*RoHS & AE OMPLIANT Features n ompliant with AE-Q00 Rev-- Stress Test Qualification for Passive omponents in Automotive Applications n 00 % electrically compatible with all previous generations of 8 SMT devices n ompatible with Pb and Pb-free solder reflow profiles n RoHS compliant* and halogen free** n Surface mount packaging for automated assembly n Agency recognition: n Standard 453 mm (8 mils) footprint n Patents pending MF-MSMF Series - PT Resettable Fuses Electrical haracteristics Model Environmental haracteristics V max. Volts I max. Amps I hold I trip Resistance Amperes at 3 Ohms at 3 Amperes at 3 Max. Time To Trip Seconds at 3 Operating Temperature... -40 to +85 Passive Aging... +85, 000 hours... ±5 % typical resistance change Humidity Aging... +85, 85 % R.H. 000 hours... ±5 % typical resistance change Thermal Shock... +85 to -40, 0 times... ±0 % typical resistance change Solvent Resistance... MIL-STD-0, Method 5... No change Vibration... MIL-STD-883, Method 007.,... No change ondition A Moisture Sensitivity Level (MSL)... Level ESD lassification - HBM... lass 6 Tripped Power Dissipation Watts at 3 Hold Trip R Min. R Max. Typ. MF-MSMF00 60.0 40 0.0 0.30 0.70 5.00 0.5.50 0.8 MF-MSMF04 60.0 40 0.4 0.34 0.40 6.50.5 0.5 0.8 MF-MSMF00 30.0 80 0.0 0.40 0.40 6.00 6.0 0.06 0.8 MF-MSMF00/60 60.0 40 0.0 0.40 0.40 6.00.5 0.5 0.8 MF-MSMF030 30.0 0 0.30 0.60 0.30 3.00 8.0 0.0 0.8 MF-MSMF050 5.0 00 0.50.00 0.5.00 8.0 0.5 0.8 MF-MSMF050/30X 30.0 40 0.50.00 0.5.00 8.0 0.5 0.8 MF-MSMF050/40X*** 40.0 0 0.50.00 0.5.30 8.0 0.5 0.8 MF-MSMF075 3. 00 0.75.50 0. 0.45 8.0 0.0 0.8 MF-MSMF075/4 4.0 40 0.75.50 0. 0.45 8.0 0.0 0.8 MF-MSMF0 6.0 00.0.0 0.04 0. 8.0 0.30 0.8 MF-MSMF0/6 6.0 00.0.0 0.04 0. 8.0 0.30 0.8 MF-MSMF0/4X 4.0 0.0.0 0.06 0.8 8.0 0.50 0.8 MF-MSMF5 6.0 00.5.50 0.05 0.4 8.0 0.40 0.8 MF-MSMF50 6.0 00.50 3.00 0.03 0.0 8.0 0.5 0.8 MF-MSMF50/.0 00.50 3.00 0.03 0.0 8.0 0.5 0.8 MF-MSMF50/4X 4.0 0.50 3.00 0.03 0.0 8.0.50.0 MF-MSMF60 8.0 00.60.80 0.035 0.099 8.0.0 0.8 MF-MSMF00 8.0 40.00 4.00 0.00 0.080 8.0.0 0.8 MF-MSMF50/6X*** 6.0 00.50 5.00 0.05 0.00 8.0 5.0. MF-MSMF60 6.0 00.60 5.0 0.05 0.080 8.0 5.0 0.8 ***TUV approval pending. Test Procedures And Requirements For Model MF-MSMF Series Test Test onditions Accept/Reject riteria Visual/Mech... Verify dimensions and materials... Per MF physical description Resistance... In still air @ 3... Rmin R Rmax Time to Trip... At specified current, Vmax, 3... T max. time to trip (seconds) Hold urrent... 30 min. at Ihold... No trip Trip ycle Life... Vmax, Imax, 00 cycles... No arcing or burning Trip Endurance... Vmax, 48 hours... No arcing or burning Solderability... ANSI/J-STD-00... 95 % min. coverage UL File Number... E74545 http://www.ul.com/ Follow link to Online ertificates Directory, then enter UL File No. E74545, or click here TÜV ertificate Number... R 00573 http://www.tuvdotcom.com/ Follow link to other certificates, enter File No. 0573, or click here *RoHS Directive 00/95/E Jan. 7, 003 including annex and RoHS Recast 0/65/EU June 8, 0. **Bourns is using the definition that appears to be the prevalent definition used as the industry standard at this time. The Bourns definition of halogen-free is: Bromine (Br) content: 900 ppm; hlorine (l) content: 900 ppm; Total Br + l content: 500 ppm.
