FUJITSU Component Connector FCN-074B / 078B series Card Edge Connector for DDR4 Memory Module Not for New Designs Overview This is a 288-pin DIMM socket that conforms to JEDEC standards. RoHS compliant Features Highly reliable contact Contact reliability with a module substrate is improved by a Fujtisu proprietary double-contact structure, which is resistant to dust and flux Various terminal shapes to match with substrate design and mounting form One surface mount type, one press fit type, and three through-hole types having different terminal lengths are included in this lineup Flame resistant UL94V-0 Flame resistant UL94V-0 LCP resin is used for the housing insulating material Typical applications DRAM-memory module connections for HPCs (servers, supercomputers), communication measurement apparatuses and office equipment DDR4 DIMM socket Item Specification Operating temperature range -55 C to +85 C Max. current rating 0.75A Max. voltage rating 29VAC Contact resistance 40mΩ maximum (10mA, 20mVDC) Insulation resistance 1MΩ minimum (500VDC) Dielectric withstanding voltage 500VAC for 1 minute Substrate insertion force 126.4N less than Item Material, surface treatment Insulation material LCP resing (UL94V-0) Conductor Copper alloy Surface treatment Contact Gold plating (PAGOS) Terminal Gold coat Ejector PA resin (UL94V-0) Metal fitting Copper alloy (tin plating) Part numbers and dimensions Part number Terminal shape Substrate thickness Number of pins Package format Min. package unit Min. shipment unit FCN-074B288-G/0D Through 1.6 288 40 pieces 200 pieces FCN-074B288-G/1D hole 2.4 288 Tray 40 pieces 200 pieces FCN-074B288-G/2D 3.2 288 40 pieces 200 pieces FCN-078B288-G/0 Surface mount - 288 40 pieces 200 pieces FCN-074B288-G/0P Press fit 1.6 min. 288 40 pieces 200 pieces Page 1 of 6
Dimensions Through-hole type FCN-074B288-G/ D Memory module conforms to JEDEC MO-309) No. 221 No. 222 No. 77 No. 78 (148 : ejector, in closed state) 129 maximum (*) Center line of (*) Polarity key center line 0.85 0.85 (77-1)=64.6±0.1 0.85 (67-1)=±0.1 74.55 63.4 (141) L 4 3-0.4±0.1 2.5 min. 6.4 max. 3.9 min. 1.4±0.03 3.65±0.05 162 max. 10 min. 5 min. 14.5 min. Dimensions (mm) Applicable substrate Part number L thickness (mm) FCN-074B288-G/0D 2.67 1.6 FCN-074B288-G/1D 3.18 2.4 FCN-074B288-G/2D 4.00 3.2 Ejector: 162 max. in open state Recommended printed circuit board (Top view) Φ2.45±0.05 No. 146 64.6 A No. 221 No. 222 Φ2.45±0.05 No. 2 No. 77 No. 78 74.55 63.4 0.85 288 -Φ0.66±0.08 2.7 2.45±0.08 1.2±0.05 1.1 Detailed view of A Page 2 of 6
Dimensions Surface mount type FCN-078B288-G/0 Memory module conforms to JEDEC MO-309) 25 No.288 7 (145: ejector enclosed state) 128.6 minimum(*) 44 Center line of (*) 5.575 Polarity key center line 4 21.3 min. 0.85 (77-1)=64.6±0.05 74.55 (141) 0.85 (67-1)=±0.05 63.4 3-0.4±0.1 2.5 min. 6.5 min. 1.4±0.03 162 min. 3.9 min. 3.65±0.05 10 min 5 min 14.5 min 21.3 min (Ejector: 162 max. in open state) Recommended printed circuit board pattern (Top view) 45 Φ 2.45±0.05 64.6 A No. 221 No. 222 No. 77 No. 78 74.55 63.4 Φ 2.45±0.05 7±0.03 2.3 1.8±0.03 2.45±0.08 Detail A 1.2±0.05 2.3 Page 3 of 6
Dimensions Press fit type FCN-074B288-G/0P Memory module conforms to JEDEC MO-309) 25 7 No. 1 (145: ejector, in closed state) minimum 128.6 (*) Center line of (*) 5.575 Polarity key center line 2.4±0.2 0.85 φ2.1±0.08 0.85 (77-1)=64.6±0.1 0.85 (67-1)=±0.1 74.55 141 1.4±0.03 162 max. 2.2 5.4 6.5 max. 3.9 max. - 3.65±0.05 10 min. 5 min. 14.5 min. Ejector in opened state Applicable substrate thickness (mm): 1.6 min. Ejector in opened state Maximum 162 Recommended printed circuit board pattern (Top view) φ2.45±0.05 A 64.6 No. 221 No. 222 No. 1 No. 77 No. 78 0.85 2.2 1.6 288 -φ0.9±0.05 PAD 1.6 288 -φ0.6±0.01 DRILL 288 -φ±0.05 PTH Detail A Page 4 of 6
Recommended soldering conditions (surface mount type) 220 C Infrared reflow (IRS) conditions Peak temperature 260 C max. The temperature profile indicates a temperature indicated on the printed circuit board surface. Set the metal mask thickness of the solder paste to 120µm. Natural air cooling or 4 C/sec. max. 4 C/sec. max. 4 C/sec. max. 160 to 170 C Pre-heating 220 C min. 40 sec. min. 255 to 260 C Actual heating 10 sec. max. Reference: Recommended memory module terminal shape (applicable to both surface mount/through hole/press fit) Variation A Variation B 31.25±0.15 (front face) 5.575 B 2.5 min 2.1 1.45 min 8 11 14.6 17.6 18.75±0.15 C 5.575 (front face) 2.8 min 2.1 1.45 min 8 11 14.6 28.05 25.5 22.95 22.1 1.4±0.1 28.05 25.5 22.95 22.1 (11.05) (11.05) (11.05) (11.05) 64.6 64.6 133.35±0.15 133.35±0.15 1.4±0.1 64.6 (3.35) 64.6 (3.35) (rear face) (rear face) 2.6 2.6 3.85±0.1 1.5±0.1 3.85±0.1 1.5±0.1 (For details see JEDEC MO-309) PAGOS is a trademark of Fujitsu Component Limited Page 5 of 6
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