iphone 5 and iphone 7 (April 14 and 17, 2017) iphone 5 WiFi module iphone 7 battery application processors wafer level packaging 3D NAND 1
iphone 5 2
WiFi Front End in iphone 5 3
Broadcom BCM4334 inside the Murata 331S0171 MCM 4
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Smartphone Front End 6
We ll close the detailed portion of this blog with a look at the Antenna Tuning Modules supplied by RF Micro. The RF1101 is a high power SPDT Switch and the RF1102 helps by optimizing the iphones antennas for the specific bands in use. This lowers the power consumption of the phone whilst also allowing the carriers the ability to add more customers to the network. 7
iphone 5 and iphone 7 (April 14 and 17, 2017) iphone 5 WiFi module iphone 7 battery application processors wafer level packaging 3D NAND 8
iphone 7: Battery Actually, it's a relatively benign Lithium ion battery. This 3.8 V, 1960 mah battery is rated for a capacity of 7.45 Wh a notable increase from the 6.55 Wh battery in last year's model. iphone 4: 115.2 mm x 58.6 mm x 9.3 mm; 1400 mah No major improvement in storage density. 138.3 x 67.1 x 7.1 mm 9
Black sheet covering the logic board 10
Logic Board A 11
Number of Transistors iphone 4 << 1 Billion iphone 5 1 Billion iphone 6 2 Billions iphone 7 3.3 Billions A10, 125 mm 2 12
Application Processors 13
Application Processors 14
Application Processors 15
iphone 6 s A8 Processor 16
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A10 vs. A9 The A10 is the first Apple produced quad core SoC, with two high performance cores and two energyefficient cores. Apple claims that the highperformance cores are 40% faster than Apple's previous A9 processor and that the two high efficiency cores consume 20% of the power of the high performance Hurricane cores. Apple states that it has 40% greater CPU performance and 50% greater graphics performance compared to its predecessor, the Apple A9. The new 6 core GPU built into the A10 chip is 50% faster while consuming 66% of the power of its A9 predecessor. 18
iphone 5 and iphone 7 (April 14 and 17, 2017) iphone 5 WiFi module iphone 7 battery application processors wafer level packaging 3D NAND 19
Fan Out WLP and Other Packaging Solutions 20
Different Packaging Solutions Now that it appears the 40 to 50 percent improvement in performance in the newest Apple A10 processor is largely from its wafer-level fan out packaging from TSMC, demand for the packaging approach is ramping fast. This is one of the fastest ramps we ve seem for a package in a long time, said TechSearch International president Jan Vardaman. It s a very disruptive technology that will have a big impact on the industry. The thinner, lower-cost packaging approach is also showing up in RF and audio codec chips in mobile phones, with ~2 billion units just in Samsung and Apple phones, potentially bringing big changes to the packaging materials market. Laminate substrate suppliers will see demand plunge, copper post suppliers will see little change, and makers of wafer-level dielectrics could potentially see 3X growth in volume. But don t think you ll see that in revenue, since customers will really beat the prices down. 21
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TSMC InFO (Integrated Fan Out) 23
InFO WLP for A10 A10 Memory 24
InFO WLP the Vertical Interconnect Pillars in the in FO WLP are about 250 um dia at an aspect ratio of 1:1 and are at a pitch of 350 um, no d 25
Apple A10 A10 26
iphone 5 and iphone 7 (April 14 and 17, 2017) iphone 5 WiFi module iphone 7 battery application processors wafer level packaging 3D NAND Qualcomm Snapdragon 27
Qualcomm Snapdragon Snapdragon is a suite of system on a chip (SoC) semiconductor products designed and marketed by Qualcomm for mobile devices. The Snapdragon central processing unit (CPU) uses the ARM RISC instruction set, and a single SoC may include multiple CPU cores, a graphics processing unit (GPU), a wireless modem, and other software and hardware to support a smartphone's global positioning system (GPS), camera, gesture recognition and video. 28
Snapdragon 835 29
Logic Board B Update! The Toshiba 3D NAND was in fact found in the 256GB version of the smartphone we tore down. 30
3D NAND 31
Toshiba BiCS for Bit Cost Scaling 32
NAND 33
3D NAND https://www.extremetech.com/computing/21 1812 planar nand flash is dead all hail ournew 3d nand overlords 34
3D NAND 35
3D NAND 36
3D NAND Die photograph Vertical NAND cell structure 37
iphone 5 and iphone 7 (April 14 and 17, 2017) iphone 5 WiFi module iphone 7 battery application processors wafer level packaging 3D NAND 38