Applications n Overcurrent and overtemperature protection of automotive electronics n Hard disk drives n P motherboards n P peripherals n Point-of-sale (POS) equipment n PMIA cards n USB port protection - USB.0, 3.0 & OTG n HDMI.4 Source protection MF-MSMF Series - PT Resettable Fuses Product Dimensions (see next page for outline drawings) Model MF-MSMF00 MF-MSMF04 MF-MSMF00 MF-MSMF00/60 MF-MSMF030 MF-MSMF050 MF-MSMF050/30X MF-MSMF050/40X MF-MSMF075 MF-MSMF075/4 MF-MSMF0 MF-MSMF0/6 MF-MSMF0/4X MF-MSMF5 MF-MSMF50 MF-MSMF50/ MF-MSMF50/4X MF-MSMF60 MF-MSMF00 MF-MSMF50/6X MF-MSMF60 A B D Min. Max. Min. Max. Min. Max. Min. 4.37 4.73 3.07 3.4 0.70.0 0.30 (0.7) (0.86) (0.) (0.34) (0.08) (0.043) (0.0) 4.37 4.73 3.07 3.4 0.70.0 0.30 (0.7) (0.86) (0.) (0.34) (0.08) (0.043) (0.0) 4.37 4.73 3.07 3.4 0.70.0 0.30 (0.7) (0.86) (0.) (0.34) (0.08) (0.043) (0.0) 4.37 4.73 3.07 3.4 0.70.0 0.30 (0.7) (0.86) (0.) (0.34) (0.08) (0.043) (0.0) 4.37 4.73 3.07 3.4 0.70.0 0.30 (0.7) (0.86) (0.) (0.34) (0.08) (0.043) (0.0) 4.37 4.73 3.07 3.4 0.55 0.85 0.30 (0.7) (0.86) (0.) (0.34) (0.0) (0.033) (0.0) 4.37 4.73 3.07 3.4 0.40 0.85 0.30 (0.7) (0.86) (0.) (0.34) (0.06) (0.033) (0.0) 4.37 4.73 3.07 3.4 0.40 0.85 0.30 (0.7) (0.86) (0.) (0.34) (0.06) (0.033) (0.0) 4.37 4.73 3.07 3.4 0.55 0.85 0.30 (0.7) (0.86) (0.) (0.34) (0.0) (0.033) (0.0) 4.37 4.73 3.07 3.4 0.55 0.85 0.30 (0.7) (0.86) (0.) (0.34) (0.0) (0.033) (0.0) 4.37 4.73 3.07 3.4 0.45 0.85 0.30 (0.7) (0.86) (0.) (0.34) (0.08) (0.033) (0.0) 4.37 4.73 3.07 3.4 0.45 0.85 0.30 (0.7) (0.86) (0.) (0.34) (0.08) (0.033) (0.0) 4.37 4.83 3.07 3.4 0.70.60 0.30 (0.7) (0.90) (0.) (0.34) (0.08) (0.063) (0.0) 4.37 4.73 3.07 3.4 0.55 0.85 0.30 (0.7) (0.86) (0.) (0.34) (0.0) (0.033) (0.0) 4.37 4.73 3.07 3.4 0.55 0.85 0.30 (0.7) (0.86) (0.) (0.34) (0.0) (0.033) (0.0) 4.37 4.73 3.07 3.4 0.55 0.85 0.30 (0.7) (0.86) (0.) (0.34) (0.0) (0.033) (0.0) 4.37 4.83 3.07 3.4 0.70.60 0.30 (0.7) (0.90) (0.) (0.34) (0.08) (0.063) (0.0) 4.37 4.73 3.07 3.4 0.55 0.85 0.30 (0.7) (0.86) (0.) (0.34) (0.0) (0.033) (0.0) 4.37 4.73 3.07 3.4 0.55 0.85 0.30 (0.7) (0.86) (0.) (0.34) (0.0) (0.033) (0.0) 4.37 4.83 3.07 3.4 0.70.60 0.30 (0.7) (0.90) (0.) (0.34) (0.08) (0.063) (0.0) 4.37 4.73 3.07 3.4 0.48 0.85 0.30 (0.7) (0.86) (0.) (0.34) (0.09) (0.033) (0.0) Style Packaging: MF-MSMF00 through MF-MSMF030 = 500 pcs. per reel. MF-MSMF050 through MF-MSMF60 = 000 pcs. per reel. MF-MSMF0/4X, MF-MSMF50/4X & MF-MSMF50/6X = 500 pcs. per reel. DIMENSIONS: MM (INHES)
MF-MSMF Series - PT Resettable Fuses Product Dimensions (see previous page for dimensions) Style Top and Bottom View A B Side View Recommended Pad Layout.5 ± 0.05 (.059 ±.00).5 ± 0.05 (.059 ±.00) 3. ± 0. (0.6 ±.004) Terminal material: Electroless Ni under immersion Au Termination pad solderability: Standard Au finish: Meets ANSI/J-STD-00D ategory. D.7 ± 0. (.06 ±.004) Recommended Storage: 40 max./70 % RH max. Style Top View Bottom View Side View Recommended Pad Layout A 8 B.95 ± 0.0 (.4 ±.004) D.68 ± 0.05 (.066 ±.00) 3. ± 0.0 (. ±.004) Typical Time to Trip at 3 00 MF-MSMF00 0 MF-MSMF030 MF-MSMF050/40X MF-MSMF50/ MF-MSMF0/4X MF-MSMF00 The Time to Trip curves represent typical performance of a device in a simulated application environment. Actual performance in specific customer applications may differ from these values due to the influence of other variables. Time to Trip (Seconds) 0. MF-MSMF60 MF-MSMF50/6X 0.0 MF-MSMF60 MF-MSMF50 MF-MSMF5 MF-MSMF04 & MF-MSMF00/60 MF-MSMF0 MF-MSMF075 MF-MSMF00 MF-MSMF0/6 MF-MSMF075/4 0.00 MF-MSMF050 MF-MSMF050/30X 0. 0 00 Fault urrent (Amps)
