OSFP Connector Cage & Cable System

Similar documents
OCuLink x4 Cable end

PRODUCT SPECIFICATION

zqsfp+stacked Connector and Cage Assembly

PRODUCT SPECIFICATION

Amphenol Amphenol Taiwan Corporation Sheet 1 of 9

Nano Pitch I/O Pluggable Connector

PDS: Rev :A STATUS:Released Printed: Jan 04, 2012

PRODUCT SPECIFICATION

PRODUCT SPECIFCATION GS MINI-SAS HD External Cable to Board Connector System. 1 of 14 F. Roger Cheng TYPE NUMBER

3M 100G QSFP28 Direct Attach Copper Cable Assemblies, 9Q Series

Amphenol Amphenol Taiwan Corporation Sheet 1 of 16

Feb-2016 Rev 1

PRODUCT SPECIFICATION

Product Specification. Mezza-pede SMT Connector Low Profile 1.0mm Pitch

Mini PCI Express Card Socket

Product Specification. CLOUDSPLITTER Connector System

3M SlimLine 85ohm Cable Assembly

PRODUCT SPECIFICATION CUSTOM CONFIGURABLE MODULAR POWER DOCK CONNECTOR SYSTEM

PRODUCT SPECIFICATION

PRODUCT SPECIFICATION

PRODUCT SPECIFICATION

SSL 1.1 Series. Product Data Sheet REV. 4, 2014 JUN

PRODUCT SPECIFICATION

USB 3.0 Plug & Receptacle

Mini PCI Express & msata Connector

PRODUCT SPECIFICATION

Product Specification

PRODUCT SPECIFICATION. This specification defines the detailed requirements for the Minitek Pwr3.0 wire to wire and wire to board connectors.


Product Specification AMP Connector USB Consortium, Plug & Receptacle. Lead Free Version

PRODUCT SPECIFICATION


Aug04 Rev D EC

SPECIFICATION AND PERFORMANCE CHARACTERISTICS OF DVI MALE AND FEMALE CONNECTOR SERIES

3M (TM) Ribbon Cable Socket and Header, 451 and 452 Series.050" x.050" (1.27 mm x 1.27 mm)

Jun-2012 Rev B2

PRODUCT SPECIFICATION

Product Specification

3M Ribbon Cable Socket and Header, Series 451 & " x.050" (1.27 mm x 1.27 mm)

Mar11 Rev C


Amphenol Amphenol Taiwan Corporation Sheet 1 of 11

PRODUCT SPECIFICATION TITLE PAGE REVISION

SPECIFICATION MARCH MULTI MEDIA MEMORY CARD CONNECTOR. Kingfont Precision Ind. Co., Ltd. 17 FL-3, NO. 738, CHUNG CHENG ROAD.

PwrMAX High Power Connector System (Preliminary)

PRODUCT SPECIFICATION. MES3050 Rev A Date 11/06/09 T-Flash Memory Card, Push-Push + SIM Card (6-Pin), Push-Pull (2-in-1 Combo Connector).

Product Specification

PRODUCT SPECIFICATION


Product Performance Specifications QuadraPaddle Connector

Development *** THIS IS NOT A FINAL DRAFT *** SFF-8642 Rev 2.2

Product Specification

Vertical type HDMI Receptacle Connector

AMP-TWIST* 6S Series SL Jack

Product Specification

AMPMODU* MOD I Interconnection System

Product Specification

Product Specification

PRODUCT SPECIFICATION

Product specification

NeXLev Product Specification TB2144

Product Performance Specification Mini Coaxial Connector

SPECIFICATION AND PERFORMANCE CHARACTERISTICS OF CONNECTOR SCSI INTERFACE NFDS & NFDP SERIES


Jun11 Rev A

SPECIFICATION AND PERFORMANCE CHARACTERISTICS OF PCPR CONNECTOR SERIES

07. har-link INTERFACE CONNECTORS

Amphenol. Amphenol. I/O Products. High Speed Interconnects

Meet requirements of USB 2.0

PCI-SIG ENGINEERING CHANGE NOTICE

0.8 pitch 模号 (MODEL NO) 未注公差 RECOMMENDED PCB LAYOUT 1.90* * ±0.

