PCI Express XMC to PCI Express Adapter with J16 Connector Breakout DESCRIPTION

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PCI Express XMC to PCI Express Adapter with J16 Connector Breakout FEATURES Adapt one XMC.3 (PCI Express VITA 42.3) module to a PCI Express slot PCI Express x1 lane interface Active signal equalization and compensation for robust operation in any PC Transparent operation P16 connector breakout to MDR68 Triggering and clocking support features for Innovative X3 IO modules IEEE 1384 XMC mechanicals >50W power provided to the module Optional connection to host power supply provides extended power capacity to the module 8 CFM fan (consumes 2nd slot) Conduction cooling (VITA20) for module ½ size PCI Express card APPLICATIONS Add XMC modules to standard PCIe host systems Custom interfaces to XMC P16 Multi-card system synchronization and control SOFTWARE No software required V 3.0 DESCRIPTION The PCI Express to XMC adapter allows a single width XMC module to be used in a PCI Express slot. The XMC site is VITA 42.3 compatible and supports a single PCI Express lane. The adapter is completely transparent to PCI Express. The adapter helps to compensate for poor system signal quality by providing adjustable signal equalization and compensation for the high speed PCI Express signals. The P16 connector breakout provides convenient access to all P16 signals through an MDR 68 connector. Signals from P16 are routed as differential pairs to JP1 so that high speed IO standards can be used to the cable. More power to the XMC module may be provide by using the optional power connector to the adapter card. The power connector provides +12V to the adapter and powers an oncard 3.3V module capable of 8A. The power connector is compatible with standard ATX power connectors in PC systems. XMC module cooling is provided with a fan and also using conduction cooling per VITA standard 20. The bracket mates to standard PMC end brackets and supports an EMI gasket. All connectors from the XMC end bracket are fully accessible. No software is required to operate the adapter. Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Innovative Integration products and disclaimers thereto appears at the end of this data sheet. All trademarks are the property of their respective owners. PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of the Innovative Integration standard warranty. Production processing does not necessarily include testing of all parameters. 05/25/08 2007

This electronics assembly can be damaged by ESD. Innovative Integration recommends that all electronic assemblies and components circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage. ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications. ORDERING INFORMATION Product Part Number Description PCIe-XMC Adapter 80172-0 PCIe-XMC Adapter Breakout and Cable 80116-1 Screw terminal assembly and 36 inch (0.91 m) pleated foil flat ribbon MDR68 cable MDR68 cable 65057 MDR68 male to male cable assembly, pleated foil shielded flat ribbon, 36 inches (0.91 m) 2 of 10

JP3 Auxiliary Power Connector JP3 provides +12V to the XMC. Pin Power 1, 3, 5 +12V 2, 4, 6 Ground Caution: incorrect connections may cause damage! Mating connector is Molex 70156 or equivalent. Power Capability Delivered to the XMC Volts Amps 3.3V Supplied by PCIe bus or DC-DC converter, as selected by JP1. +12V Supplied by JP3, a disk drive connector from the host computer -12V 1A max (supplied by on-card DCDC) ** XMC cooling may be required Specifications Power Consumption 3.3V @ 0.1A maximum (adapter only) Trigging and Clocking Features Physicals Form Factor PCI Express half card Size 4.20 in x 6.49 in Slots Consumes 2 slots when fan is installed; single slot without fan Weight 100g Trigger inputs 2, single-ended, >1M, to J16 pins Clock Inputs 2, single-ended, 50 ohm, converted to LVDS differential pairs connected to J16 Clock levels 0 = <0.7V, 1 = >2.4V -0.3V min, 3.6V Connector SMB female, vertical Cooling XMC Site Form Factor 75x150 mm modules (IEEE 1386) Mounting height 10mm for single slot Specification VITA 42 Fan Conduction Cooling Specifications ~8 CFM Conduction cooling from module to adapter and chassis VITA 20 Conduction Cooling 3 of 10

