Discontinued Discontinued as as of of September September 30, 30, 013 013 For board-to-board Narrow pitch connectors (0.5mm pitch) P5KL Series 5.8mm 3.3mm Products are discontinued. FEATURES 1. Low profile mated height of 1. mm and 0.5 mm pitch contributes to device miniaturization.. Strong resistance to adverse environments! Utilizes construction for high contact reliability. 3. Simple lock structure provides tactile feedback to ensure excellent mating/unmating operation feel. Simple lock mechanism APPLIATIONS Digital devices, such as digital still cameras and digital video cameras.. Effective mating length 0.3 mm 0.3mm ORDERING INFORMATION 5L: Narrow Pitch onnector P5KL (0.5 mm pitch) 6L: Narrow Pitch onnector P5KL (0.5 mm pitch) Number of pins ( digits) Mated height <> 3: For mated height 1. mm <> 3: For mated height 1. mm Functions 3: With positioning bosses : Without positioning bosses Surface treatment (ontact portion / Terminal portion) 7: Ni plating on base, Au plating on surface (for Ni barrier available) Packing G: 3,000 pieces embossed tape and plastic reel x (for Ni barrier available) AXK 3 7 G 1
Discontinued as of September 30, 013 PRODUT TYPES Mated height 1. mm No. of pins Part No. Inner carton (1-reel) 10 AXK5L1037G AXK6L1037G 1 AXK5L137G AXK6L137G 0 AXK5L037G AXK6L037G AXK5L37G AXK6L37G 30 AXK5L3037G AXK6L3037G 3 AXK5L337G AXK6L337G 0 AXK5L037G AXK6L037G 6 AXK5L637G AXK6L637G 50 AXK5L5037G AXK6L5037G 60 AXK5L6037G AXK6L6037G Notes: 1. Regarding ordering units: During production, Please make orders in 1-reel units. Samples for mounting confirmation: Please consult us. Samples: Small lot orders are possible. Please consult us.. The standard type comes without positioning bosses. onnectors with positioning bosses are available for on-demand production. For this type of connector, 9th digit of the part no. changes from to 3. e.g. 10 pin contacts for sockets: AXK5L10337G SPEIFIATIONS 1. haracteristics Item Specifications onditions Rated current 0.5A/pin contact (Max. 10 A at total pin contacts) Rated voltage 60V A/D Electrical Breakdown voltage 150V A for 1 minute Detection current: 1mA Insulation resistance Min. 1,000M (initial) Using 500V D megger Mechanical Environmental ontact resistance omposite insertion force omposite removal force Holding force of terminal securing section. Material and surface treatment Part name Material Surface treatment Molded portion Heat-resistant resin (UL9V-0) Packing quantity Outer carton 3,000 pieces 6,000 pieces Based on the contact resistance measurement method Max. 90m specified by JIS 50. Max. 0.981N {100gf}/pin contacts pin contacts (initial) Min. 0.0588N {6gf}/pin contacts pin contacts Min. 0.981N {100gf}/pin contact Measuring the maximum force. As the contact is axially pull out. Ambient temperature 55 to +85 No freezing at low temperatures Soldering heat resistance Storage temperature Thermal shock resistance Humidity resistance Saltwater spray resistance Max. peak temperature of 60 (on the surface of the P board around the connector terminals) 300 within 5 seconds 350 within 3 seconds 55 to +85 (product only) 0 to +50 (emboss packing) 5 cycles, insulation resistance min. 100M, 10 hours, insulation resistance min. 100M, hours, insulation resistance min. 100M, HS resistance 8 hours, Lifetime Insertion and removal life 50 times Unit weight 0 pin contacts; : 0.05g; : 0.0g ontact/post opper alloy Infrared reflow soldering Soldering iron No freezing at low temperatures. No dew condensation. onformed to MIL-STD-0F, method 107G Order Temperature ( ) Time (minutes) 0 1 55 3 30 Max. 5 3 +3 85 0 30 Max. 5 0 55 3 Bath temperature 0, humidity 90 to 95% R.H. Bath temperature 35, saltwarter concentration 5 1% Bath temperature 0, gas concentration 3 1 ppm, humidity 75 to 80% R.H. Repeated insertion and removal speed of max. 00 times/hours ontact portion: Ni plating on base, Au plating on surface Terminal portion: Ni plating on base, Au plating on surface (Except for thick of terminal) The section close to the soldering portion has a nickel barrier. (The nickel base is exposed.)
