Product End-of-Life Disassembly Instructions Product Category: Personal Computers Marketing Name / Model [List multiple models if applicable.] HP 260 G1 DM Business PC Purpose: The document is intended for use by end-of-life recyclers or treatment facilities. It provides the basic instructions for the disassembly of HP products to remove components and materials requiring selective treatment, as defined by EU directive 2002/96/EC, Waste Electrical and Electronic Equipment (WEEE). 1.0 Items Requiring Selective Treatment 1.1 Items listed below are classified as requiring selective treatment. 1.2 Enter the quantity of items contained within the product which require selective treatment in the right column, as applicable. Quantity of items Item Description Notes included in product Printed Circuit Boards (PCB) or Printed Circuit Assemblies (PCA) Batteries Mercury-containing components Liquid Crystal Displays (LCD) with a surface greater than 100 sq cm With a surface greater than 10 sq cm 1 All types including standard alkaline and lithium coin or button style batteries For example, mercury in lamps, display backlights, scanner lamps, switches, batteries Includes background illuminated displays with gas discharge lamps Cathode Ray Tubes (CRT) 0 Capacitors / condensers (Containing PCB/PCT) 146 Electrolytic Capacitors / Condensers measuring greater than 2.5 cm in diameter or height External electrical cables and cords 1 Gas Discharge Lamps 0 Plastics containing Brominated Flame Retardants weighing > 25 grams (not including PCBs or PCAs already listed as a separate item above) Components and parts containing toner and ink, including liquids, semi-liquids (gel/paste) and toner Include the cartridges, print heads, tubes, vent chambers, and service stations. Components and waste containing asbestos 0 Components, parts and materials containing refractory ceramic fibers EL-MF877-00 Page 1 Template Revision B PSG instructions for this template are available at EL-MF877-01 1 0 0 0 0 0 0
Components, parts and materials containing radioactive substances 2.0 Tools Required List the type and size of the tools that would typically be used to disassemble the product to a point where components and materials requiring selective treatment can be removed. Tool Description Screwdriver #1 Support fixture Description #3 Description #4 Description #5 0 Tool Size (if applicable) Cross head of screwdriver 3.0 Product Disassembly Process 3.1 List the basic steps that should typically be followed to remove components and materials requiring selective treatment: 1. Follow steps described in Disassembly instruction (file attached) 2. If parts can be removed without using a tool, remove it first. 3. Use correct screwdriver and torque value before unlock the screw. 4. 5. 6. 7. 8. 3.2 Optional Graphic. If the disassembly process is complex, insert a graphic illustration below to identify the items contained in the product that require selective treatment (with descriptions and arrows identifying locations). NA EL-MF877-00 Page 2 Template Revision B PSG instructions for this template are available at EL-MF877-01
MANUFACTURING PROCESS INSTRUCTIONS MECHANICAL ASSEMBLY MODEL : Pippin Sub-assembly name: Document No.: FA DIS ASS Y Pippin FA DIS ASS'Y SOP Written by: Stanley Chen Revision: 0.1 Date: 2014/11/26 Page: 1 A. Current station version list Station Ver. Station Ver. Station Ver. Station Ver. 1 0.1 10 0.1 2 0.1 11 0.1 3 0.1 12 0.1 4 0.1 13 0.1 5 0.1 14 0.1 6 0.1 7 0.1 8 0.1 9 0.1 B. Version Modify list Revision Date Station Content Ver. Design 0.1 2014/11/26 ALL FIRST VERSION 0.1 Stanley Chen Auditor : Stanley Chen