Series PC 3.5 precision subminiature connectors

SPRING - LOADED CONNECTORS

Introduction. Purpose. Introduction to JAE s HDMI Connector, DC* Series

07. har-link Interface Connectors

cpci Series (2mm) Connectors

SMA Series. Specification. Description. Applications Civil & Military Telecommunication Instrumentation SMA SMA. Interface Mating Dimensions

Product Performance Specification Mini Power Connector

SPRING-LOADED CONNECTORS PAD CONNECTORS

SPRING - LOADED CONNECTORS

MLVS 0402 Series Engineering Specification

High-Speed(10 + Gbps) BGA Mezzanine Connectors

HIGH POWER CONTACT ELECTRICAL SPECIFICATIONS

MRJR Rugged RJ45 Connector

Automotive Camera Module RF Connector POK15 Series

07. har-link Interface Connectors

[0.057] 5.8 [0.23]

PRODUCT SPECIFICATION

/June/2014 Rev C

DT Connectors. Features. Connector

PGA / BGA / PLCC SOCKETS

zsfp+ (Small Form-factor Pluggable Plus) 25 Gbps Interconnect System

SERIES MCX 50 MICRO MINIATURE CONNECTORS

2mm Pitch, Multi functional Connector System. (Floating [Board-to-Board], Swing-Lock [Wire-to-Board], Short Pin)

Open NAND Flash Interface Specification: NAND Connector

Solder tail tin lead (60-40) per Mil-P Contact spacing. 125 signal 25 ground (top shield) Contact current rating. 95 signal 19 ground

Amphenol. Printed Circuit Board Technology NAFI + UHD CONNECTORS STANDARD. RELIABLE. PROVEN.

RTE02 and RTE03 Miniature Rotary Switches

Bergstak 0.80mm Pitch Product Presentation

BOARD/WIRE-TO-BOARD CONNECTORS MINITEK UNSHROUDED VERTICAL HEADERS

Transcription:

PAGE /6 /5/7 UNRESTRICTED OSFP Connector Cage & Cable System

PAGE /6 /5/7 UNRESTRICTED.0 SCOPE This Product Specification covers performance, test and quality requirements for the JPC Quad Small Form Factor Pluggable (OSFP) Copper Direct Attach Cable Assembly (DAC) cable, Cage and Connector.0 PRODUCT DESCRIPTION. PRODUCT NAME AND SERIES NUMBER(S) OSFP Board mount connector Product Name Part Number P945A060 Series OSFP EMI Cage Kit ( Spring Type) P945C Series OSFP Copper Cable ( DAC) See Customer Drawing. DIMENSIONS, MATERIS, PLATINGS AND MARKING See Customer Drawing for information on dimensions, material, plating and marking.3 PIN ASSIGNMENTS Pin assignment may vary depending on the cable assembly configuration. Different configuration will have different part numbers within the series. Refer to the appropriate cable sales drawing of the specification part number for correct pin assignment..4 ADDITIONAL GENERAL SPECIFICATION Plug PCB: Material is TU883 Series Overall thickness of paddle PCB is mm over pads s are 30u ' Min Hard Gold plated over 00u Min thick nickel plating Cable end Plug Kit Back shell -Zinc die cast Pull / Press button High temperature thermal plastic Latch - Stainless Steel Bulk Cable See Customer Drawing for information

PAGE 3/6 /5/7 UNRESTRICTED 3.0 APPLICABLE DOCUMENTS AND SPECIFICATIONS EIA 364 Series EIA 364-000 SFF 8679 OSFP Electrical Connector Test Procedures Including Environmental Classifications with Test Procedures Environmental Test Methodology for Assessing the Performance of Connectors and Sockets Used In Business Office Applications QSFP+ 4X Base Electrical Specification, OCTAL SMALL FORM FACTOR PLUGGABLE MODULE 4.0 RATINGS ITEM Voltage Current Temperature Durability SPEC 30 Volts AC (RMS)/DC Max. 0.5 Amps Max Operating: 0 C to 70 C Storage:-0 C to +80 C Pad Plating 0.76μm Au Module Cycles : 50 cycles Connector/Cage Cycles : 00 cycles

PAGE 4/6 /5/7 UNRESTRICTED 5.0 PERFORMANCE (MECHANICAL & ENVIRONMENTAL) 5. TEST GROUP ITEM TEST TEST PROCEDURE CONDITON REQUIRMENT and a current of 00mA Baseline Durability (precondition) EIA-364-09 Perform plug & unplug cycles: 50 times 3 Temperature Life EIA-364-7, method A, Test Condition 3 at 05 ± C : ( 0 hours) Mate Conditioning Exposure 4 ; and a current of 00 ma. <0 mω, max 5 Reseating Manually unplug & plug the connector, 3 cycles 6 ; and a current of 00 ma. <0 mω, max From initial

