ESD protection for ultra high-speed interfaces

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XSON7 Rev. 1 19 August 214 Product data sheet 1. Product profile 1.1 General description The device is designed to protect high-speed interfaces such as SuperSpeed and Hi - Speed USB combination, Secure Digital (SD) card 3. and Thunderbolt interfaces against ElectroStatic Discharge (ESD). The device includes six high-level ESD protection diode structures for ultra high-speed signal lines and is encapsulated in a DFN2111-7 (SOT1358-1) leadless ultra small Surface-Mounted Device (SMD) plastic package. All signal lines are protected by a special diode structure offering ultra low line capacitance of only.27 pf. These diodes utilize a unique snap-back structure in order to provide protection to downstream components from ESD voltages up to 1 kv contact exceeding IEC 61-4-2, level 4. 1.2 Features and benefits System ESD protection for USB 2. and USB 3. combination, SD card 3. and Thunderbolt interfaces All signal lines with integrated rail-to-rail clamping diodes for downstream ESD protection of 1 kv exceeding IEC 61-4-2, level 4 Matched.5 mm trace spacing Signal lines with.5 pf matching capacitance between signal pairs Line capacitance of only.27 pf for each channel Design-friendly pass-through signal routing 1.3 Applications The device is designed for high-speed receiver and transmitter port protection: Portable and wearable devices Smartphones and tablet PCs TVs and monitors DVD recorders and players Notebooks, main board graphic cards and ports Set-top boxes and game consoles

2. Pinning information Table 1. Pinning Pin Symbol Description Simplified outline Graphic symbol 1 CH1 channel 1 ESD protection 2 GND ground [1] 1 2 3 4 5 6 7 1 3 CH2 channel 2 ESD protection 7 4 CH3 channel 3 ESD protection 2 5 CH4 channel 4 ESD protection 6 6 CH5 channel 5 ESD protection 3 aaa-1349 7 CH6 channel 6 ESD protection 5 4 Transparent top view 3. Ordering information [1] Any pin can be chosen for ground connection; one pin must be connected to ground. 4. Marking Table 2. Ordering information Type number Package Name Description Version DFN2111-7 plastic extremely thin small outline package; no leads; 7 terminals; body 1.1 2.1.5 mm SOT1358-1 Table 3. Marking codes Type number Marking code 3T 5. Limiting values Table 4. Limiting values In accordance with the Absolute Maximum Rating System (IEC 6134). Symbol Parameter Conditions Min Max Unit V I input voltage 5.5 +5.5 V V ESD electrostatic discharge IEC 61-4-2, level 4 [1] voltage contact discharge 1 +1 kv air discharge 15 +15 kv T amb ambient temperature 4 +85 C T stg storage temperature 55 +125 C [1] All pins to ground. All information provided in this document is subject to legal disclaimers. NXP Semiconductors N.V. 214. All rights reserved. Product data sheet Rev. 1 19 August 214 2 of 13

6. Characteristics Table 5. Characteristics T amb =25 C unless otherwise specified. Symbol Parameter Conditions Min Typ Max Unit V BR breakdown voltage I I = 1 ma 6 - - V I LR reverse leakage current per channel; V I = 3 V - 1 1 na C line line capacitance f = 1 MHz; V I =V [1] -.27.35 pf C line line capacitance f=1mhz; V I =V [1] -.3.5 pf difference r dyn dynamic resistance surge [2] [1] This parameter is guaranteed by design. [2] According to IEC 61-4-5, pulse time t p = 8/2 s. [3] 1 ns Transmission Line Pulse (TLP); 5 ; pulser at 8 ns. positive transient -.5 - negative transient -.5 - TLP [3] positive transient -.6 - negative transient -.6 - V CL clamping voltage I PP =3.5A [2] positive transient - 4.8 - V I PP = 3.5 A [2] negative transient - 4.8 - V All information provided in this document is subject to legal disclaimers. NXP Semiconductors N.V. 214. All rights reserved. Product data sheet Rev. 1 19 August 214 3 of 13