Document No. Pippin FA DIS ASS Y SOP Station : 1(1/1) Name : Loosen IO Bracket Screws Ver. : 0.1 Date : 2014/11/26 1. Put the machine on support fixture. 2. Loosen screw (6052B0313401,T15, #6-32x6) * 1. () T15 Electric screwdriver 1 Support fixture 1
Document No. Pippin FA DIS ASS Y SOP Station : Name : Disassemble Rubber * 2 & Screw * 2 Ver. : 0.1 Date : 2014/11/26 1. Remove the rubber * 2. 2(1/1) 2. Loosen screw (6052B0305501,cross,M2x23) * 2. () Electric screwdriver- #1 1
Document No. Pippin FA DIS ASS Y SOP Station : 3(1/1) Name : Disassemble Bottom Cover Ver. : 0.1 Date : 2014/11/26 1. Slide the bottom cover to remove it. ()
Document No. Pippin FA DIS ASS Y SOP Station : 4(1/1) Name : Disassemble HDD/SSD Ver. : 0.1 Date : 2014/11/26 With HDD/SSD SKU 1. Press the plastic hook, then slide the HDD/SSD to right side. () 2 1 press 2. Disassemble HDD/SSD from HDD CNTR. ()
Document No. Pippin FA DIS ASS Y SOP Station : Name : Loosen HDD Screws Ver. : 0.1 Date : 5(1/1) 2014/11/26 With HDD /SSD SKU 1. Loosen guide pin screw (6054B1522101 ) * 4. ( / Fig. 2) Electric screwdriver - T15 1
Document No. Pippin FA DIS ASS Y SOP Station : 6(1/1) Name : Loosen HDD Tray Screws Ver. : 0.1 Date : 2014/11/26 4 1 1. Loosen HDD tray screw (6052B0310201,T15, #6-32x6 ) * 4. () 2 3 Electric screwdriver - T15 1
Document No. Pippin FA DIS ASS Y SOP Station : 7(1/1) Name : Disassemble HDD Tray From M/B Ver. : 0.1 Date : 2014/11/26 1. Disassemble HDD FFC CNTR. () 2. Disassemble HDD Tray (6070B0847201). () HDD FFC CNTR
Document No. Pippin FA DIS ASS Y SOP Station : Name : Disassemble DDR Door, DDR, Antenna Ver. : 0.1 Date : 2014/11/26 8(1/1) 1. Disassemble DDR door (6053B1155701). () 2. Disassemble DDR. () 3. Disassemble AUX/MAIN antenna on WLAN card. (Fig.3) Fig.3
Document No. Pippin FA DIS ASS Y SOP Station : 9(1/1) Name : Disassemble WLAN Card & SSD Ver. : 0.1 Date : 2014/11/26 2 WLAN 1. Loosen WLAN card screw (6052B0228001, T8 M2,0*3.0) * 2. () 2. Disassemble WLAN card. (Fig. 1) 1 With M2 SSD SKU 3. Loosen screw (6052B0228001,T8 M2.0*3.0) * 1. () 4. Disassemble SSD. (Fig. 2) M2 SSD Electric screwdriver - T8 1
Document No. Pippin FA DIS ASS Y SOP Station : 10(1/1) Name : Disassemble Fan Module Ver. : 0.1 Date : 2014/11/26 2 1. Loosen screw * 2, then disassemble fan module (6033B0042101). () 1 2. Disconnect fan cable from M/B CNTR. () Electric screwdriver - T15 1
Document No. Pippin FA DIS ASS Y SOP Station : 11(1/1) Name : Disassemble Thermal Module Ver. : 0.1 Date : 2014/11/26 1 4 1. Loosen thermal module set screw * 4. 3 2 2. Disassemble thermal module (6043B0173501). Electric screwdriver - T15 1
Document No. Pippin FA DIS ASS Y SOP Station : Name : Disassemble M/B Ver. : 0.1 Date : 2014/11/26 12(1/1) 1. Loosen screw (6052B0310201,T15, #6-32x6) * 2. () 2 1 2. Disassemble M/B. () Electric screwdriver - T15 1
Document No. Pippin FA DIS ASS Y SOP Station : Name : Disassemble Speaker Module Ver. : 0.1 Date : 2014/11/26 13(1/1) 1. Rip the AL foil on M/B, disassemble speaker module. () 2. Disassemble speaker (6039B0068801 or 6039B0068901) and holder (6051B0953001/1570A0001701). () 3. Disassemble antenna main (6036B0143401 or 6036B0143501), separate antenna and holder. (Fig.3) Fig.3
Document No. Pippin FA DIS ASS Y SOP Station : 14(1/1) Name : Disassemble Antenna (AUX) Ver. : 0.1 Date : 2014/11/26 1. Disassemble antenna (AUX) (6036B0147301 or 6036B0147201).