IPASS 0.8mm PITCH I/O CONNECTOR 1.0 SCOPE...2 2.0 PRODUCT DESCRIPTION...2 2.1 PRODUCT NAME AND SERIES NUMBER...2 2.2 DIMENSIONS, MATERIALS, PLATINGS AND MARKINGS...2 3.0 REFERENCE DOCUMENTS...2 3.1 MOLEX DOCUMENTS...2 4.0 PROCEDURE...2 4.1 GENERAL REQUIREMENTS...2 4.2 PACKAGING...2 4.3 BOARD THICKNESS...2 4.4 BOARD LAYOUT...2 4.5 ASSEMBLY INSTRUCTIONS...3 4. BOARD LAYOUT...3 4.7 VACUUM PICK UP...3 4.8 SOLDER TAIL SEATING...4 4.9 SOLDERING REQUIREMENTS...5 4.10 PROCESSING REQUIREMENTS...5 4.11 STENCIL REQUIREMENTS... 4.12 REWORK INSTRUCTIONS... 5.0 WORKMANSHIP REQUIREMENTS... DATE: 200 / 02 / 08 1 of
1.0 SCOPE This Application Specification covers the processing and handling requirements for the ipass connector family (7558 series). 2.0 PRODUCT DESCRIPTION 2.1 PRODUCT NAME AND SERIES NUMBER Product Name: ipass Connector Family Series Number: 7558 2.2 DIMENSIONS, MATERIALS, PLATINGS AND MARKINGS See the appropriate sales drawing for information on dimensions, materials, plating and marking, and footprint patterns. 3.0 REFERENCE DOCUMENTS 3.1 MOLEX DOCUMENTS PK-7558-002 SD-7558-001 SMES-152 Packaging Specification ipass Right Angle Solderability 4.0 PROCEDURE 4.1 GENERAL REQUIREMENTS 4.1.1 PACKAGING The Molex ipass connector is supplied on tape and reel packaging for high-speed assembly. 4.1.2 BOARD THICKNESS There is no required minimum board thickness for single-sided printed circuit boards. 4.1.3 BOARD LAYOUT The board layout must conform to the appropriate industry standard requirements. See the aforementioned sales drawings for the specific connector footprint and keep-out areas. DATE: 200 / 02 / 08 2 of
4.2 ASSEMBLY INSTRUCTIONS 4.2.1 BOARD LAYOUT The board layout must conform to the appropriate industry standard requirements. See the aforementioned sales drawings for the specific connector footprint and keep-outs. The Molex ipass connector shall be placed on the host printed circuit board using the aligning posts. The terminals shall be lined up on the printed circuit board in such a way that the solder feet shall be placed over the solder pads on the host printed circuit board. 4.2.2 VACUUM PICK UP Polyimide tape (approximate size: 5mm by 10mm) is supplied on the top surface of the receptacle for vacuum pick and place. This tape does not need to be removed after placement of the receptacle on the PCB or after processing the receptacle to the PCB. The location of the centroid of the receptacle is given relative to the upper left corner. The upper left corner is defined with the receptacles solder tails to the bottom and the card slot to the top as you are looking at the PCB. See figure below for location of centroid. The table below lists the dimensional location of the centroid as a function of circuit size. Circuit Size Dimension 2 3 38 50 8 X (mm).70 8.70 9.10 11.50 15.10 Y (mm) 5.80 5.80 5.80 5.80 5.80 Weight (g) 0.74 0.9 1.00 1.2 1.5 DATE: 200 / 02 / 08 3 of
4.2.3 SOLDER TAIL SEATING As the connector posts are for clearance and fit only, the force required for seating the connector is minimal. The connector must be seated and soldered so that there is no more than a 0.05mm (.002 ) gap between the housing and the printed circuit board. Only the front pegs on the housing and the SMT tails should be touching the printed circuit board. DATE: 200 / 02 / 08 4 of
4.3 SOLDERING REQUIREMENTS 4.3.1 PROCESSING REQUIREMENTS Peak reflow temperatures are not recommended to exceed 20 C (lead free application). The recommended profile for soldering the receptacle to the PCB is: SMT Profile Ramp-Up: Preheat Temperature: Time maintained above: Peak Temperature: Time within 5 C of actual Peak Temperature: Ramp-Down: Cycle Duration, 25 C to Peak Temperature: Average Rate of 3 C/second max 150 C min. to 200 C max. for 0-180 seconds 217 C for 0-120 seconds 250 C 20-40 seconds Average Rate of C/second max 8 minutes maximum DATE: 200 / 02 / 08 5 of
4.3.2 STENCIL REQUIREMENTS A minimum solder paste thickness of 0.13mm (.005 ) is recommended, yielding a solder volume on pad of 0.077mm 3 (.00000498828 in 3 ). 4.4 REWORK INSTRUCTIONS Rework as if it were a BGA device 5.0 WORKMANSHIP REQUIREMENTS Inspection of non-functional areas shall be made under normal artificial lighting, un-magnified, and viewed in a manner that duplicates the typical end use application. Normal viewing should be made at a distance no closer than 12 inches with a light source capable of 80-100 foot candles at the part surface. In general, non-functional areas are defined as any area that does not affect the mechanical or electrical function of the part. This criterion is valid for all areas designated as non-functional and may be, but are not required as such, on the sales drawing. Inspection of functional areas shall be made under the same conditions as for non-functional, except for magnification, which shall be at a maximum of 10X. In general, functional areas are defined as any area that has a direct affect on the mechanical or electrical function of the part. This criterion is valid for all areas designated as functional and may be, but are not required to be designated as such, on the sales drawing. Acceptable defects include: protrusions around the gate location(s); discoloration, color variation, flow marks inconsistent gloss of surface or knit/weld lines on all surfaces; sinks scratches, tool marks or parting line flash on non-functional surfaces. DATE: 200 / 02 / 08 of