JP5 Install for +12V from the PCIe bus JP1 When installed, 3.3V is from the PCIe bus Caution: Do not use w hen U1 DC-DC is installed J1 REF CLK J2 SAMPLE CLK JP3 Auxiliary pow er J4 TRIGGER 0 J3 TRIGGER 1 JP2 -XMC P16 Breakout PCI Express x1 lane Applications Information Hosting XMC Modules in PCI Express Systems The adapter is used to host PCI Express XMC modules in desktop PCI Express slots. A single lane of PCI Express connection is provided. The adapter card has a single XMC module site conforming to VITA 42.3 Express, with standard IEEE 1386 mechanicals. The module is the same size as older PMC modules. The module has a 10mm mounting height. If the fan is mounted to the adapter, the assembly consumes two slots. If the fan is removed, the adapter with a module mounted on it fits in a single PCI Express slot. PCI Express Compatibility The adapter uses a Pericom PI2EQX4401 re-driver between the PCI Express host bus and XMC PCI Express interface. This re-driver chip buffers the PCI express lanes and clock signals. The equalization and signal amplification are programmable using the DIP switches on the card. This allows the card to be tuned to operate in adverse conditions where the PCI Express signals weak or distorted. The re-driver supports 1 active lane and is compatible with PCI Express Base Specification Rev 1.0a. The PCI Express lane operates at 2.5 Gbps. Multiple lane PCI Express modules are also compatible with the adapter. 4 of 10

The signal equalization and amplification can be set using the two DIP switches. These switches must be set when power to the card is off. DIP Switch Controls SW1 Transmit (PCIe to XMC) SW2 Receive (XMC to PCIe) Switch 2:1 Settings (ON = 0, OFF = 1) Equalization [ON ON] (00) = no equalization [DEFAULT] [ON OFF] (01) = [0:2.5dB] @ 1.25 GHz [OFF ON] (10) = [2.5:4.5dB] @ 1.25 GHz [[OFF OFF] (11) = [4.5:6.5dB] @ 1.25 GHz 3 Output Swing Control ON = 1x [DEFAULT] OFF = 1.2x 4 De-emphasis ON = 0 db [DEFAULT] OFF = -3.5 db In general, the default settings work best in most systems. If adjustment is required, then first adjust the host side parameters first: equalization on SW1 (switches 1 and 2), and deemphasis and output swing control on SW2 (switches 3 and 4). Power to the XMC Module The XMC site provides +3.3V, +12V and -12V to the module. The power can be sourced from either the PCIe bus slot or by using an auxiliary power connection to J3. Jumpers are used to select the power source as shown in the following table. 5 of 10

Jumper Function Settings Notes JP1 Selects either 3.3 V to the XMC from the PCIe bus or the DC-DC converter. Short: 3.3V is from the PCIe bus. ** For 3.3V from the PCIe bus, the DC-DC MUST be removed. ** DC-DC provides 8A maximum. PCIe bus slot can provide from 2 to 10A depending on slot power capacity. Open: 3.3V is from the DC-DC converter (default configuration) JP5 Selects the +12V source for the XMC and adapter. Short: +12V is from the PCIe bus. Open: +12V is from JP3. Most PCIe bus slots provide 1-2A for 12V. It is not recommended to plug JP3 when JP5 is shorted. The adapter can source power from either the PCIe slot or from the auxiliary power connector JP3. Since many PCIe slots have low power capacity in desktop PCs, the auxiliary power connector is used if the PCIe slot cannot supply enough power to the XMC module. As delivered the card is configured to use power from the PCIe bus. To change the power source to JP3, remove the jumper JP5. DO NOT HOT PLUG THE JP3 POWER CONNECTOR! Damage may occur! J16 Breakout to JP2 The P16 connector from the XMC module is connected to JP2 according to the schematic shown. There are 46 signals routed to the connector, most of them as signal pairs (100 ohm differential impedance, 50 ohm single ended). The signals pairs are well suited for use as LVDS or LVPECL differential pairs. All signal pairs are matched to within 0.020 inches. Signal pairs are denoted by the circled wires on the following schematic. Connector is 3M 10268-55H3VC or equivalent. Mating connector is 3M 10168-6010EC or equivalent. Signal Pair J16 pins JP2 pins Signal J16 pin JP2 pin DIO0/DIO1 C1/C2 1/35 DIO22/DIO23 F4/F5 17/51 DIO2/DIO3 C3/C4 2/36 DIO24/DIO25 F6/F7 19/53 DIO4/DIO5 C5/C6 4/38 DIO26/DIO27 F8/F9 20/54 DIO6/DIO7 C7/C8 5/39 DIO28/DIO29 F10/F11 22/56 DIO8/DIO9 C9/C10 7/41 DIO30/DIO31 F12/F13 23/57 DIO10/DIO11 C11/C12 8/42 DIO32/DIO33 F14/F15 25/59 DIO12/DIO13 C13/C14 10/44 DIO34(Trig 1)/DIO35 F16/F17 26/60 6 of 10

