GENERAL DESCRIPTION EVALUATION BOARD MANUAL

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s June 2012 Rev. 1.1.1 GENERAL DESCRIPTION The XRP7714EVB-DEMO-1, XRP7714EVB- DEMO-2, and the XRP7714-DEMO-2P Demo boards are complete, working, four channel, power systems measuring either 2 x 2, or 2 by 2.5 capable of producing over 35 watts. They provide 3.3V, 2.5V 1.8V and 1V at a maximum of 4 amps per channel. The 2.5V, 1.8V and 1V supplies can be adjusted in 50mV increments, and the 3.3V supply is adjustable in 100mV increments. The order and ramp rates for each supply can be programmed to accommodate any sequencing requirement. All power supply operations can be controlled over an I 2 C interface. Faults, output voltages and currents can also be monitored. Four GPIO signals are available and can be programmed to provide status of power good signals enables and faults. Unused GPIO pins can be programmed as I/O expansion for a microcontroller. The board is supported by PowerArchitect TM and plugs directly onto the Exar Communications Module (XRP77XXEVB- XCM). EVALUATION BOARD EVALUATION BOARD MANUAL XRP7714EVB-DEMO-1 XRP7714EVB-DEMO-2/2P FEATURES XRP7714 Programmable Controller 4 Channel Power System Wide Input Voltage Range: 4.5V-25V Over 35W Capable Small Form Factor: 2.0 x 2.0 I 2 C Interface Programming Monitoring Control Fig. 1: XRP7714EVB-DEMO-X2/2P Schematic Exar Corporation www.exar.com 48720 Kato Road, Fremont CA 94538, USA Tel. +1 510 668-7000 Fax. +1 510 668-7001

PIN ASSIGNMENT PGND2 BST1 GH1 LX1 GL1 PGND1 VCCA VIN2 VIN1 LDOOUT 31 32 33 34 35 36 37 38 39 40 AVDD 1 30 GL2 DVDD 2 29 LX2 GPIO0 3 28 GH2 GPIO1 4 27 BST2 GPIO2 GPIO3 5 6 XRP7714 TQFN 6mm X 6mm 26 25 VCCD BST4 GPIO4 7 24 GH4 GPIO5 8 23 LX4 ENABLE 9 Exposed Pad: AGND 22 GL4 DGND 10 21 PGND4 20 19 18 17 16 15 14 13 12 11 BST3 GH3 LX3 GL3 PGND3 VOUT4 VOUT3 VOUT2 VOUT1 AGND Pin Description Fig. 2: XRP7714EVB-DEMO-X Pin Assignment Name Pin Number Description VIN1 39 VIN2 38 VCCA 37 VCCD 26 PGND1 4 36,31,16,21 AVDD 1 Power source for the internal linear regulators to generate VCCA, VDD and the Standby LDO (LDOOUT). Place a decoupling capacitor close to the controller IC. Also used in UVLO1 fault generation if VIN1 falls below the user programmed limit, all channels are shut down. The VIN1 pin needs to be tied to VIN2 on the board with a short trace. If the Vin2 pin voltage falls below the user programmed UVLO VIN2 level all channels are shut down. The VIN2 pin needs to be tied to VIN1 on the board with a short trace. Output of the internal 5V LDO. This voltage is internally used to power analog blocks. Note that a compensation capacitor should be used on this pin (see application note). Gate Drive input voltage. This is not an output voltage. This pin can be connected to VCCA to provide power for the Gate Drive. VCCD should be connected to VCCA with the shortest possible trace and decouple with a minimum 1µF capacitor. Alternatively, VCCD could be connected to an external supply (not greater than 5V). Ground connection for the low side gate driver. Should be routed as the return line of the GL signal. Connect at low side FET source. Output of the internal 1.8V LDO. A decoupling capacitor should be placed between AVDD and AGND close to the chip (with short traces). DVDD 2 Input for powering the internal digital logic. This pin should be connected to AVDD. DGND 10 AGND 11 GL1-GL4 35,30,17,22 Digital Ground. Connect this pin to the ground plane at the exposed pad with a separate trace. Analog Ground. Connect this pin to the ground plane at the exposed pad with a separate trace Output pin of the low side gate driver. Connect directly to the respective gate of an external N-channel MOSFET. 2012 Exar Corporation 2/17 Rev. 1.1.1