.5 aaa-1355 1.2 aaa-1356 S 21dd (db) a -.5.8-1.5.4-2.5-3.5 1 6 1 7 1 8 1 9 1 1-6 -2 2 6 f (Hz) V I (V) differential mode a = C line --------------------------------- C line VI = V Fig 1. Insertion loss; typical values Fig 2. Relative capacitance as a function of input voltage; typical values aaa-1357 S 21dd (db) -2-4 -6-8 1 6 1 7 1 8 1 9 1 1 f (Hz) Fig 3. normalized to 1 Crosstalk; typical values All information provided in this document is subject to legal disclaimers. NXP Semiconductors N.V. 214. All rights reserved. Product data sheet Rev. 1 19 August 214 4 of 13

aaa-14154 Fig 4. Data rate: 5 Gbit/s Vertical scale = 16 mv/div Horizontal scale = 2 ps/div USB 3. eye diagram Printed-Circuit Board (PCB) with aaa-14155 Fig 5. Data rate: 5 Gbit/s Vertical scale = 162.5 mv/div Horizontal scale = 2 ps/div USB 3. eye diagram PCB without (reference) All information provided in this document is subject to legal disclaimers. NXP Semiconductors N.V. 214. All rights reserved. Product data sheet Rev. 1 19 August 214 5 of 13

4 aaa-1358 aaa-1359 I (A) I (A) 3-1 2-2 1-3 2 4 6 V CL (V) -4-6 -4-2 V CL (V) IEC 61-4-5; t p =8/2 s; positive pulse IEC 61-4-5; t p =8/2 s; negative pulse Fig 6. Dynamic resistance with positive clamping; typical values Fig 7. Dynamic resistance with negative clamping; typical values 14 I (A) 12 aaa-1351 I (A) -2 aaa-13511 1-4 8-6 6-8 4-1 2-12 4 8 12 V CL (V) -14-12 -8-4 V CL (V) t p = 1 ns; Transmission Line Pulse (TLP) t p = 1 ns; Transmission Line Pulse (TLP) Fig 8. Dynamic resistance with positive clamping; typical values Fig 9. Dynamic resistance with negative clamping; typical values The device uses an advanced clamping structure showing a negative dynamic resistance. This snap-back behavior strongly reduces the clamping voltage to the system behind the ESD protection during an ESD event. Do not connect unlimited DC current sources to the data lines to avoid keeping the ESD protection device in snap-back state after exceeding breakdown voltage (due to an ESD pulse for instance). All information provided in this document is subject to legal disclaimers. NXP Semiconductors N.V. 214. All rights reserved. Product data sheet Rev. 1 19 August 214 6 of 13

7. Application information The device is designed to provide high level ESD protection for high-speed serial data buses such as HDMI, DisplayPort, esata and LVDS data lines. When designing the Printed-Circuit Board (PCB), give careful consideration to impedance matching and signal coupling. Do not connect the signal lines to unlimited current sources such as battery. ESD protection schematic diagram for USB 3. or USB 2. interface is shown on Figure 1. V BUS V BUS USB 3. controller Rx+ Rx- GND PESD5VS1USF Rx+ Rx- GND USB 3. connector D+ D- D+ D- Tx+ Tx+ Tx- Tx- 5 4 3 6 2 1 7 aaa-13549 Fig 1. Any pin can be chosen for ground connection; one pin must be connected to ground. Demo PCB of ESD protection for USB 3. or USB 2. interfaces using All information provided in this document is subject to legal disclaimers. NXP Semiconductors N.V. 214. All rights reserved. Product data sheet Rev. 1 19 August 214 7 of 13

