2014. All rights reserved. Application note Rev. 1 11 March 2014 4 of 11

8. USB (circuit design notice, Low-speed mode) Compared to the LPC11U3x, the LPC11U6x USB controller has some new features: Software can control the USB_CONNECT signal by setting the DCON bit in the DEVCMDSTAT register. There is no need to have a dedicated USB_CONNECT pin on the chip. Supports SoftConnect through internal 1.5 kω pull-up resistor between USB_DP and VDD. USB pads include internal SoftConnect and 33 Ω series termination resistor for USB_DP and USB_DM signal lines. Support for XTAL-less low-speed USB (1.5 Mbit/s) USB-IF Full/Low Speed Certified MCU with USB drivers in ROM. 8.1 USB interface circuit design reference Typically, the LPC11U3x USB circuit (self-powered for example) can be designed as: Fig 1. USB interface on a self-powered device (for 11U3x) All information provided in this document is subject to legal disclaimers. NXP B.V. 2014. All rights reserved. Application note Rev. 1 11 March 2014 5 of 11

The LPC11U6x USB circuit design is changed to Fig 2 for self-powered device and Fig 3 for bus-powered device: Fig 2. USB interface on a self-powered device where USB_VBUS = 5 V Fig 3. USB interface on a bus-powered device As the 33 Ω termination resistor and the 1.5k Ω pull up resistor are integrated on the chip, user does not need to provide external termination resistor and 1.5k Ω pull up resistor. This reduces BOM and hardware cost. For more details on the LPC11U6x USB interface design, refer to chapter 14.2 - Suggested USB interface solutions on the LPC11U6x datasheet. All information provided in this document is subject to legal disclaimers. NXP B.V. 2014. All rights reserved. Application note Rev. 1 11 March 2014 6 of 11

8.2 USB low-speed operation The USB device controller can be used in low-speed mode supporting 1.5 Mbit/s data exchange with a USB host controller. To operate in low-speed mode, change the board connections as follows: Connect USB_DP to the D pin of the connector Connect USB_DM to the D+ pin of the connector Use the IRC as clock source for the USB PLL to generate 48 MHz, then set the USB clock divider USBCLKDIV to 8 for a 6 MHz USB clock. Fig 4. USB interface for low-speed, XTAL-less operation 9. 12-bit A/D converter External 10 Ω resistors are recommended in low-speed mode to reduce overshoot and accommodate for 5 m cable length required for USB-IF testing. For design details on USB Low-speed operation, refer to chapter 14.2.1 - USB Lowspeed operation on the LPC11U6x datasheet. The LPC11U3x has a 10-bit ADC with a maximum 10-bit conversion rate of 400 ksamples/s. For LPC11U3x ADC, the analog voltage supply and ADC reference voltage shared with VDD. The LPC11U6x has a 12-bit ADC with a maximum 12-bit conversion rate of 2 MSamples/s (VDD = 2.7 V to 3.6 V) or 1 MSamples/s (VDD = 2.4 V to 2.7 V). The LPC11U6x ADC uses dedicated pins for Analog voltage supply (VDDA) and ADC reference voltage (VREFP, VREFN).The A/D converter includes a built-in, hardware selfcalibration mode. In order to achieve the specified ADC accuracy, the A/D converter must be recalibrated, at a minimum, following every chip reset before initiating normal ADC operation. All information provided in this document is subject to legal disclaimers. NXP B.V. 2014. All rights reserved. Application note Rev. 1 11 March 2014 7 of 11

