Bluetooth ual Mode Module Part No (ray) Part No (ape & Reel) 24/JAN/2017 2.55mm A A 18.9mm Revised 12.71mm Features Bluetooth ual Mode (v2.0, v2.1, v4.0 and v4.1) Requires no external hardware Class 2 x Output Power I2C, UAR and USB 2.0 (Full Speed) Low Power Consumption IC Antenna Onboard Serial Port Profile (SPP) F Programmable Standalone Module (With Embedded Bluetooth v4.1 Stack) Application Firmware support Individual PWM channels (3 on dedicated LE pads) 6 digital and 3 analogue 18.9mm x 12.71mm X 2.55mm SM Side and Bottom Pads for easy production RoHS, REACH and WE Compliant Solution Includes UAR to SPP Bridge Application Overview he Bluetooth ual Mode module is a versatile and cost effective solution designed for use as a GAP Central (master) or GAP Peripheral device. his allows your embedded system to wirelessly communicate with other nearby Bluetooth v2.0, 2.1 and Bluetooth v4.0, v4.1 enabled devices (e.g. ios and Android). he is also ideal for streaming high quality data and establishing Bluetooth low energy connections. his single core standalone module combines a Bluetooth v2.0, v2.1 and Bluetooth v4.0, v4.1 radio using a dual mode Bluetooth v4.1 stack, plus a microcontroller unit with an 8 Mbit flash memory for running the application. It also incorporates 29 pin outs, including I2C, UAR and USB for interfacing with sensors and many other peripheral devices. It s SM side and bottom pads allow for easy manufacture and placement within your product. LM offer bespoke integration into your product by supporting your developer, including development of new applications for the module. We also offer Bluetooth v4.1 demo applications, which can be customised to your specification. he module can be used as a bridge between Bluetooth v2.0, 2.1 and Bluetooth v4.0, v4.1 devices, using our SPP to UAR Bridge Application. eveloped firmware and configuration settings can be preloaded to the module before supply. Page 1 of 15
Bluetooth ual Mode Module Part No (ray) Part No (ape & Reel) General Specification v4.1 (Backwards compatible with v2.0, v2.1 and v4.0) Module ype Standalone (Configurable with A Commands) Profiles SPP Hardware CSR Chipset IC Antenna Onboard Antenna Microcontroller (MCU) 56 KB (12K x 24-bit) M Program Interface SPI I2C, UAR, USB 2.0 (Full Speed), AIO, PIO and PWM Interfaces 5V (VCHG/VBUS) or 2V8 (VBA) Power Supply Crystal Oscillators evelopment Kit 26 MHz LM55X F RF Characteristics Frequency 80 MHz RISC MCU 8 Mbit Flash Memory ata Rate A A Bluetooth Standard Wireless Up to 3Mbps 2.4 GHz to 2.485 GHz Physical Characteristics -40 C to +85 C imensions (L x W x H) 18.9mm x 12.71mm x 2.55mm Weight 0.84 g Certifications BA Operating emperature Compliance Page 2 of 15 RoHS, REACH and WE
Bluetooth ual Mode Module Part No (ray) Part No (ape & Reel) Firmware he Bluetooth ual Mode module is configured by using A commands in configuration mode. he A command set controls the primary operations such as information enquiry, connection/ disconnection set up and settings. he module is configured via its UAR interface from a microcontroller or PC, using a MCU software or Hercules SEUP utility respectively. At the start of every power up cycle the enters the configuration mode. Please refer to the A Commands user manuals for the BR / ER and Bluetooth low energy connection configurations details: A A A Commands Manual BR / ER - http://lm-technologies.com/951atc A Commands Manual Bluetooth LE Connections - http://lm-technologies.com/951atb A commands are used to establish BR/ ER and Bluetooth LE connections. In data mode, data can be transmitted and received between the Bluetooth v2.0, 2.1 and Bluetooth Smart devices via the (Bluetooth ual Mode Module). By using our SPP to UAR Bridge application. And the UAR interface represents the data channel once a connection is established. o break the connection and enter the configuration mode again, the has to be powered off. efault Factory Settings evice Settings UAR Settings iscoverable : YES evice Name: _PROO_01 Echo of command: YES Response to commands: YES efault Security mode 2.1 Baud rate : 19200 Stop bit : ONE Parity bits: NONE Flow Control: None Bluetooth Low Energy Settings SPP Role : SLAVE Escape sequence check enabled: YES GAP Role: Central GA ROLE: Client SSP 2.1 Settings F Bluetooth v2.0, 2.1 Profile Settings IoypesSupported : io capability keyboard only ForceManInheMiddle : RUE ynamicpinenb: RUE, Page 3 of 15