Name Pin Number Description GH1-GH4 33,28,19,24 LX1-LX4 34,29,18,23 BST1-BST4 32,27,20,25 GPIO0-GPIO3 3,4,5,6 GPIO4_SDA, GPIO5_SCL 7,8 Output pin of the high side gate driver. Connect directly to the respective gate of an external N-channel MOSFET. Lower supply rail for the high-side gate driver (GHx). Connect this pin to the switching node at the junction between the two external power MOSFETs and the inductor. These pins are also used to measure voltage drop across bottom MOSFETs in order to provide output current information to the control engine. High side driver supply pin(s). Connect BST to an external boost diode and a capacitor as shown in the front page diagram. The high side driver is connected between the BST pin and LX pin. These pins can be configured as inputs or outputs to implement custom flags, power good signals and enable/disable controls. A GPIO pin can also be programmed as an input clock synchronizing IC to external clock. Refer to the GPIO Pins Section and the External Clock Synchronization Section for more information. I2C serial interface communication pins. These pins can be re-programmed to perform GPIO functions in applications when I2C bus is not used. VOUT1 4 12,13,14,15 Voltage sense. Connect to the output of the corresponding power stage. LDOOUT 40 ENABLE 9 Output of the Standby LDO. It can be configured as a 5V or 3.3V output. A compensation capacitor should be used on this pin [see Application Note]. If ENABLE is pulled high, the chip powers up (logic reset, registers configuration loaded, etc.). If pulled low for longer than 100us, the XRP7714 is placed into shutdown. AGND Exposed Pad Analog Ground. Connect to analog ground (as noted above for pin 11). ORDERING INFORMATION Refer to XRP7714EVB-DEMO-X s datasheet and/or www.exar.com for exact and up to date ordering information. 2012 Exar Corporation 3/17 Rev. 1.1.1

USING THE EVALUATION BOARD INPUT VOLTAGE CONFIGURATION The XRP7714EVB-DEMO-1 Board has several different input voltage options. The Input voltage components are rated at 35V. The power components have been optimized for a 12V input rail. When running the board at an input voltage other than 12V, use PowerArchitect TM to evaluate the system performance. Single Wide Range, Input Voltage Rail Both the XRP7714EVB-DEMO-1 and the XRP7714EVB-DEMO-2P ship from the factory configured for a single wide range input. The Input voltage range is from 5.5V to 25V. Single 5V Voltage Rail Installing a zero ohm resistor into position R28 connects VIN to VCCA. This allows operation down to 4.75V, but restricts the maximum input voltage to 5.5V. Dual Voltage Rail Operation The XRP7714EVB-DEMO-x boards can be configured to operate from two separate rails. The following modifications must be made: Remove 0 ohm resistors R2 and R13 Connect power for the XRP7714 between pins VIN and GND Connect channel power between pins VIN1 and GND I 2 C INTERFACE The XRP77XX family of controllers employs a standard I2C interface. Pull-ups for the I2C signals are not included on the demo board. If using the demo board with something other than the XRP77xxEVB-XCM, verify that the SDA and SCL lines are pulled up. Channel Design and Limitations Channel 1 is designed to provide an output voltage from 3.3V to 5.0V. The default voltage is 3.3V. Channel 2 is designed to provide an output voltage from 1.8V to 2.5V. The default voltage is 2.5V. Channel 3 is designed to provide an output voltage from 1.5V to 1.8V. The default voltage is 1.8V. Channel 4 is designed to provide an output voltage from.9 to 1.2V. The default voltage is 1.0V. The Tantalum output capacitor is has a 2.5V rating. If modifying the channel 3 design, do not exceed four volts unless the C45 is replaced. ENABLE PIN The ENABLE pin connects to an RC network This delays turn on of the device. It is pulled up to AVDD with a 100K resistor and to ground through a.01ufd capacitor. It appears on pin 9 of connector CON5. This pin can be used to turn on or turn off the device. BOARD DIFFERENCES The XRP7714EVB-DEMO-1 board is 2 x 2 and does not have the facility for a power connector. This board may be available through distribution, but is no longer manufactured. The XRP7714EVB-DEMO-2 board is 2 x 2.5 and comes from the factory with wired for Single 5V operation (note: some boards were shipped without populating R28. R28 must be populated for single rail 5V operation). The Power Jack has been removed from the board. Supplying more than 5V to the board will damage the XRP7714. This board may be available through distribution, but is no longer manufactured. The XRP7714EVB-DEMO-2P board is 2 x 2.5 and comes from the factory wired for a single wide range input. The P denotes that a power connector is installed for connection to a power supply of the customers choosing. The center lead of the input connector is positive. Operating the Evaluation Board Note: The XRP7714EVB-DEMO-2, is designed to be powered from the USB voltage that is supplied to from the host PC through the XCM board. No additional power connections are 2012 Exar Corporation 4/17 Rev. 1.1.1