A basic application diagram for ESD protection of SD card interface is shown on Figure 11. GND can be connected to pin 2 for easy routing or to any other rail-to-rail structure. VCC DAT1 DAT SD card application GND CLK SD memory card VCC (V SD ) PESD5VS1USF CMD DAT3/ CD DAT 1 7 6 3 2 5 4 aaa-13548 Fig 11. Any pin can be chosen for ground connection; one pin must be connected to ground. Application diagram of SD card ESD protection using 8. Package outline.5 max.5 max 1.2 1..1 7 1.5 2.2 2.5 1. 1.5 5 4.127 Dimensions in mm.5.3.2 min.25.15 14-5-7 Fig 12. Package outline DFN2111-7 (SOT1358-1) All information provided in this document is subject to legal disclaimers. NXP Semiconductors N.V. 214. All rights reserved. Product data sheet Rev. 1 19 August 214 8 of 13

9. Soldering Footprint information for reflow soldering of DFN2111-7 (SOT1358-1) package SOT1358-1 1.56.2.63 (7x).5 1.7.5 2.3.2.3.3 (7x).2 (7x).53 (7x).3 1.36 occupied area solder resist solder lands solder paste Dimensions in mm Issue date 14-4-24 14-5-7 sot1358-1_fr Fig 13. Reflow soldering footprint DFN2111-7 (SOT1358-1) All information provided in this document is subject to legal disclaimers. NXP Semiconductors N.V. 214. All rights reserved. Product data sheet Rev. 1 19 August 214 9 of 13

1. Revision history Table 6. Revision history Document ID Release date Data sheet status Change notice Supersedes v.1 214819 Product data sheet - - All information provided in this document is subject to legal disclaimers. NXP Semiconductors N.V. 214. All rights reserved. Product data sheet Rev. 1 19 August 214 1 of 13

11. Legal information 11.1 Data sheet status Document status [1][2] Product status [3] Definition Objective [short] data sheet Development This document contains data from the objective specification for product development. Preliminary [short] data sheet Qualification This document contains data from the preliminary specification. Product [short] data sheet Production This document contains the product specification. [1] Please consult the most recently issued document before initiating or completing a design. [2] The term short data sheet is explained in section Definitions. [3] The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status information is available on the Internet at URL http://www.nxp.com. 11.2 Definitions Draft The document is a draft version only. The content is still under internal review and subject to formal approval, which may result in modifications or additions. NXP Semiconductors does not give any representations or warranties as to the accuracy or completeness of information included herein and shall have no liability for the consequences of use of such information. Short data sheet A short data sheet is an extract from a full data sheet with the same product type number(s) and title. A short data sheet is intended for quick reference only and should not be relied upon to contain detailed and full information. For detailed and full information see the relevant full data sheet, which is available on request via the local NXP Semiconductors sales office. In case of any inconsistency or conflict with the short data sheet, the full data sheet shall prevail. Product specification The information and data provided in a Product data sheet shall define the specification of the product as agreed between NXP Semiconductors and its customer, unless NXP Semiconductors and customer have explicitly agreed otherwise in writing. In no event however, shall an agreement be valid in which the NXP Semiconductors product is deemed to offer functions and qualities beyond those described in the Product data sheet. 11.3 Disclaimers Limited warranty and liability Information in this document is believed to be accurate and reliable. However, NXP Semiconductors does not give any representations or warranties, expressed or implied, as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP Semiconductors takes no responsibility for the content in this document if provided by an information source outside of NXP Semiconductors. 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This document supersedes and replaces all information supplied prior to the publication hereof. Suitability for use NXP Semiconductors products are not designed, authorized or warranted to be suitable for use in life support, life-critical or safety-critical systems or equipment, nor in applications where failure or malfunction of an NXP Semiconductors product can reasonably be expected to result in personal injury, death or severe property or environmental damage. NXP Semiconductors and its suppliers accept no liability for inclusion and/or use of NXP Semiconductors products in such equipment or applications and therefore such inclusion and/or use is at the customer s own risk. Applications Applications that are described herein for any of these products are for illustrative purposes only. NXP Semiconductors makes no representation or warranty that such applications will be suitable for the specified use without further testing or modification. Customers are responsible for the design and operation of their applications and products using NXP Semiconductors products, and NXP Semiconductors accepts no liability for any assistance with applications or customer product design. It is customer s sole responsibility to determine whether the NXP Semiconductors product is suitable and fit for the customer s applications and products planned, as well as for the planned application and use of customer s third party customer(s). Customers should provide appropriate design and operating safeguards to minimize the risks associated with their applications and products. NXP Semiconductors does not accept any liability related to any default, damage, costs or problem which is based on any weakness or default in the customer s applications or products, or the application or use by customer s third party customer(s). Customer is responsible for doing all necessary testing for the customer s applications and products using NXP Semiconductors products in order to avoid a default of the applications and the products or of the application or use by customer s third party customer(s). NXP does not accept any liability in this respect. Limiting values Stress above one or more limiting values (as defined in the Absolute Maximum Ratings System of IEC 6134) will cause permanent damage to the device. Limiting values are stress ratings only and (proper) operation of the device at these or any other conditions above those given in the Recommended operating conditions section (if present) or the Characteristics sections of this document is not warranted. Constant or repeated exposure to limiting values will permanently and irreversibly affect the quality and reliability of the device. Terms and conditions of commercial sale NXP Semiconductors products are sold subject to the general terms and conditions of commercial sale, as published at http://www.nxp.com/profile/terms, unless otherwise agreed in a valid written individual agreement. In case an individual agreement is concluded only the terms and conditions of the respective agreement shall apply. NXP Semiconductors hereby expressly objects to applying the customer s general terms and conditions with regard to the purchase of NXP Semiconductors products by customer. No offer to sell or license Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights. All information provided in this document is subject to legal disclaimers. NXP Semiconductors N.V. 214. All rights reserved. Product data sheet Rev. 1 19 August 214 11 of 13

