Product End-of-Life Disassembly Instructions

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of items included in product Printed Circuit Boards (PCB) or Printed Circuit With a surface greater than 10 sq cm 2

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With a surface greater than 10 square cm All types including standard alkaline and lithium coin or button style batteries

(DVD-PC-3 / MO-PC) x MO-PC HP RP x. Total weight [kg] Address Orteliuslaan 1000

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Transcription:

Product End-of-Life Disassembly Instructions Product Category: Notebooks and Tablet PCs Marketing Name / Model [List multiple models if applicable.] HP Folio 13 Notebook PC Purpose: The document is intended for use by end-of-life recyclers or treatment facilities. It provides the basic instructions for the disassembly of HP products to remove components and materials requiring selective treatment, as defined by EU directive 2002/96/EC, Waste Electrical and Electronic Equipment (WEEE). 1.0 Items Requiring Selective Treatment 1.1 Items listed below are classified as requiring selective treatment. 1.2 Enter the quantity of items contained within the product which require selective treatment in the right column, as applicable. Quantity of items Item Description Notes included in product Printed Circuit Boards (PCB) or Printed Circuit Assemblies (PCA) Batteries Mercury-containing components Liquid Crystal Displays (LCD) with a surface greater than 100 sq cm Cathode Ray Tubes (CRT) Capacitors / condensers (Containing PCB/PCT) Electrolytic Capacitors / Condensers measuring greater than 2.5 cm in diameter or height External electrical cables and cords Gas Discharge Lamps Plastics containing Brominated Flame Retardants Components and parts containing toner and ink, including liquids, semi-liquids (gel/paste) and toner Components and waste containing asbestos Components, parts and materials containing refractory ceramic fibers Components, parts and materials containing radioactive substances With a surface greater than 10 sq cm Mother board All types including standard alkaline and lithium coin or button style batteries battery and RTC battery For example, mercury in lamps, display backlights, scanner lamps, switches, batteries Includes background illuminated displays with gas discharge lamps LCD Include the cartridges, print heads, tubes, vent chambers, and service stations. EL-MF877-00 Page 1 1 2 1

2.0 Tools Required List the type and size of the tools that would typically be used to disassemble the product to a point where components and materials requiring selective treatment can be removed. Tool Description Description #1 screw driver Description #2 Description #3 Description #4 Description #5 Tool Size (if applicable) Philip #1 / TORX T 3.0 Product Disassembly Process 3.1 List the basic steps that should typically be followed to remove components and materials requiring selective treatment: 1. remove KB 2. remove log up 3. remove battery 4. remove LCD module 5. remove USB board 6. remove SPEAKER module 7. remove FAN module 8. remove SPEAKER module 9. remove WLAN modul 10. remove SSD module 11. remove MB 12. divide Logic_up assy (remove power board) 13. divide Logic_up assy (remove TP brk) 14. divide Logic_up assy (remove TP module) 15. divide Logic_up assy (remove ESD board) 16. divide Display assy (remove lcd_bezel) 17. divide Disply assy (remove LCM module) 18. divide Display assy (remove antenna cable) 19. divide Disply assy (remove webcam module) 20. divide Display assy (remove LVDS cable) 21. divide MB (remove RTC battery) 3.2 Optional Graphic. If the disassembly process is complex, insert a graphic illustration below to identify the items contained in the product that require selective treatment (with descriptions and arrows identifying locations). EL-MF877-00 Page 2

Step 1 Remove KB Step2 Remove log up Step 3 Remove battery Step4 Remove LCD module EL-MF877-00 Page 3

Step 5 Remove USB board Step 6 Remove SPEAKER module Step 7 Remove FAN module Step 8 Remove SPEAKER module EL-MF877-00 Page 4

Step 9 Remove WLAN module Step 10 Remove SSD module Step11 Remove MB Step 12 divide Logic_up assy (remove power board) EL-MF877-00 Page 5

Step13 divide Logic_up assy (remove TP brk) Step 14 divide Logic_up assy (remove TP module) Step15 divide Logic_up assy (remove ESD board) Step 16 divide Display assy (remove lcd_bezel) EL-MF877-00 Page 6

Step17 divide Disply assy (remove LCM module) Step 18 divide Display assy (remove antenna cable) Step19 divide Disply assy (remove webcam module) Step 20 divide Display assy (remove LVDS cable) EL-MF877-00 Page 7

Step21 divide MB (remove RTC battery) EL-MF877-00 Page 8