Stick LIN-78K0 Hardware Manual 2008/6 The 2nd edition TESSERA TECHNOLOGY INC. - -
[NOTES] The information in this document is subject to change without notice. No part of this document may be copied or reproduced in any form or by any means without the prior written consent of TESSERA TECHNOLOGY INC.. TESSERA TECHNOLOGY INC.. assumes no liability for infringement of patents or copyrights of third parties by or arising from use of a product described herein. This product is designed and manufactured with intention for use in evaluation and prototyping by engineers with knowledge of security, safety and reliability. TESSERA TECHNOLOGY INC.. would like to inform, that the standard quality assurance procedure(s) have not been fully applied to this product and its documentation and that TESSERA TECHNOLOGY INC.. cannot assure the full and error free function and/or the standard quality level. [CAUTION] This equipment should be handled like a CMOS semiconductor device. The user must take all precautions to avoid build-up of static electricity while working with this equipment. All test and measurement tool including the workbench must be grounded. The user/operator must be grounded using the wrist strap. The connectors and/or device pins should not be touched with bare hands. - 2 -
Contents Introduction.... Features....2 Hardware Overview....3 Attached goods list... 5. Block Diagram... 5 2 Interface Connection... 6 2. J... 6 3 Switches and LEDs... 7 3. SW: Debug switch... 7 3.2 SW2: writer switch... 7 3.3 LED... 8 3. LED2: Power Indication... 8 3.5 LED3... 9 Power Source... 0 5 Design Data... 5. Parts Layout... 5.2 Circuit Schematics... 2 5.3 Body Dimensions... 5. Board dimensions... 5 5.5 PCB Layout... 6 5.5. Silk of the top side... 6 5.5.2 Silk of the bottom side... 7 5.5.3 PCB Layout: The first layer... 8 5.5. PCB Layout: The second layer... 9 5.5.5 PCB Layout: The third layer... 20 5.5.6 PCB Layout: The fourth layer... 2-3 -
Introduction μpd78f8020d is the NEC Electronics 8 bit single chip microcomputer. The features and hardware specification of Stick LIN-78K0 are described.. Features Features of the Stick LIN-78K0 are as follows. The evaluation board used the NEC Electronics 8bit single chip microcontroller μpd78f8020d (The part of 8-bit microcontroller is same as 78K0/KE2). All of the ROM, RAM, circumference circuit and LIN transceiver are efficiently built in one chip on a Stick LIN-78K0. High-speed operation is realized via the 20MHz internal clock. 28 Kbytes of Flash EEPROM, available on the chip, Stick LIN-78K0 is programmable and debuggable from PC via USB connection without any additional hardware tools. FT2232L (FTDI) is available on board for USB interface (USB2.0 compatible). The size of the module is, 82mm x 23mm..2 Hardware Overview MCU μpd78f8020dgb Clock 20MHz main Interfaces USB connector (Type A) Expansion interface (J) Power supply 5.0V by USB, 7.0V-8.0V by Expansion interface - -
.3 Attached goods list Stick LIN-78K0 Development tool/manual CD-ROM Expansion interface cable for LIN (separate cable with clip). Block Diagram 5V 5V 8.5V Voltage Converter USB-UART FT2232L MCU UPD78F8020D 8-bit Micro VSUP I/O I/F USB I/F Ch (78K0/KE2) UART OCDB P70 Writer SW OCDA Analog 5V RESET FLMD0 Driver LIN Ch2 UART Debug SW UART0 UART6 5V - 5 -
2 Interface Connection 2. J Expansion Interface: J J: Hirose DF-0DP-2DS J Name Connection to MCU Notes VSUP (VSUP,HDS) External Power Supply 2 LIN LIN LIN Bus 3 DR DR Low side Pre driver DR2 DR2 Low side driver for Relay 5 DR22 DR22 Low side driver for Relay 6 DR22_I DR22_I Driver 22 control signal input 7 DR DR Hall sensor power supply driver 8 DR2_I DR2_I Driver 2 control signal input 9 GND 0 SWI SWI High voltage SW input 9Pin 0Pin Pin 2Pin Location of J: TOP VIEW - 6 -
3 Switches and LEDs 3. SW: Debug switch The mode selection for Debugging with the ID78K0-TK. Setting of SW Normal Mode Debugging Mode OFF ON SW SW: TOP VIEW 3.2 SW2: writer switch Programming mode selection for Flash EEPROM on the MCU with PG-FPL3. Setting of SW2 Normal Mode Flash Programming Mode OFF ON SW2 SW2: TOP VIEW - 7 -
3.3 LED LED is connected to Low side driver DR3. LED status P33 Output data DR3 status LED High ON Green Low OFF Off LED LED: TOP VIEW 3. LED2: Power Indication LED2 is a green LED to indicate the availability of power. LED2 status Status LED Power ON Green Power OFF Off LED2 LED2: TOP VIEW - 8 -
3.5 LED3 LED3 indicate LIN Bus Pull-up. LIN Bus Pull-up Pull-up enable Pull-up disable LED3 LED Green Off LED3 LED3: TOP VIEW - 9 -
Power Source Stick LIN-78K0 are able to choice two ways of power source. MCU power() and driver module power(vsup) are both supplied when power source are supplied from either USB or expansion interface(vsup). If you supply power using the expansion interface(vsup), then keep power source voltage DC7.0V-DC8.0V. - 0 -
5 Design Data 5. Parts Layout USB(USB I/F) SW2(Writer SW) LED J(Expantion I/F) SW(Debug SW) LED2 LED3 TOP VIEW SW2(Writer SW) USB(USB I/F) J(Expantion I/F) SW(Debug SW) TOP VIEW - -
5.2 Circuit Schematics TP5 TP R0 0K C 0.uF R 00K P70 R2 560 2 G3VM-6G 3 U VSUP D SS00 LED3 PG2H Y X X2 CSTCE 20MHz V P.2 RTS_RES0 P.2 FLMD0 P.2 R8 0K TP3 TP TP TP TP7 TP TP8 TP PORTB C 0.uF P20 X2 X P33 P70 TP6 TP C6 0.7uF 2 3 5 6 7 8 9 0 2 3 5 6 U2 P.2 P.2 TP TP P20 P2 P00/TI00 P20/INTP0/EXLVI RESET FLMD0 P22/X2/EXCLK/OCD0B P2/X/OCD0A REGC VSS P60/SCL0 P6/SDA0 P33/TI5/TO5/INTP P70/KR0 P06/TI0/TO0 P05/TI00 P32/INTP3/OCDB RXD0 TXD0 TP2 TP ANI3 ANI FLMD0 P30 6 P0/TI00/TO00 63 P20/ANI0 62 P2/ANI 6 P22/ANI2 60 P23/ANI3 59 P2/ANI 58 P25/ANI5 57 AVSS 57 56 AVREF 55 P0/SCK0/TxD0 5 P/SI0/RxD0 53 P2/SO0 52 I.C. 5 I.C. 50 SWO 50 9 LIN 9 P3/INTP2/OCDA P30/INTP P7/TI50/TO50 P6/TOH/INTP5 P5/TOH0 P/RxD6 P3/TxD6 MSLP UMODE PCNT VBASE VRO VIC HDS SUP DRPS 7 8 9 20 2 22 23 2 25 26 27 28 29 30 3 32 LIN D2 RD27S RD27S D 8 GND2 7 SWI 6 DR_I 5 DR DR2_I 3 DR2 2 GND3 DR22 0 DR22_I 39 DR3 38 DR3_I 37 DR_I 36 DR 35 DR5_I 3 DR5 33 GND upd78f8020dgb C2 220pF SWI P20 DR DR2 DR22 P33 P20 P2 VSUP R6 7K SS00 D5 R7 7K SS00 D6 DR2_I P6 DR22_I P7 DR R2 00K R 20K C5 0.uF VSUP ANI C8 0.00uF R5.5K LED PG2H R9 30K R3 0K VSUP D3 RB60M-0 ANI3 C7 0.00uF DR DR22 DR J 2 3 5 6 7 8 9 0 DF-0DP-2DS R3 K LIN DR2 DR22_I DR2_I SWI C3 0.uF R.5K R 00K P.2 PORTA P.2 P.2 RXD6 TXD6 TP9 TP TP0 TP P.2 FPL3 P30 P7 P6 P5 P5 + C2 22uF/6V R5.2(0.5W,3226,%) C3 0.uF C9 0.uF + C0 7uF/35V(5*) C uf USB + C5 uf + 2 3 U3 FSEL CAP+ GND CAP- IN 8 SHDN 7 LV 6 OUT 5 MAX68ESA + C uf D7 RB60M-0 VSUP R6 390 LED2 PG2H Title Stick LIN 02 Parts, 2 Library Parts, 82 Nets, 3 Pins Size Document Number Rev A3 5E-027A 2.0 Date: Thursday, October 26, 2006 Sheet of 2-2 -
USB R7 70 USB USB USB C6 0.uF + C7.7uF C8 C9 C20 C2 8 U5A 7 SN7LVC3G07DCT 8 U5B 3 5 R9 K USB SN7LVC3G07DCT R28 K R2 0K R22 0K R23 0K R25 0K USB USB 2 23 22 2 20 9 7 6 5 3 2 0 0 39 38 37 36 35 33 32 30 29 28 27 26 TXDA RXDA RTSA# CTSA# DTRA# DSRA# DCDA# RIA# TXDENA SLEEPA# RXLED# TXLED# SI/WUA TXDB RXDB RTSB# CTSB# DTRB# DRSB# DCDB# RIB# TXDENB# SLEEPB# RXLEDB# TXLEDB# SI/WUB VCCIOB 3 VCCIOA VCC 2 VCC 3 AVCC 6 3V3OUT 6 USBDM 8 USBDP 7 RSTOUT# 5 XTIN 3 XTOUT RESET# EECS 8 EESK EEDATA 2 C22 33nF R8 27 R20 27 R2.5K Y2 CSTCR6M00G5 R26 USB27 BLMPG750S L 5 U6 R27 2 3 SN7LVCGDCK 27 USB VBUS 2 3 D- D+ GND FG FG2 FG FG2 UAR0-W500 C23 0.uF 0.uF 0.uF C2 0.uF 0.uF 0.uF C25 C26 0.uF 0.uF PWREN# TEST 7 GND GND GND GND AGND U C27 C28 C29 3 25 8 9 5 FT2232 ( RS232 PINOUT ) 0.uF 0.uF 0.uF P. P. TXD0 TXD6 FPL3 R29 0K USB C30 R30 0K 3 6 A B USB U9 A/B VCC 5 Y 7LVCG97DCK FPL3 8 U8A 2 6 SN7LVC2G26DCU 8 U5C 6 2 SN7LVC3G07DCT R33 K RXD6 P. RXD0 P. OCD 2 7LVC2G7DCU 5 3 2 U7 D CLK VCC 8 6 7 CLR PRE U0 Q 5 Q 3 7LVCG08DCK U8B 5 3 8 7 R3 K SN7LVC2G26DCU R32 27 PORTA P. 0.uF OCD 2 8 UA 7 FPL3 5 6 8 7LVC2G38DCU UB 3 R3 0K RTS_RES0 P. 7LVC2G38DCU PORTB P. OCD Mode SW 3 2 OCD FPL3 Mode SW2 3 2 FPL3 FPL3 P. Normal Mode 6 5 FLMD0 Normal Mode 6 5 FLMD0 FLMD0 P. Title Stick LIN SSSS222700 SSSS222700 Size Document Number Rev A3 5E-027A 2.0 Date: Thursday, October 26, 2006 Sheet 2 of 2-3 -
5.3 Body Dimensions - -
5. Board dimensions - 5 -
5.5 PCB Layout 5.5. Silk of the top side - 6 -
5.5.2 Silk of the bottom side - 7 -
5.5.3 PCB Layout: The first layer - 8 -
5.5. PCB Layout: The second layer - 9 -
5.5.5 PCB Layout: The third layer - 20 -
5.5.6 PCB Layout: The fourth layer - 2 -