Export control This document as well as the item(s) described herein may be subject to export control regulations. Export might require a prior authorization from competent authorities. Quick reference data The Quick reference data is an extract of the product data given in the Limiting values and Characteristics sections of this document, and as such is not complete, exhaustive or legally binding. Non-automotive qualified products Unless this data sheet expressly states that this specific NXP Semiconductors product is automotive qualified, the product is not suitable for automotive use. It is neither qualified nor tested in accordance with automotive testing or application requirements. NXP Semiconductors accepts no liability for inclusion and/or use of non-automotive qualified products in automotive equipment or applications. In the event that customer uses the product for design-in and use in automotive applications to automotive specifications and standards, customer (a) shall use the product without NXP Semiconductors warranty of the product for such automotive applications, use and specifications, and (b) whenever customer uses the product for automotive applications beyond NXP Semiconductors specifications such use shall be solely at customer s own risk, and (c) customer fully indemnifies NXP Semiconductors for any liability, damages or failed product claims resulting from customer design and use of the product for automotive applications beyond NXP Semiconductors standard warranty and NXP Semiconductors product specifications. Translations A non-english (translated) version of a document is for reference only. The English version shall prevail in case of any discrepancy between the translated and English versions. 11.4 Trademarks Notice: All referenced brands, product names, service names and trademarks are the property of their respective owners. 12. Contact information For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: salesaddresses@nxp.com All information provided in this document is subject to legal disclaimers. NXP Semiconductors N.V. 214. All rights reserved. Product data sheet Rev. 1 19 August 214 12 of 13

13. Contents 1 Product profile.......................... 1 1.1 General description..................... 1 1.2 Features and benefits.................... 1 1.3 Applications........................... 1 2 Pinning information...................... 2 3 Ordering information..................... 2 4 Marking................................ 2 5 Limiting values.......................... 2 6 Characteristics.......................... 3 7 Application information................... 7 8 Package outline......................... 8 9 Soldering.............................. 9 1 Revision history........................ 1 11 Legal information....................... 11 11.1 Data sheet status...................... 11 11.2 Definitions............................ 11 11.3 Disclaimers........................... 11 11.4 Trademarks........................... 12 12 Contact information..................... 12 13 Contents.............................. 13 Please be aware that important notices concerning this document and the product(s) described herein, have been included in section Legal information. NXP Semiconductors N.V. 214. All rights reserved. For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: salesaddresses@nxp.com Date of release: 19 August 214 Document identifier:

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