Introduction of Hitachi SU1510

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Introduction of Hitachi SU1510 1

1. Main Features of the SU1510 SU1510 Same high-performance optics as S-3400N Variable Pressure mode as standard Large samples up to 153mm in diameter (observation range 126mm in diameter) Observation and EDS analysis on a sample 11up to 60mm tall Resolution: 3.0 nm(30kv,se,hv) 4.0 nm(30kv,bse,lv) Main unit is only 55 cm wide, operating table can be provided by user. TMP vacuum is standard 2 Copyright 2008 Hitachi High-Technologies Corporation All Rights Reserved.

1. Main Features of the SU1510 Variable Pressure Mode is standard No sample coating; good results without need to be specialist Excellent performance and Compact Size SE image; 3.0nm(High Vacuum) / BSE image; 4.0nm (Low Vacuum) Larger sample and imaging/analysis capability Analysis and the observation of the sample height 60mm Φ153mm at the maximum sample size Turbo Molecular Pump (TMP) is standard High throughput, Less floor space, less electric consumption. BSE Semiconductor Detector Superior image at low vacuum / low acceleration voltage Large diversity of options ESED-Ⅱ/ 3D-View 3

2. TMP vacuum as standard 4

2. Turbo Molecular Pump as standard! TMP offers shorter pumping times and less footprint than Diffusion Pump driven systems SU1510 (TMP) S-3000 (DP) 6 min 20 min SEM startup time High throughput Time shortening Weight RP SU1510 (TMP) S-3000 (DP) 2.5 min 4 min Time shortening Evacuation time at sample exchange * Time : approximately 55 cm 60 cm 115 cm SU1510 5 Copyright 2008 Hitachi High-Technologies Corporation All Rights Reserved.

3. Easy to Use 6

3. Easy to Use SU1510 Operation Guide with flow chart Step 1 Step 2 7

3. Easy to Use Step 1 Condition Setting Step 2 Image Adjustment 6 preset configurations for specific sample types, User made recipes can be saved as well Automatically sets the best condition Operation Guide using flow chart Focus (coarse) Alignment Stigmator Focus (fine) Capture Accelerated Voltage Probe Current Magnification Degree of Vacuum SE or BSE Signal Working Distance 8

3. Easy to Use SU1510 Image Adjustment with mouse 1. Click on Operation View Stigma X Stigma Y Brightness Contrast Focus (fine) Focus (coarse) ( turns into an adjustment screen) 2. Mouse click and move the cursor to desired operation area 3. Click/hold and move mouse left or right to control specified function 9

3. Easy to Use SU1510 Image Adjustment with mouse 1. Click on operation View ( turns into an adjustment screen) 2. Mouse click and move the cursor to desired operation area 3. Move mouse to control specified function swing with mouse Easy to operate! 10

3. Easy to Use Hitachi W-SEM has a choice of image displays. The operator can choose from real time displays of full screen, small screen or simultaneously display two different signals as shown below. 30 Small image (640 480 pixels) Full screen image (1280 960 pixels) Dual image(640 480 pixels 2) 11

3. Easy to Use Hitachi W-SEM has a signal mixing function in which operators can mix different signals generated from the same field of view and produce one combined image. Cu Ni Left: SE image Right: BSE image Signal mixing image (SE + BSE) 12 Sample: Cross section of BGA

3. Easy to Use Maintenance Video 3D-animation shows the step by step maintenance procedures to the user. 13 Copyright 2008 Hitachi High-Technologies Corporation All Rights Reserved.

4. Quadrant Bias -The boost for Low kv image quality- 14

4. Quadrant Bias Quad Bias OFF Ie = 8μA Quad Bias ON Ie = 62μA Quadrant bias can increase emission current, and contributes to the improvement of image quality at low accelerating voltage, without changing the probe size. Filament life time does not depend on Quadrant Bias ON/OFF. 0 3kV 5kV 15kV Quad Bias (Red) Quad Bias Off (Black) 15 30kV Copyright 2008 Hitachi High-Technologies Corporation All Rights Reserved.

4. Quadrant Bias High Resolution SE image at 0.3kV Vacc.: 0.3kV Mag.: x1,000 Vacc.: 0.3kV Mag.: x5,000 Sample: Star Sand 16

5. Auto Function ABS (Auto Beam Setting) 17

Auto Function Auto Beam Setting (ABS) Filament saturation, Beam alignment, focus, brightness and contrast Just One-Click!! All of these functions will be aligned just by one-click. 18 Copyright 2008 Hitachi High-Technologies Corporation All Rights Reserved.