required to demonstrate basic board functionality. If connecting the board to an external power source, do not exceed 5.5V on the chip or it will be damaged. Make sure that the board is configured for the power supply(s) that you are using. Refer to the Input Voltage Configuration section if you require specific board modifications for your application. Insert the USB cable into the computer and the XCM board. Load the PowerArchitect TM software. Select the XRP7714EVB configuration and select Create Configuration. Bring up Procedure Plug the PowerXR evaluation board on to the XCM as shown below. You will be prompted for a filename by a Create New File Dialog box. Navigate to a location to save the configuration, enter a filename and select Save. If the XCM board is recognized, there will be an XCM tab. If not, Ctrl-b should initiate a board search and find it. On the DEMO tab, the lower left should indicate a board connected, but the rest of the page should be grey ed out. Apply Power to the board: Please refer to the appropriate board connection diagram for your specific evaluation board. If using a single 2012 Exar Corporation 5/17 Rev. 1.1.1

supply, Connect the input supply between the VIN pin and the GND pin. If using a dual supply, Connect the chip power between VIN/VINP pin and GND, and connect Power Vin between the VIN1 pin and GND. If using the 5V only option with R28 populated, no power connections are necessary. Turn on the Power supply. The DEMO page should now become live indicating communication with the XRP7714. Click Program Chip and a window should pop up indicating Success. Now click on the box at the middle right Enable All. Refer to the Exar PowerArchitect TM Quick Start Guide for information on how to run the software. 2012 Exar Corporation 6/17 Rev. 1.1.1

EVALUATION BOARD CONNECTIONS: DEMO-2P Figure 3:XRP7714EVB-DEMO-2P Board Connections 2012 Exar Corporation 7/17 Rev. 1.1.1

EVALUATION BOARD CONNECTIONS: DEMO-2 Figure 4:XRP7714EVB-DEMO-2 Board Connections 2012 Exar Corporation 8/17 Rev. 1.1.1

EVALUATION BOARD CONNECTIONS: DEMO-1 GND Channel 2 Out GND Channel 4 Out GND Channel 3 Out GND Channel 1 Out LDO OUT GND PGND POWER VIN (VINP) CHIP VIN (VIN) GND Figure 5:XRP7714EVB-DEMO-1 Board Connections 2012 Exar Corporation 9/17 Rev. 1.1.1