MF-MSMF Series - PT Resettable Fuses Thermal Derating hart - Ihold (Amps) Ambient Operating Temperature Model -40-0 0 3 40 50 60 70 85 MF-MSMF00 0.6 0.4 0. 0.0 0.08 0.07 0.06 0.05 0.03 MF-MSMF04 0.3 0.9 0.7 0.4 0. 0.0 0.09 0.08 0.06 MF-MSMF00 0.9 0.6 0.3 0.0 0.7 0.5 0.4 0. 0.0 MF-MSMF00/60 0.9 0.6 0.3 0.0 0.7 0.5 0.4 0. 0.0 MF-MSMF030 0.44 0.39 0.35 0.30 0.6 0.3 0. 0.8 0.5 MF-MSMF050 0.77 0.68 0.59 0.50 0.44 0.40 0.37 0.33 0.9 MF-MSMF050/30X 0.77 0.68 0.59 0.50 0.44 0.40 0.37 0.33 0.9 MF-MSMF050/40X 0.77 0.68 0.59 0.50 0.44 0.40 0.37 0.33 0.9 MF-MSMF075.5.0 0.88 0.75 0.65 0.60 0.55 0.49 0.43 MF-MSMF075/4.5.0 0.88 0.75 0.65 0.60 0.55 0.49 0.43 MF-MSMF0.59.43.6.0 0.95 0.87 0.80 0.7 0.60 MF-MSMF0/6.59.43.6.0 0.95 0.87 0.80 0.7 0.60 MF-MSMF0/4X.00.70.40.0 0.95 0.88 0.80 0.73 0.6 MF-MSMF5.80.63.43.5.08 0.99 0.9 0.8 0.68 MF-MSMF50.7.95.7.50.30.8.09 0.97 0.8 MF-MSMF50/.7.95.7.50.30.8.09 0.97 0.8 MF-MSMF50/4X.0.90.70.50.5.3.00 0.88 0.69 MF-MSMF60.30.0.90.60.45.30.5.03 0.9 MF-MSMF00 3.08.7.35.00.80.60.50.40.5 MF-MSMF50/6X 3.90 3.4.96.50.4.98.85.9 0.94 MF-MSMF60 4.00 3.5 3.06.60.34.08.95.39.04 Solder Reflow Recommendations Temperature T P T L TS MAX. TS MIN. 5 t s PREHEAT RAMP-UP t p t L RITIAL ZONE TL TO TP RAMP-DOWN Notes: MF-MSMF models cannot be wave soldered or hand soldered. Please contact Bourns for soldering recommendations. All temperatures refer to topside of the package, measured on the package body surface. If reflow temperatures exceed the recommended profile, devices may not meet the published specifications. ompatible with Pb and Pb-free solder reflow profiles. Excess solder may cause a short circuit, especially during hand soldering. Please refer to the Multifuse Polymer PT Soldering Recommendation guidelines. Designed for single solder reflow operations. t 5 * TO PEAK 8 MINS. Time How to Order MF - MSMF 075/4 - Multifuse Product Designator Series MSMF = 453 mm (8 mils) Surface Mount omponent Hold urrent, Ihold 00-60 (0.0 Amps -.60 Amps) Higher Voltage Option Blank = Standard Voltage /, /6, /4, /30, /40, /60 = Specific Voltage Rated X = Multifuse freexpansion Design MF-MSMF Series Packaging Packaged per EIA 48- - = Tape and Reel Typical Part Marking Represents total content. Layout may vary. 5Y BI-WEEKLY DATE ODE: WEEKS 49-50 = Y YEAR ODE: 5 = 005 PART IDENTIFIATION EXAMPLES: MF-MSMF00 = 0 MF-MSMF050 = 50 MF-MSMF075 & 075/4 = 75 MF-MSMF0 & 0/6 = MF-MSMF50 & 50/ = 5 MF-MSMF00 = 0 8 PART IDENTIFIATION EXAMPLES: MF-MSMF00/60 = MF-MSMF050/30X & /40X = 4 MF-MSMF0/4X = 6 MF-MSMF50/4X = 8 MF-MSMF50/6X = BI-WEEKLY DATE ODE: WEEKS 5-6 = MF-MSMF SERIES, REV. AL, /7 PART IDENTIFIATION Users EXAMPLES: should verify actual device performance in their specific applications. The products described herein and this document are subject to specific disclaimers as set forth on the last page of this document, and at www.bourns.com/legal/disclaimer.pdf.
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