10. State Configurable Timers (SCT) 11. DMA controller 12. Real-Time Clock (RTC) LPC11U6x contains two State Configurable Timers (SCTimer0/PWM and SCTimer1/PWM). The state configurable timer can create timed output signals such as PWM outputs triggered by programmable events. Combinations of events can be used to define timer states. The SCTimer/PWM can control the timer operations, capture inputs, change states and toggle outputs triggered entirely only by events without CPU intervention. If multiple states are not implemented, the SCTimer/PWM simply operates as one 32-bit or two 16-bit timers with match, capture and PWM functions. Each SCTimer/PWM supports: 4 inputs, 4 outputs, 6 events, 8 states and 5 capture/match registers. LPC11U3x does not contain a State Configurable Timer. LPC11U6x is integrated with a DMA controller. The DMA controller can access all memories and the USART and SSP peripherals using DMA requests. DMA transfers can also be triggered by internal events like the ADC interrupts, timer match outputs, the pin interrupts (PINT0 and PINT1) and the SCTimer DMA requests. LPC11U6x contains a Real-Time Clock (RTC) with 32 khz oscillator. The RTC resides in a separate always-on voltage domain with battery back-up. The RTC uses an independent oscillator, also located in the always-on voltage domain. 13. On-chip temperature sensor LPC11U6x contains an on-chip temperature sensor. The temperature sensor transducer uses an intrinsic p-n junction diode reference and outputs a CTAT voltage (Complement to Absolute Temperature). The output voltage varies inversely with device temperature with an absolute accuracy of better than 5 C over the full temperature range ( 40 C to +105 C). After power-up and after switching the input channels of the ADC, the temperature sensor output must be allowed to settle to its stable value before it can be used as an accurate ADC input. For an accurate measurement of the temperature sensor by the ADC, the ADC must be configured in single-channel burst mode. The last value of a nine-conversion (or more) burst provides an accurate result. 14. Cyclic Redundancy Check (CRC) engine A CRC engine is available on the LPC11U6x. The Cyclic Redundancy Check generator with programmable polynomial settings supports several CRC standards commonly used (CRC-CCITT, CRC-16, and CRC-32). The LPC11U3x does not have a CRC engine. All information provided in this document is subject to legal disclaimers. NXP B.V. 2014. All rights reserved. Application note Rev. 1 11 March 2014 8 of 11