EVALUATION BOARD SCHEMATICS 2012 Exar Corporation 10/17 Rev. 1.1.1

BILL OF MATERIAL Ref. Qty Part Number Manufacturer Size Description U1 1 XRP7714ILB-F EXAR CORP QFN40 Q1,Q2,Q3,Q4 4 FDS8984 FAIRCHILD 8-SOIC Alternate Q1,Q2,Q3,Q4 4 FDS6930B FAIRCHILD 8-SOIC D1,D2,D3,D4 4 SD101AWS Diodes Inc. SOD-323 WURTH L1,L2 2 744314490 ELEKTRONIK 7.0x6.9mm L3 1 744311330 L4 1 744310200 WURTH ELEKTRONIK WURTH ELEKTRONIK 7.0x6.9mm 7.0x6.9mm C1,C6,C20,C31,C43 5 GRM32ER7Y106KA12L MURATA CORP. 1210 C2 1 EKZE350ELL471MJ20S United Semi-Con Radial, Can C10,C26,C37,C46 4 GRM32ER61C476ME15L MURATA CORP. 1210 C12,C13,C16,C27,C38, C47 6 GRM188R71H104KA93D MURATA CORP. 603 C3,C17,C18 3 GRM21BR71A225KA01L MURATA CORP. 805 C8,C23,C28,C33,C34 5 GRM188R71H103KA01D MURATA CORP. 603 C9,C24,C29,C35,C39, C40,C41,C44 8 GRM188R71H102KA01D MURATA CORP. 603 C11,C25 2 TCJB476M010R0070 AVX CORP. 1210 C36 1 T520B157M006ATE070 KEMET 1411 C45 1 T520B337M2R5ATE045 KEMET 1411 R1,R3,R4,R10,R11,R18, R19,R23,R24 9 CRCW06034R99FKEA Vishay/Dale 603 R2,R13 2 CRCW12060000Z0EA Vishay/Dale 1206 R5,R12,R20,R25 4 CRCW08054R99FKEA Vishay/Dale 805 R6 1 CRCW02010000Z0ED Vishay/Dale 603 4 Ch. 25V PWM Step Down Controller QFN40 30mohm MOSFET N-CH DUAL 30V 6A 8-SOIC 50mohm MOSFET N-CH DUAL 30V 5.5A 8-SOIC Diode Schottky, 40V, 400mW, SOD-323 Inductor 4.9uH, 14.5mΩ, 6.5A Inductor 3.3uH, 9.0mΩ, 9.0A Inductor 2.0uH, 5.85mΩ, 11.5A Cap Cer 10uF, 35V, X7R, 10% 1210 Cap Aluminium 470uF, 35V, 20%, 23mOhm CAP CER 47uF, 16V, 20%, X5R, 1210 Cap Cer 0.1uF, 50V,X7R, 0603 Cap Cer 2.2uF, 10V, X7R, 0805 Cap Cer 0.01uF, 50V,X7R,0603 Cap Cer 1000pF,50V,X7R,0603 Cap Tant 47uF, 10V, 20%, 1210 Cap Tant 150uF, 6.3V, 20%, 1411 Cap Tant 330uF, 2.5V, 20%, 1411 Res 4.99 Ohm, 1%, 1/10W, 0603 Res 0.0 Ohm, 1/4W, 1206 Res 4.99 Ohm, 1%, 1/8W, 0805 Res 0.0 Ohm, 1/20W, 0603 R15 1 CRCW0603100KFKEA Vishay/Dale 603 Res 100K Ohm, 1%, 1/0W, 0603 CON3 1 RAPC722X Switchcraft Inc. 2.1mmID, 5.5mmOD Conn PoweJack Mini R/A CON4 1 61304011121 WURTH ELEKTRONIK 2.54mm, 3 PIN 2.54mm pin header CON5 1 61301021821 WURTH ELEKTRONIK 2.54mm, 10 pins 2.54mm Dual Socket Header GPO0,GPO1,GPO2, GPO3 4 1528-2 KEYSTONE 0.082 SINGLE TURRET GND,TIP4,TIP5,TIP6, TIP8,TIP10,TIP11, TIP13,TIP14,VIN,VIN1, VOUT1,VOUT2,VOUT4 14 1562-2 KEYSTONE 0.084 SINGLE TURRET 2012 Exar Corporation 11/17 Rev. 1.1.1