Bluetooth ual Mode Module Part No (ray) Part No (ape & Reel) Bluetooth Applications he module can run full application code for a wide range of industries. his includes the automotive, M2M (industrial cable replacement), EPOS, health & fitness and consumer electronics (e.g. printers and wearable technologies) industries. Only limited by the imagination of the embedded developer. he modules can run Bluetooth v2.0, 2.1 or Bluetooth v4.0, v4.1 applications. epending on whether the embedded developer requires a low-energy Bluetooth connection, a high-quality data stream Bluetooth connection or both simultaneously. Alert ag Key Fob Beacon Blood Pressure Sensor Cycling Speed and Cadence Sensor Environment Sensor A A LM echnologies offer both Bluetooth v4.0, v4.1 and Bluetooth v2.0, 2.1 application support. his includes assisting the developer and creating new applications with the modules: Health hermometer Security ag Heart Rate Sensor Serial Communication Keyboard ime Client Multifunction Steering Wheel emperature and Pressure Mouse Weight Scale Printer Glucose Sensor Running Speed and Cadence Sensor Example Applicaiton LM SPP to UAR Bridge Application he module can act as a bridge between a Bluetooth v2.0, 2.1 device and a Bluetooth v4.0, v4.1 device. By using our Bluetooth ual Mode application SPP to UAR Bridge. Allowing Bluetooth v2.0, 2.1 data to be transmitted to a Bluetooth v4.0, v4.1 device through the or vice versa v2.1 User Application SPP F Bluetooth RFCOMM Bluetooth v4.1 User Application GAP X GA SMP A L2CAP Link Manager Link Layer BR/ER PHY LE PHY L2CAP LM048 CONNECION A CONNECION B LM931 UAR over GA: Bluetooth v2.0, 2.1 data to a Bluetooth v4.0, v4.1 device, for example our LM931 UAR over SPP: Bluetooth Smart data to a Bluetooth v2.0, 2.1 device, for example our LM048 Page 4 of 15
Bluetooth ual Mode Module Part No (ray) Part No (ape & Reel) Start Connect to Bluetooth v2.0, 2.1 device with SPP profile (Master or Slave) he SPP to UAR Bridge application flow diagram below outlines the steps to setup the bridge : Connection A A A enters in Configuration Mode Search Bluetooth low energy devices Connect with Bluetooth low energy device scans the services on Bluetooth low energy device Connection B scans service for Serial over GA characteristics detects Serial Service writes serial CCFG flag and SPP characteristics Set the device in SPPAAMOE F receives data from Bluetooth low energy/v2.0, 2.1 device & transmits to v2.0, 2.1/Bluetooth low energy device isconnect Bluetooth v2.0, 2.1 connection isconnect Bluetooth low energy device connection Stop Note 1. Connection A and Connection B sequence can be interchanged. 2. After Connection A, the device must be in Configuration Mode. 3. he must enable the Serial CCFG flag on the Bluetooth low energy oeripheral to transmit data. 4. No specific order is required for disconnection. Page 5 of 15
Bluetooth ual Mode Module Part No (ray) Part No (ape & Reel) Powering he can be powered in one of 2 ways: 29 1) Powered through the VCHG/VBUS (Pin 21) 2) Powered from a Lithium ion / Lithium polymer battery through VBA (Pin 19) 21 A A 19 11 PIN 1 10 F Pin Outs GN GN LE_0 AIO_1 LE_1 AIO_2 LE_2 RS USB_P PIO_0 / SCL USB_N AIO_0 GN VBA_SENSE PIO_1 / SA CHG_EX Page 6 of 15 VBA SPI_MOSI SPI_CLK SPI_ENABLE GN SPI_CS VREGENABLE SPI_MISO PIO_3 / UAR_X PIO_5 / UAR_CS VCHG / VBUS PIO_4 / UAR_RS PIO_2 / UAR_RX