Discontinued as of September 30, 013 DIMENSIONS Interested in AD data? You can obtain AD data for all products with a mark from your local Panasonic Electric Works representative. AD Data (Mated height: 1.mm) (Unit: mm) A B±0.1 0.0±0.03 (Suction face) 1.60.80 1.0.0 (0.80) Terminal coplanarity 0.10 5.80 No. of contacts A B 10 5.50.00 1 6.00.50 0 8.00.50 0.10±0.03 9.00 5.50 30 10.50 7.00 1.15 (0.80) 3 11.50 8.00 0 13.00 9.50 6 1.50 11.00 50 15.50 1.00 60 18.00 1.50 General tolerance: 0. (Mated height: 1.mm) A B±0.1 0.0±0.03 (Suction face) 1.0.50 0.95 0.10±0.03 Terminal coplanarity 0.10 (0.65).00 (0.65) 3.30 No. of contacts A B 10 3.90.00 1.0.50 0 6.0.50 7.0 5.50 30 8.90 7.00 3 9.90 8.00 0.90 0 11.0 9.50 6 1.90 11.00 50 13.90 1.00 60 16.0 1.50 General tolerance: 0. and header are mated 1.0±0.15 3
Discontinued as of September 30, 013 EMBOSSED TAPE DIMENSIONS (unit: mm, ommon for respective contact type, socket and header) Tape dimensions (onforming to JIS 0806-1990. However, some tapes have mounting hole pitches that do not comply with the standard.) Tape I Tape II A±0.3 1.75 A±0.3 B 1.75 Plastic reel dimensions (onforming to EIAJ ET-700B) D±1 Taping reel Top cover tape Pull out direction 8.0 Pull out direction 8.0 380 dia. Embossed carrier tape Embossed mounting-hole +0.1 1.5 0 dia. +0.1 1.5 0 dia. Suffix: G (1 reel, 3,000 pieces embossed tape: Plastic reel package) Mated height No. of pins Type of taping A B D Quantity per reel and header are common: 1.mm 10 to 18 Tape I 16.0 7.5 17. 3,000 pcs. 0 to 50 Tape I.0 11.5 5. 3,000 pcs. 60 Tape II 3.0 8. 1. 33. 3,000 pcs. onnector orientation with respect to direction of progress of embossed tape Direction of tape progress Type ommon for P5KL Note: There is no indication on this product regarding top-bottom or left-right orientation.
Discontinued as of September 30, 013 NOTES 1. As shown below, excess force during insertion may result in damage to the connector or removal of the solder. Also, to prevent connector damage plese confirm the correct position before mating connectors. Recommended P board pattern (TOP VIEW) 3.0±0.05.0±0.05 0.5±0.03 Recommended P board pattern (TOP VIEW) 0.5±0.03 0.0±0.05 0.15±0.03. Keep the P board warp no more than 0.03 mm in relation to the overall length of the connector. Max. 0.03mm Max. 0.03mm 3. Recommended P board and metal mask patterns onnectors are mounted with high pitch density, intervals of 0.35 mm, 0. mm or 0.5 mm. In order to reduce solder bridges and other issues make sure the proper levels of solder is used. The figures to the right are recommended metal mask patterns. Please use them as a reference. 0.0±0.05 0.15±0.03 B±0.05 : Insulation area.00±0.05 6.80±0.05 Metal mask thickness: 150 m (Terminal portion opening area ratio: 57%) 0.3±0.01 (0.86) (0.86).88±0.01 6.60±0.01 Metal mask thickness: 10 m (Terminal portion opening area ratio: 70%) 0.3±0.01 B±0.05 Metal mask thickness: 150 m (Terminal portion opening area ratio: 56%) 0.3±0.01 (0.58) (0.58).9±0.01.10±0.01 Metal mask thickness: 10 m (Terminal portion opening area ratio: 70%) 0.3±0.01.0±0.05.30±0.05 (1.07).6±0.01 6.60±0.01 (1.07) (0.7) (0.7).66±0.01.10±0.01 Notes: 1. See the dimension table on page 3 for more information on the B dimension of the socket and header.. The socket dimension is the B dimension in the dimensions table with 0.8 added. For autions for Use, see onnector Technical Information. For other details, please verify with the product specification sheets. 5