6. Specimen Chamber & Stage 19

6. Specimen Chamber & Stage T X R Z Y 1. Range of Motion X-axis / Y-axis; 80 mm x 40 mm Z-axis ; 5.0 mm to 60 mm R-axis (rotation) ; 360 (continuous) T-axis (tilt) ; 20 to 90 2. Stage Control ; Manual drive 3. Maximum Specimen Size (Option;2-axis motor drive) ; 153 mm diameter 4. Maximum observable area 5. Maximum Sample Height ; 126 mm diameter (+ R) ; 60 mm (AWD=15 mm) 20

6. Specimen Chamber & Stage Imaging & Analysis of a sample 60mm in height 60 mm Stamp Sample height = 60 mm 60mm Tall Sample observable at X-ray Analysis Position ( AWD= 15 mm) 21

6. Specimen Chamber & Stage Option: 2- axis motor drive & Image Navigation Available to move with mouse and TrackBall by 2-axis motor drive stage Captured SEM image / such as optical microscope image / drawings image available to move the stage 22

6. Specimen Chamber & Stage Multi Sample Holder 15mm dia 4 15mm dia 14 Resin embedded Holder Faraday cup 23 Copyright 2008 Hitachi High-Technologies Corporation All Rights Reserved.

6. Specimen Chamber & Stage Thermo, BrukerAXS are available for SU1510 and other Hi-SEMs X-act Oxford-3L-Ln2 EDAX-2.5L-LN2 are only for the SU1510 116mm 227mm Thermo UltraDry10+/30 BrukerAXS XFlash4010/4030 5010 Oxford/Horiba x-act/x-max Oxford/Horiba 3L-LN2(30mm2) EDAX 2.5L-LN2(10mm2) 24

6. Specimen Chamber & Stage Twin EDS detection: Maximize count rate, minimize sample topography induced shadowing Result of left detector High sample topography induces shadow in single detector map Sample:Bonding Wire EDX:Bruker AXS X-Flash 4010 Result of both detectors Simultaneous observation by two opposing detectors minimizes the shadow. 25

7.Low Vacuum Function Observation of non-conductive samples without the need for metal coating 26

7. Theory of Low vacuum SEM Electron Beam irradiates a non-conductive samples Sample:gaze Sample surface will be charged. Charge up image Charge artefact in image Need for metal coating Less charge up image 27 Copyright 2008 Hitachi High-Technologies Corporation All Rights Reserved.

7. Theory of Low vacuum SEM The VP mode enables observation of non-conductive or hydrated samples without the need for sample preparation such as metal coating. Positive ions generated by either, the interaction of the incident electron beam, or the secondary electrons leaving the sample with the gas, act to neutralize the build up of negative charge on the sample surface. The chamber pressure is controlled by a simple slide bar. A patented Real-time Vacuum Feedback (RVF) system permits rapid vacuum stability in the specimen chamber at the user specified pressure setting. Primary e-beam Obj. lens BSE detector BSE - M - e + - - - - - Non-conductive sample Residual gas molecule Low vacuum (6~270Pa) 28

7. Theory of Low vacuum SEM Final aperture Obj. lens Charge up - - - - - - Sampl e M M M - - - M+ - - - M M+ M+ - M - - - MM+ - - -- M+ - - - - - - M+ M+ M+ M+ M M+ M+ M+ M+ M+ M+ M+ - Sampl e M Less charge M+ + - Neutraliz up e M High Vac. (5 10-4 Pa) Low Vac. (6Pa~270Pa) 29 1) D.A.Moncrieff,V.N.E.Robinson and L,B.Harrie (1978)

7. Theory of Low vacuum SEM Abnormal Contrast High Vacuum (SE image) Low Vacuum (BSE image) Sample :Rubber Vacc.:15kV 30 Copyright 2008 Hitachi High-Technologies Corporation All Rights Reserved.

7. Theory of Low vacuum SEM Food Plant Sweet potato 50μm 100μm Growth point of asparagus Microbe Germ on rice 300μm mould 50μm 31

7. Theory of Low vacuum SEM Charge up Less charge up TiO 2 High Vacuum / without metal coat TiO 2 20μm High Vacuum / with metal coat Vacc.:5kV Mag.: 1,000 Pressure:~10-3 Pa Sample:Photo-catalyst fibers 32

7. Theory of Low vacuum SEM Comparison: Metal Coated vs. uncoated sample TiO 2 TiO 2 20μm 20μm With Metal Coat (Pt) High Vacuum, BSE Vacc. : 5kV Sample:Photo-catalyst fibers Mag.:x1,000 Without Metal Coat Low Vacuum, BSE Metal coated image (left image ) hardly shows TiO 2 contrast, as the sample surface is covered by metal coating layer. 33 Copyright 2008 Hitachi High-Technologies Corporation All Rights Reserved.