EVALUATION BOARD LAYOUT Fig. 3: Component Placement Top Side Fig. 4: Component Placement Bottom Side 2012 Exar Corporation 12/17 Rev. 1.1.1

Fig. 5: Layout Top Side Fig. 6: Layout Bottom 2012 Exar Corporation 13/17 Rev. 1.1.1

Fig. 7: Layout Internal Plane Fig. 8: Layout Internal Plane 2012 Exar Corporation 14/17 Rev. 1.1.1

EVALUATION BOARD EFFICIENCY PERFORMANCE Fig. 9: All Channels Efficiency Fig. 10: 3.3V Efficiency Fig. 11: 2.5V Efficiency Fig. 12: 1.8V Efficiency Fig. 14: Layout Internal Plane Fig.13: 1V Efficiency 2012 Exar Corporation 15/17 Rev. 1.1.1

EVALUATION BOARD LINE LOAD REGULATION PERFORMANCE Fig. 14: Line Load Regulation 3.3V Fig. 15: Line Load Regulation 2.5V Fig. 16: Line Load Regulation 1.8V Fig. 17: Line Load Regulation 1.0V Fig.18: 1V Efficiency Fig. 14: Layout Internal Plane 2012 Exar Corporation 16/17 Rev. 1.1.1

DOCUMENT REVISION HISTORY Revision Date Description 1.0.0 04/15/2011 Initial release of document 1.1.0 06/15/2011 1.1.1 10/01/2012 Corrected BOM and schematic (channels 2 and 3 were swapped in schematic). Noted discontinuance of -1 and -2 boards. Added note regarding omitted R28 on some -2 boards. Added picture of proper connection of XCM. Added FDS6930B as alternate BOM. A limited number of boards were built with these MOSFETs due to availability of the primary part number. Logo change. BOARD REVISION HISTORY Board Revision Date Description REV2.0 01/03/2011 Initial release of evaluation boards 2 and 2P. REV1.0 12/23/2010 Initial release of evaluation board 1. Note: Limited to a production of 150 units. FOR FURTHER ASSISTANCE Email: powertechsupport@exar.com customersupport@exar.com Exar Technical Documentation: http://www.exar.com/techdoc/default.aspx? EXAR CORPORATION HEADQUARTERS AND SALES OFFICES 48720 Kato Road Fremont, CA 94538 USA Tel.: +1 (510) 668-7000 Fax: +1 (510) 668-7030 www.exar.com NOTICE EXAR Corporation reserves the right to make changes to the products contained in this publication in order to improve design, performance or reliability. EXAR Corporation assumes no responsibility for the use of any circuits described herein, conveys no license under any patent or other right, and makes no representation that the circuits are free of patent infringement. Charts and schedules contained here in are only for illustration purposes and may vary depending upon a user s specific application. While the information in this publication has been carefully checked; no responsibility, however, is assumed for inaccuracies. EXAR Corporation does not recommend the use of any of its products in life support applications where the failure or malfunction of the product can reasonably be expected to cause failure of the life support system or to significantly affect its safety or effectiveness. Products are not authorized for use in such applications unless EXAR Corporation receives, in writing, assurances to its satisfaction that: (a) the risk of injury or damage has been minimized; (b) the user assumes all such risks; (c) potential liability of EXAR Corporation is adequately protected under the circumstances. Reproduction, in part or whole, without the prior written consent of EXAR Corporation is prohibited. 2012 Exar Corporation 17/17 Rev. 1.1.1