15. Legal information 15.1 Definitions Draft The document is a draft version only. The content is still under internal review and subject to formal approval, which may result in modifications or additions. NXP Semiconductors does not give any representations or warranties as to the accuracy or completeness of information included herein and shall have no liability for the consequences of use of such information. 15.2 Disclaimers Limited warranty and liability Information in this document is believed to be accurate and reliable. However, NXP Semiconductors does not give any representations or warranties, expressed or implied, as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP Semiconductors takes no responsibility for the content in this document if provided by an information source outside of NXP Semiconductors. In no event shall NXP Semiconductors be liable for any indirect, incidental, punitive, special or consequential damages (including - without limitation - lost profits, lost savings, business interruption, costs related to the removal or replacement of any products or rework charges) whether or not such damages are based on tort (including negligence), warranty, breach of contract or any other legal theory. Notwithstanding any damages that customer might incur for any reason whatsoever, NXP Semiconductors aggregate and cumulative liability towards customer for the products described herein shall be limited in accordance with the Terms and conditions of commercial sale of NXP Semiconductors. Right to make changes NXP Semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice. This document supersedes and replaces all information supplied prior to the publication hereof. Suitability for use NXP Semiconductors products are not designed, authorized or warranted to be suitable for use in life support, life-critical or safety-critical systems or equipment, nor in applications where failure or malfunction of an NXP Semiconductors product can reasonably be expected to result in personal injury, death or severe property or environmental damage. NXP Semiconductors and its suppliers accept no liability for inclusion and/or use of NXP Semiconductors products in such equipment or applications and therefore such inclusion and/or use is at the customer s own risk. Applications Applications that are described herein for any of these products are for illustrative purposes only. NXP Semiconductors makes no representation or warranty that such applications will be suitable for the specified use without further testing or modification. Customers are responsible for the design and operation of their applications and products using NXP Semiconductors products, and NXP Semiconductors accepts no liability for any assistance with applications or customer product design. It is customer s sole responsibility to determine whether the NXP Semiconductors product is suitable and fit for the customer s applications and products planned, as well as for the planned application and use of customer s third party customer(s). Customers should provide appropriate design and operating safeguards to minimize the risks associated with their applications and products. NXP Semiconductors does not accept any liability related to any default, damage, costs or problem which is based on any weakness or default in the customer s applications or products, or the application or use by customer s third party customer(s). Customer is responsible for doing all necessary testing for the customer s applications and products using NXP Semiconductors products in order to avoid a default of the applications and the products or of the application or use by customer s third party customer(s). NXP does not accept any liability in this respect. Export control This document as well as the item(s) described herein may be subject to export control regulations. Export might require a prior authorization from competent authorities. Evaluation products This product is provided on an as is and with all faults basis for evaluation purposes only. NXP Semiconductors, its affiliates and their suppliers expressly disclaim all warranties, whether express, implied or statutory, including but not limited to the implied warranties of noninfringement, merchantability and fitness for a particular purpose. The entire risk as to the quality, or arising out of the use or performance, of this product remains with customer. In no event shall NXP Semiconductors, its affiliates or their suppliers be liable to customer for any special, indirect, consequential, punitive or incidental damages (including without limitation damages for loss of business, business interruption, loss of use, loss of data or information, and the like) arising out the use of or inability to use the product, whether or not based on tort (including negligence), strict liability, breach of contract, breach of warranty or any other theory, even if advised of the possibility of such damages. Notwithstanding any damages that customer might incur for any reason whatsoever (including without limitation, all damages referenced above and all direct or general damages), the entire liability of NXP Semiconductors, its affiliates and their suppliers and customer s exclusive remedy for all of the foregoing shall be limited to actual damages incurred by customer based on reasonable reliance up to the greater of the amount actually paid by customer for the product or five dollars (US$5.00). The foregoing limitations, exclusions and disclaimers shall apply to the maximum extent permitted by applicable law, even if any remedy fails of its essential purpose. 15.3 Trademarks Notice: All referenced brands, product names, service names and trademarks are property of their respective owners. All information provided in this document is subject to legal disclaimers. NXP B.V. 2014. All rights reserved. Application note Rev. 1 11 March 2014 9 of 11

16. List of figures Fig 1. USB interface on a self-powered device (for 11U3x)... 5 Fig 2. USB interface on a self-powered device where USB_VBUS = 5 V... 6 Fig 3. USB interface on a bus-powered device... 6 Fig 4. USB interface for low-speed, XTAL-less operation... 7 All information provided in this document is subject to legal disclaimers. NXP B.V. 2014. All rights reserved. Application note Rev. 1 11 March 2014 10 of 11

17. Contents 1. Introduction... 3 2. Processor (M0+, MTB)... 3 3. Memory size... 3 4. Operating temperature range... 4 5. Package and pin out (GPIO, glitch-free pads, XTAL w/gpio, RSTOUT)... 4 5.1 LPC11U3x... 4 5.2 LPC11U6x... 4 6. I2C interface... 4 7. MinUART (wake up feature)... 4 8. USB (circuit design notice, Low-speed mode). 5 8.1 USB interface circuit design reference... 5 8.2 USB low-speed operation... 7 9. 12-bit A/D converter... 7 10. State Configurable Timers (SCT)... 8 11. DMA controller... 8 12. Real-Time Clock (RTC)... 8 13. On-chip temperature sensor... 8 14. Cyclic Redundancy Check (CRC) engine... 8 15. Legal information... 9 15.1 Definitions... 9 15.2 Disclaimers... 9 15.3 Trademarks... 9 16. List of figures... 10 17. Contents... 11 Please be aware that important notices concerning this document and the product(s) described herein, have been included in the section 'Legal information'. NXP B.V. 2014. All rights reserved. For more information, visit: http://www.nxp.com For sales office addresses, please send an email to: salesaddresses@nxp.com Date of release: 11 March 2014 Document identifier: