envisiontec.com M-CAD

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EnvisionTEC - German Precision 1

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envisiontec.com M-CAD

Xtreme 3SP & Xede 3SP ULTRA 3SP & ULTRA 3SP HD Perfactory 4 Standard & Standard XL Perfactory 4 Mini & Mini XL Perfactory 3 Mini Multi Lens Perfactory Micro HiRes & EDU & XL Photosensitive Resins 08 envisiontec.com

Visual Aids Prototype Tooling Direct Manufacturing Fit and Assembly Toys and Models Direct Casting EnvisionTEC - German Precision 1

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Your Partner For Success. Ever since EnvisionTEC GmbH patented the Perfactory DLP machine in 1999, we have built a reputation for reliable and high quality engineering solutions. These skills have been used to manufacture award winning, high speed, economical additive manufacturing machines. When EnvisionTEC decided to build a rapid prototyping machine, conventional techniques were considered. These were rejected as they were either not capable of achieving the resolution required or the ongoing running costs proved to be uneconomic for the end user. Thus, the Perfactory DLP process was born and subsequently commercialized in 2002. EnvisionTEC has continued to innovate in the 3D printing field, adding bioprinting technology and our newest technology, 3SP (Scan, Spin, and Selectively Photocure). We strive to deliver solutions, not just 3D printers. We look to deliver a finished product, designed with software that is fully integrated with our software, and printed on an EnvisionTEC 3D printer with a material that meets the exact needs of the end user. We work closely with many industry-specific software developers to ensure a seamless transition between content creation and 3D printing. We look forward to working with you to deliver the perfect solution for your 3D printing needs. Al Siblani - CEO EnvisionTEC. EnvisionTEC - German Precision 3

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Xtreme 3SP & Xede 3SP New 3SP (Scan, Spin, and Selectively Photocure) technology quickly prints highly accurate parts from STL files Large build area makes it the first choice for automotive and aerospace industries Fast build speed is ideal for service bureau or OEM customers Constant build speed and quality regardless of geometry or number of parts X Y resolution of 100 µm and a Z resolution range from 50 to 100 µm (material dependant). Machine Specification: Xtreme 3SP Xede 3SP Maximum Building envelope: 254 x 362 x 330 mm* 457 x 457 x 457 mm* Voxel** resolution in X & Y: 100 µm 100 µm Dynamic Voxel Resolution in Z: 50-100 µm*** 50-100 µm*** Footprint: 165 x 165 x 165 cm 178 x 190 x 165 cm Electrical Requirement: System specifications are subject to change without notice. *Deviation of +/- 2mm possible. **A voxel is volumetric pixel. ***Pre-Adjusted by each material module and material dependent.**** 220 V, single phase, 15 A EnvisionTEC - German Precision 5

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ULTRA 3SP and ULTRA 3SP HD 3SP (Scan, Spin, and Selectively Photocure) technology quickly prints highly accurate parts from STL files Very few moving parts make the systems user-serviceable Delivered and installed with all the relevant software to enable automatic generation of supports and perfect model production Low part cost due to minimal material waste High quality surface finish Accuracy and surface finish remains constant over the entire build area Machine Specification: ULTRA 3SP ULTRA 3SP HD Maximum Building envelope: 266 x 175 x 193 mm* 266 x 175 x 193 mm* Voxel** Resolution in X & Y: 100 µm 50 µm Dynamic Voxel** Resolution in Z: 25-100 µm*** 25-100 µm*** Footprint: Optional Stand: 74 x 76 x 117 cm 74 x 76 x 64 cm Electrical Requirement : 100-127 VAC, 50/60 Hz, single phase, 8A; 200-240 VAC, 50Hz, single phase 4A System specifications are subject to change without notice. *Deviation of +/- 2mm possible. **A voxel is volumetric pixel. *** Pre-Adjusted by each material module and material dependent. EnvisionTEC - German Precision 7

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Perfactory 4 Standard and Standard XL Ideal for consumer product models Fitted with the Enhanced Resolution Module (ERM) as standard enables 50 µm resolution in the X and Y axis The Perfactory Standard XL with ERM can build up 25mm in height per hour at a voxel*** thickness of 100 µm Constant build speed regardless of quantity or complexity of parts (only the dynamic Z voxel will affect this). Machine Specification: Perfactory 4 Standard Perfactory 4 Standard XL Build Envelope: 160 x 100 x 230* mm 192 x 120 x 230* mm Voxel** resolution in X & Y (ERM): 42 µm 50 µm Dynamic Voxel** resolution in Z: 25-150 µm*** Projector Resolution: 1920 x 1200 Pixels Footprint: 73 x 48 x 135 cm Weight Approx: 85 kg Electrical Requirement: 100-120 V, 5.4 A; 220-240 V, 2.4 A System specifications are subject to change without notice. *Deviation of +/- 2mm possible. ** A voxel is volumetric pixel. *** Pre-Adjusted by each material module and material dependent. EnvisionTEC - German Precision 9

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Perfactory 4 Mini and Perfactory 4 Mini XL Ideal for the manufacture of electronic components for hand held devices A choice of 15 different resins can be used Change over between materials in minutes utilizing the easily interchangeable base Produce the finest detail in the shortest time Resolution and surface finish remains constant over the entire build area Machine Specification: P4 Mini P4 Mini XL Lens System: Lens f = 2.36 (60 mm) Lens f = 2.95 (75 mm) Lens f = 2.36 (60 mm) Lens f = 2.95 (75 mm) Build Envelope (factory adjustable): 64 x 40 x 230 mm* 38 x 24 x 230 mm* 115 x 72 x 230 mm* 84 x 52.5 x 230 mm* Voxel** resolution in X & Y (ERM): 17 µm 10 µm 30 µm 22 µm Dynamic Voxel resolution in Z: Projector Resolution: Footprint: Weight Approx: Electrical Requirement: System specifications are subject to change without notice. *Deviation of +/- 2mm possible. **A voxel is volumetric pixel. ***Pre-Adjusted by each material module and material dependent. 15-150 µm*** 1920 x 1200 Pixels 73 x 48 x 135 cm 85 kg 100-120 V, 5.4 A; 220-240 V, 2.4 A EnvisionTEC - German Precision 11

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Perfactory 3 Mini Multi Lens The Perfactory 3 Mini Multi Lens has the highest precision and 3 lens choices: 60 mm, 75 mm, and 85 mm. Fitted with the Enhanced Resolution Module (ERM) enables resolutions down to 16 µm in the X and Y with the 85 mm lens The machine is delivered and installed with all relevant software to enable automatic support generation and perfect model production Wide range of materials Resolution and surface finish remains constant over the entire build area Machine Specification: Lens System Lens f = 2.36 (60 mm) Lens f = 2.95 (75 mm) Lens f - 3.35 (85 mm) Build Envelope 84 x 63 x 230 mm* 44x 33 x 230 mm 44x 33 x 230 mm ERM Voxel** Size: 16 µm 21 µm 30 µm Dynamic Voxel** Resolution in Z: Projector Resolution: Footprint: Weight Approx: 15-150 µm*** 1400 x 1050 Pixels 73 x 48 x 135 cm 85 kg Electrical Requirement: 100-120 V, 5.4 A; 220-240 V, 2.4 A. System specifications are subject to change without notice. *Deviation of +/- 2mm possible. **A voxel is volumetric pixel. ***Pre-Adjusted by each material module and material dependent. EnvisionTEC - German Precision 13

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Perfactory Micro EDU, Micro HiRes and Micro XL The smallest personal desktop 3D manufacturing systems The Micro series can produce small engineering components requiring high precision Ideal for producing high quality, small engineering components Long life LED DLP light source with zero maintenance and very low acquisition cost Ideal for educators, consumers, and design professionals Machine Specification: Micro EDU Micro HiRes Micro XL Build Envelope: 100 x 75 x 100 mm* 40 x 30 x 100 mm* 100 x 75 x 100 mm* Voxel** resolution in X & Y: 150 µm 31 µm 150 µm Dynamic Voxel** Resolution in Z: 50 µm - 100 µm 25 µm - 35 µm 50 µm - 100 µm Footprint: 28 x 25 x 61 cm 23 x 18 x 58 cm 28 x 25 x 61 cm Weight Approx: 24 lb (11 kg) 28.66 lbs (13 kg) 24 lb (11 kg) Electrical Requirement: System specifications are subject to change without notice. *Deviation of +/- 2mm possible. **A voxel is volumetric pixel. ***Pre-Adjusted by each material module and material dependent. 100-120 V, 3 A; 220-240 V, 2 A EnvisionTEC - German Precision 15

High Performance Photosensitive Resins EnvisionTEC offers a range of high performance materials to cope with most applications required by industry. Wax Filled Resins - These are used for direct casting applications Ceramic Filled Resins - These have a high temperature resistance and extremely smooth surface finishing making them ideal for high temperature vulcanized rubber molding and silicone molding. General Purpose Resins - These are highly accurate resins that can be used for functional assembly, filming, silicone molding and concept molding. Material Available Formulas Applications Perfactory Micro 3SP AB Flex X X General purpose with structural representation of ABS with additional flexibility ABS Flex Black X X X Highly flexible general purpose ABS-like ABS Flex Light Gray X X X Highly flexible general purpose ABS-like ABS Flex White X X X Highly flexible general purpose ABS-like ABS Tough X X X Extremely tough ABS-like ABS White X General purpose, superior strength, wide processing latitude ABS Tuff X X General purpose with structural representation of ABS E-Denstone Series X X X High temperature molding, high resolution, nonmetal masters E-Glass X X X Clear visual aids E-Shell 200 Series X X Medical grade, opaque skin tones E-Shell 300 Series X X Medical grade, transparent for visual aids E-Tool X X X Strong and ideal for molds for thermoplastic injection molding HTM140 Series X X High temperature molding, high resolution, nonmetal masters LS600 X X General purpose, durable and accurate with fine details Q-View X X Quick building for fast design verification R5/R11 Series X Master models, mimics polypropylene for rubber molding RC 70/90 Series X X Nanoparticle-filled high temperature materials for tough, stiff parts RC25/31 Series X High temperature applications, nano filled silica oxide Superflex X X X Extremely flexible polypropylene-like 16 envisiontec.com

EnvisionTEC GmbH Brüsseler Straße 51 D-45968 Gladbeck Germany Phone: +49 2043 9875 0 envisiontec.com info@envisiontec.com EnvisionTEC, Inc 15162 South Commerce Dearborn, MI 48120 USA Phone: +1 313 436 4300 envisiontec.com northamerica@envisiontec.com EnvisionTEC - German Precision 17

MK-IND-MCADBooklet-V01-FN-EN