DIO14/DIO15(Trig 0) C15/C16 11/45 DIO36/DIO37 F18/F19 28/62 DIO16/DIO17 C17/C18 13/47 DIO38/DIO39 A9/B9 29/53 DIO18 C19 14 DIO40/DIO41 D9/E9 31/65 DIO19 F1 48 DIO42/DIO43 A19/B19 32/66 DIO20/DIO21 F2/F3 16/50 DIG_CLKP/ DIG_CLKN D19/E19 34/68 Triggering and Clock Inputs for Innovative X3 Family of I/O Modules 7 of 10

The adapter has special support for Innovative's X3 family of XMC IO modules that provides two trigger and two clock inputs. These signals can be used to for system synchronization and triggering such as simultaneous sampling across many modules. Connector Signal Direction Termination P16 Connection Use J1 EXT REF Input 50 ohms D9(+)/E9(-) Reference clock input. X3 modules can use this signal as a reference to their PLL for sample rate generation. J2 EXT CLK Input 50 ohms A9(+)/B9(-) Sample clock input. X3 modules can use this signal, a or 1 to 32 division of it, as a sample clock. J4 TRIG 0 I/O >1M ohm C16 Trigger input 0. X3 modules can use this signal as a trigger input or output. J3 TRIG 1 I/O >1M ohm F16 Trigger input 1. X3 modules can use this signal as a trigger input or output. Cooling the XMC Module Many XMC modules will require forced air cooling. The adapter has a large opening under the XMC module for air flow. The module site supports conduction cooling per VITA standard 20. The conduction areas are connected a thermal plane in the adapter that spreads the heat through the card and to the front panel bracket, providing greater cooling capacity to the module. The thermal plane is NOT connected to the electrical ground, but rather chassis ground. The through holes for cooling bars are for a 2mm screw. Software Driver: No software is required. 8 of 10

Cables The P16 breakout uses a pleated foil ribbon cable assembly mating to the JP2 connector. Innovative offers a cable assembly (P/N 65057) and screw terminal assembly for convenience (P/N 80116-1). The cable assembly generally offers performance up to >50 MHz when differential signaling such as LVDS is used. Single ended signals are limited to about 10 MHz. 9 of 10

IMPORTANT NOTICES Innovative Integration Incorporated reserves the right to make corrections, modifications, enhancements, improvements, and other changes to its products and services at any time and to discontinue any product or service without notice. Customers should obtain the latest relevant information before placing orders and should verify that such information is current and complete. All products are sold subject to Innovative Integration s terms and conditions of sale supplied at the time of order acknowledgment. Innovative Integration warrants performance of its hardware products to the specifications applicable at the time of sale in accordance with Innovative Integration s standard warranty. Testing and other quality control techniques are used to the extent Innovative Integration deems necessary to support this warranty. Except where mandated by government requirements, testing of all parameters of each product is not necessarily performed. Innovative Integration assumes no liability for applications assistance or customer product design. Customers are responsible for their products and applications using Innovative Integration products. To minimize the risks associated with customer products and applications, customers should provide adequate design and operating safeguards. Innovative Integration does not warrant or represent that any license, either express or implied, is granted under any Innovative Integration patent right, copyright, mask work right, or other Innovative Integration intellectual property right relating to any combination, machine, or process in which Innovative Integration products or services are used. Information published by Innovative Integration regarding third-party products or services does not constitute a license from Innovative Integration to use such products or services or a warranty or endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property of the third party, or a license from Innovative Integration under the patents or other intellectual property of Innovative Integration. Reproduction of information in Innovative Integration data sheets is permissible only if reproduction is without alteration and is accompanied by all associated warranties, conditions, limitations, and notices. Reproduction of this information with alteration is an unfair and deceptive business practice. Innovative Integration is not responsible or liable for such altered documentation. Resale of Innovative Integration products or services with statements different from or beyond the parameters stated by Innovative Integration for that product or service voids all express and any implied warranties for the associated Innovative Integration product or service and is an unfair and deceptive business practice. Innovative Integration is not responsible or liable for any such statements. For further information on Innovative Integration products and support see our web site: www.innovative-dsp.com Mailing Address: Innovative Integration, Inc. 2390A Ward Avenue, Simi Valley, California 93065 Copyright 2007, Innovative Integration, Incorporated 10 of 10