PAGE 5/6 /5/7 UNRESTRICTED 5. TEST GROUP and a current of 00mA Baseline EIA-364-09 Durability Perform plug & unplug cycles: (precondition) PL-50 times 3 EIA-364-3.Test Condition I Thermal (0Cycles) Shock 0 Hours None 4 <0 mω, max and a current of 00mA 5 EIA-364-3 Cycle connector between 5 ±3 C at Cyclic 80% RH and 65 ±3 C at 50% RH Temperature & 4 cycles. Humidity Ramp times should be 0.5 hour and dwell should be.0 hour None 6 <0 mω, max and a current of 00mA 7 Reseating Manually unplug & plug the connector, 3cycles 8 <0 mω, max and a current of 00mA

PAGE 6/6 /5/7 UNRESTRICTED 5.3 TEST GROUP 3 and a current of 00mA PL-baseline EIA-364-09 Durability Perform plug & unplug cycles: (precondition) PL-50 times 3 Temperature Life (Precondition) EIA-364-7 method A Test condition 3 at 05 ± C 7 hours None 4 <0 mω, max and a current of 00mA EIA-364-8 Test Condition VII Test 5 Condition letter D Discontinuity 5 minutes in each of 3 mutually Mechanical <μsec perpendicular directions. Vibration Both mating halves rigidly fixed to not contribute to relative motion of one contact against another. 6 EIA-364-7 Test Condition letter A Discontinuity 3 shocks in each axis(8) Mechanical <μsec Both mating halves rigidly fixed to Shock not contribute to relative motion of one contact against another. 7 and a current of 00mA <0 mω, max

PAGE 7/6 /5/7 UNRESTRICTED 5.4 TEST GROUP 4 and a current of 00mA baseline EIA-364-09 Durability Perform plug & unplug cycles: (precondition) 50 times 3 Temperature Life (Precondition) EIA-364-7 method A Test condition 3 at 05 ± C 7 hours None 4 <0 mω, max and a current of 00mA 5 Mixed Flowing Gas EIA-364-65 class IIA, 4 days See Note None 6 and a current of 00mA <0 mω, max Cycle connectors 0 times between 5 ±3 C at 80% RH and 85 ±3 C at 50% RH. 7 Thermal Disturbance Ramp should be a minimum of C per minute and dwell times should insure that the contacts reach the temperature extremes for a minimum of 5 minutes None

PAGE 8/6 /5/7 UNRESTRICTED 8 and a current of 00mA <0 mω, max 9 Reseating Manually unplug & plug the connector, 3cycles 0 and a current of 00mA <0 mω, max Note:. For PL, expose / of the specimens unmated for 5 days, mate & un-mate all Specimens time, measure LLCR on all specimens. Expose same / of specimens unmated for 5 days, mate & un-mate all specimens time, measure LLCR on all Specimens. Expose all specimens mated for 5 days, mate & un-mate all specimens time, then to measure LLCR on all specimens. Expose all specimens mated for 5 days, mate & un-mate all specimens time.. Characterize porosity & plating thickness before test sequence.

PAGE 9/6 /5/7 UNRESTRICTED 5.5 TEST GROUP 5 Dielectric Withstanding voltage EIA-364-0: Apply a voltage of 500 VDC for minute between adjacent terminals and between adjacent terminals and ground No disruptive discharge No leakage current in excess of 5mA and a current of 00mA baseline 3 Durability EIA-364-09 Perform plug & unplug cycles: 50 times 4 ; <0 mω, max and a current of 00 ma. 5 Dielectric Withstanding voltage EIA-364-0: Apply a voltage of 500 VDC for minute between adjacent terminals and between adjacent terminals and ground No disruptive discharge No leakage current in excess of 5mA Note:. Separate set of specimens will be used to access dielectric withstanding voltage and change in low level contact resistance.. Dielectric withstanding voltage testing will use different contacts than those used for low level contact resistance testing

PAGE 0/6 /5/7 UNRESTRICTED 5.6 TEST GROUP 6 Measure the temperature rise at the Temperature rated current after 96 hours. Temperature Rise: Rise (45 minutes ON and 5 minutes +30 C maximum (via current OFF). cycling) Fixture as required. 5.7 TEST GROUP 7 Module Mate Forces (Module only) Mate connector at a rate of.7 mm per minute 40N MAX Mating force Module Un-mate Forces (Module only) Un-Mate connector at a rate of.7 mm per minute Un- 30N MAX Unmating force 5.8 TEST GROUP 8 Module Retention Apply force of 5N to the cable module Axial Load with latch enabled 5N MIN No damage Cage Retention (Latch Strength) Measure force necessary to remove OSFP Module from cage assembly with latch enabled 5N MIN No damage