8. 4 segment solid state type BSE detector 34

8. 4 segment solid state type BSE detector Features of Hitachi s BSE detector High sensitivity solid state type BSE (standard) Improve the low kv BSE image quality Short WD(5mm) observation possible Improved response at Fast scan rate allows quick acquisition of area of interest BSE images provide high contrast, compositional information of the sample due to the atomic number differences within the material. 35 Copyright 2008 Hitachi High-Technologies Corporation All Rights Reserved.

8. 4 segment solid state type BSE detector High sensitivity 4-Segment semiconductor detector utilized High resolution 4.0 nm ( 6 Pa 30 kv) Short WD of 5 mm enhances image quality 3-D observation available with 3D-VIEW software (option) 15 kv 5 kv Sample: Calcium 36 carbonate

8. 4 segment solid state type BSE detector Cross section of Coated paper Sample cross section prepared by E-3500 Ar ion cross section polisher Sample :Coated paper for printer Vacc. :10kV Pressure :40Pa 37 Copyright 2008 Hitachi High-Technologies Corporation All Rights Reserved.

8. 4 segment solid state type BSE detector Observation of Metal grain contrast 10kV Mag.:x300 Mag.:x1,000 Sample:Gold (Au) Wire Vacc.:10kV Sample cross section prepared by E-3500 38 Ar ion cross section Copyright 2008 Hitachi High-Technologies Corporation All Rights Reserved.

8. 4 segment solid state type BSE detector EDX analysis position Sample:BGA (Ball Grid Alley) Sample cross section prepared by E-3500 Ar ion cross section polisher 39 Copyright 2008 Hitachi High-Technologies Corporation All Rights Reserved.

8. 4 segment solid state type BSE detector Cu layer Plating laye r Alloy layer Solder layer BSE image Cu-K Ni-K Pb-M Sn-L Mixing of 4 elements 10μm Vacc. : 15kV Mag. : x2k Collected time :3min 40 Copyright 2008 Hitachi High-Technologies Corporation All Rights Reserved.

8. 4 segment solid state type BSE detector Low accelerating Voltage in Low Vacuum mode 5μm Vacc.15kV Vacc.5kV Sample: Scratch card Mag.:x 3,000 Pressure:10Pa 41 Copyright 2008 Hitachi High-Technologies Corporation All Rights Reserved.

8. 4 segment solid state type BSE detector Low accelerating Voltage in Low Vacuum mode Vacc. : 15kV Sample:Photo-catalyst fibers Mag.:x1,000 Pressure:30Pa TiO 2 50mm 20μm Vacc. : 5kV Vacc. : 3kV 42 Copyright 2008 Hitachi High-Technologies Corporation All Rights Reserved.

8. 4 segment solid state type BSE detector 3D- VIEW software (option) 3D model is constructed easily from 4 images obtained from a solid state BSE detector. No sample tilt is required for 3D image. Simple measurement function provided Cross-section profile 43 Copyright 2008 Hitachi High-Technologies Corporation All Rights Reserved.

9. ESED-Ⅱ Environmental Secondary Electron Detector 44

9. ESED-Ⅱ ESED-Ⅱ ESED provides SE image at low vacuum mode. 10nm (30kV, 60Pa) is guaranteed. Sample :PCB BSE image shows sample compositions ESED image shows surface topography of a sample closely 45 Copyright 2008 Hitachi High-Technologies Corporation All Rights Reserved.

9. ESED-Ⅱ ESED-Ⅱ application x5000 Sample : Poly Vinyl Vacc. : 5kV Pressure : 60 Pa x10000 46 Copyright 2008 Hitachi High-Technologies Corporation All Rights Reserved.

9. ESED-Ⅱ Particle BSE image BSE image show Contrast of particles composition ESED ESED image show surface topography of a sample closely Vacc. : 5kV Mag. : 1,000 Pressure : 50Pa Sample : rubber roller 47 Copyright 2008 Hitachi High-Technologies Corporation All Rights Reserved.

Differences to S-3400N/S-3700N series 48

Differences to S-3400N/S-3700N series Manual stage operation (only x,y axes motorization as option available) No dedicated operating console, needs user prepared table Knob panel (focus, magnification, B/C, image shift) only as option BSE detector only with 4 segments No EDX preparation DBC and comm interface only as option 49

END Introduction of Hitachi SU1510 Copyright 2008 Hitachi High-Technologies Corporation All Rights Reserved.