Bluetooth ual Mode Module Part No (ray) Part No (ape & Reel) Pin Assignments ype escription ypical 1 GN Ground Common Ground 0V 2 AIO_0 Input Analog Input 3 AIO_1 Input Analog Input 4 AIO_2 Input Analog Input 5 RS Input 6 PIO_0/ SCL 7 GN Ground 8 PIO_1/ SA 9 PIO_2/ UAR_RX 10 PIO_3/ UAR_X 11 PIO_4/ UAR_RS 12 PIO_5/ UAR_CS 13 SPI_MISO 14 SPI_CS 15 GN 16 Pin Name A A Programmable Input / Output or I2C Serial Clock Common Ground 0V Programmable Input / Output or I2C Serial ata Programmable Input / Output or UAR Receive Programmable Input / Output or UAR ransmit Programmable Input / Output or UAR RS Programmable Input / Output or UAR CS SPI Master In Slave Out SPI Chip Select Ground Common Ground 0V SPI_ENABLE SPI Enable (CSR) 17 SPI_CLK SPI Clock 18 SPI_MOSI SPI Master Out Slave In 19 VBA Power Battery input 2V8 20 VREGENABLE Power Voltage Regulator Enable 1V 21 Power Battery Charger Input/ Positive Power Supply 5V (3V - 6.5V) 22 CHG_EX Power External Battery Charge Control 0V - 6.5V & 0mA-20mA 23 VBA_SENSE Power Battery Charger Sense Input 200mV (195mV - 205mV) 24 USB_N USB Negative 25 USB_P USB Positive 26 LE_2 Output PWM / LE 2 27 LE_1 Output PWM / LE 1 28 LE_0 Output PWM / LE 0 29 GN Ground Common Ground 0V F Reset VCHG/VBUS Page 7 of 15
Bluetooth ual Mode Module Module Block iagram Part No (ape & Reel) AN PWM AIO B_RF CSR Chipset VCHG / VBA Filter Part No (ray) SPI (ebug) I2 C FLA 8 Mbit A A UAR/PIO SIO USB XAL F 26MHz Page 8 of 15
Bluetooth ual Mode Module Part No (ray) Part No (ape & Reel) op View 20 Pin 29 Physical imensions 19 1.27 A A 8.3mm 11.5mm 12.71mm 1.27 Pin Spacing 1.27 Pin 1 0.381mm 1.981 10 6.20mm 18.90mm F Front View 2.1mm 2.55mm 0.8mm 6.20mm 18.90mm 1.981 Side View 2.1mm 2.55mm 0.8mm 1.21mm 4.41mm 12.71mm Page 9 of 15
Bluetooth ual Mode Module Part No (ray) Part No (ape & Reel) EGE OF HOS PCB ( Optimal ) A A Optimal Placement Position PCB Footprint Pin 1 Placement Note If the optimal placement position cannot be achieved, ensure there is no metal beneath the highlighted part of module. Pin 1 29 20 19 1.27 1.27 3.81mm 7.87mm 12.71mm F NB Aim to place the module away from interference. (i.e: place the module at the edge of the board.) NO MEAL BENEAH HIS AREA Pin Spacing Pin 1 1.70mm 1.0mm 10 6.20mm 18.90mm Page 10 of 15
Bluetooth ual Mode Module Part No (ray) Part No (ape & Reel) F A A Soldering Reflow Chart Page 11 of 15
Bluetooth ual Mode Module Part No (ray) Part No (ape & Reel) ape and Reel Packaging 0.15mm 4mm 32mm A A 19.9 20mm ape imensions 0.32mm 13.8mm 3mm 330mm Notes F Reel imensions Carton imensions (L x W x H): 360mm x 290mm x 370mm Quantities 1000 modules per ape 4 Boxes per Carton 4000 modules per Carton 36mm 92mm Page 12 of 15
Bluetooth ual Mode Module Part No (ray) Part No (ape & Reel) ray Packaging LM961 10mm 8.7mm ray imensions 6 X 10 5mm A A 6.3mm 143mm 312mm 13.4mm Notes F 47.4mm Quantities Anti-Static PS ray, Black. 60 modules per ray Electrical Resistance: 1 MΩ< R< 100MΩ. 600 modules per Box hickness: = 0.8 mm 4 Boxes per Carton Carton imensions (L x W x H): 2400 modules per Carton 360mm x 325mm x 160mm Page 13 of 15
Bluetooth ual Mode Module Part No (ray) Part No (ape & Reel) Packaging for ape & Reel / ray he trays/reels are stacked and inserted into an anti-static vacuum bag and the A A Anti-Static Label, Model Name Label and Moisture Sensitive Labels stuck on. drying agent Humidity Indicator Card Reels are place within a vacuum bag. Anti-static aluminium vacuum bag. rays are stacked up with an empty tray on the top. F he vacuum bag is placed inside the box and a Model Name Label stuck on the front-side of each box. Model name label Anti-static aluminium vacuum bag. b ox ) b ox carton carton label Each carton contains 4 boxes. Page 14 of 15
Bluetooth ual Mode Module Part No (ray) Part No (ape & Reel) Module 1 x SM Plug & Play IC Ant Module ape & Reel Module 1 x SM Plug & Play IC Ant Module ray F A A Packaging Options Page 15 of 15