PAGE /6 /5/7 UNRESTRICTED 5.9 TEST GROUP 9 Cage Press-fit Insertion Force Axial load on top of Cage 000N MAXIMUN Insertion force Cage Press-fit Retention Force Axial load on all exposed Press-fit tails simultaneously 4N MINIMUM Retention force 5.0 TEST GROUP 0 Apply force of 75N to the cable No Cable module parallel to the test board and discontinuities of Latitudinal perpendicular to the cage in either μsec or longer Force direction for 0 minutes duration No Cable Apply force of 75N to the cable discontinuities of Longitudinal module perpendicular to the test μsec or longer Force board and downward for 0 minutes duration

PAGE /6 /5/7 UNRESTRICTED 5. TEST GROUP Differential Impedance EIA-364-08 Rise time of 70 ps (0 % - 80 %) 00Ω+/-0Ω Cable Minimum bend Radius EIA-364-4 Cycle in each of 4 Perpendicular directions No physical damage 3 Differential Impedance EIA-364-08 Rise time of 70 ps (0 % - 80 %) 00Ω+/-0Ω 4 Wire Flex EIA-368-4E Flex cable 80 for 5 cycles.5 inch. from back of shell to top of roller Discontinuity <μsec No physical damage 5 Differential Impedance EIA-364-08 Rise time of 70 ps (0 % - 80 %) 00Ω+/-0Ω 6 Cable Strain Relief 5 mm/min,90n min. No physical damage 7 Differential Impedance EIA-364-08 Rise time of 70 ps (0 % - 80 %) 00Ω+/-0Ω

PAGE 3/6 /5/7 UNRESTRICTED 5. TEST GROUP Solderability Per SMES-5 Solder coverage 95% minimum Dimensional: Conformance to SMT Process compatibility See Section 8.0 for JPC Reflow Profile sales Drawing Requirements Visual : No Damage 6.0 PERFORMANCE (HIGH SPEED CHARACTERIZATION) 6. SIGNAL INTEGRITY REQUIREMENTS TEST GROUP 3 (CONNECTOR ONLY) ITEM TEST TEST PROCEDURE REQUIREMENT EIA 364-08 Differential Rise time: 5ps (0-80%) For Reference Only Impedance Includes Host Board 90-0 Ohms (Distribution) (Connector Area) Interface, Connector and Edge Card Interface Within Pair Skew EIA 364-03???? 3 Near End Isolation EIA 364-90 60 MHz to 6 GHz -40 db Min. at 6GHz -30 db Min. at 6~6GHz (Frequencies up to 6 GHz) -.0 db Max. at 6GHz 4 Differential Insertion Loss EIA 364-50 MHz to 6 GHz -.5 db Max. at 6~8GHz -6 db Max. at 8~6GHz (Frequencies up to 6 GHz)

PAGE 4/6 /5/7 UNRESTRICTED 5 Differential Return Loss EIA 364-08 0 MHz to 6 GHz - db Min. at 4GHz -5 db Min. at 4~6GHz (Frequencies up to 6 GHz) Differential 6 7 Common Mode Through Conversion (SCD) Integrated Crosstalk Noise (ICN) 50 MHz to 6 GHz Range of Integration:0 MHz to 3 GHz Aggressor s Peak Amplitude:600Mv Aggressor s 0-80% Risetime:9.6ps 3dB Reference Receiver Bandwith:8.75 GHz -4dB Max. at 6GHz -db Max. at 6~6GHz (Frequencies up to 6 GHz) Total ICN:3 mv rms (All Aggressors Active) Near End Worst Aggressor:mV rms Far End Worst Aggressor:.8mV rms 7.0 PACKAGING 7. CONNECTOR / Cage See Customer Drawing for information on packing 7. PLUG CABLE ASSEMBLY See Customer Drawing for information on packing

PAGE 5/6 /5/7 UNRESTRICTED 8.0 OTHER INFORMATION 8. CONNECTOR ONLY TEST PROFILE DESCRIPTION Average Ramp Rate Preheat Temperature Preheat Time Ramp to Peak Time over Liquid as(7 ) Peak Temperature Time within 5 of Peak Ramp-Cool Down Time 5 to Peak REQUIREMENT 3 C/sec Max 50 C Min to 00 C Max 60 to 80 sec 3 C/sec Max 60 to 50 sec 60+0/-5 C 0 to 40 sec 6 C/sec Max 8 min Max