Optimize your system designs using Flash memory Howard Cheng Sr. Segment Applications Manager Embedded Solutions Group, Micron 2012 Micron Technology, Inc. All rights reserved. Products are warranted only to meet Micron s production data sheet specifications. Information, products, and/or specifications are subject to change without notice. All information is provided on an AS IS basis without warranties of any kind. Dates are estimates only. Drawings are not to scale. Micron and the Micron logo are trademarks of Micron Technology, Inc. All other trademarks are the property of their respective owners. 1
Agenda Non-Volatile Market & Trends Flash Cell Architectures Flash Memory Choices System Considerations Summary 2
2012 Semiconductor Market Forecast Worldwide Semiconductor Market $313B DRAM $32.1B Flash $32.4B PC $12.4B Specialty $19.7B NOR $3.9B NAND $28.5B Source: Gartner 3Q11 3
The Embedded Markets NOR: %Revenue 2011 $2.2B NAND: %Revenue 2011 $1.7B Automotive 6% PC & Server 6% PC & Server 26% Consumer & Graphics 27% Networking & Storage 7% Automotive 10% Networking & Storage 24% Industrial 13% Industrial 20% Consumer & Graphics 61% Source: Gartner/iSuppli/Micron 2011 4
Embedded Flash Technology Trend 100% 90% 80% NAND Managed NAND 70% # Units 60% 50% 40% Serial NOR M-NAND NAND S-NOR P-NOR 30% 20% 10% Parallel NOR 0% 2011 2012 2013 2014 2015 NAND growing in units with managed NAND coming on strong for ease of design NOR uses still versatile, but parallel losing popularity due to board simplicity Source: isuppli, Mkt research, does not include large data applications (ie PMP, MP3, SSD, Media Cards, etc) 5
Embedded Flash Technology Trend Managed NAND % MMb NAND M-NAND NAND 2011 2012 2013 2014 2015 % MMb Parallel NOR Serial NOR S-NOR P-NOR 2011 2012 2013 2014 2015 Code + Data bit growth increasing the need for NAND and cost/bit Serial NOR gaining momentum on parallel due ease of design Source: isuppli, Mkt research, does not include large data applications (ie PMP, MP3, SSD, Media Cards, etc) 6
Agenda Non-Volatile Market & Trends Flash Cell Architectures Flash Memory Choices System Considerations Summary 7
Cell architectures Floating Gate Technologies S/D Polysilicon Gate Oxide Nitride Oxide S/D Electron Storage S Polysilicon Gate ONO Polysilicon Oxide D PCM Technology Temperature T m T x Reset (amorphization) Set (crystallization) Time 8
PCM product attributes Available in NOR-type options Industry driving toward LPDDRx Fast programming for NVM Fast read capability Evolved Options NOR replacement NOW NAND replacement <5 yrs RAM replacement <5 yrs Disruptive Options Integrated memories NAND/RAM System Cache Options HDD/SDD Integration PCIe 9
PCM benefits Bit Alterability 0 1 0 1 0 1 0 1 No Erase Required 1 0 1 0 1 0 1 0 Scaling 90 & 45nm Today 5nm Future Endurance Bit Errors 10
Agenda Non-Volatile Market & Trends Flash Cell Architectures Flash Memory Choices System Considerations Summary 11
Solutions for different requirements NOR vs. NAND Lowest Floor Cost ($) Lowest $/GB Serial NOR Parallel NOR SLC NAND Managed NAND MLC NAND Longer lifecycles Ease of use Diverse products Lower Floor cost Code, Code+Data Shorter lifecycles Focus on cost/gb Expanding markets Mostly Data Focused Customer Requirements Dictate the Solution 12
NOR product attributes Simple command sets Cost effective at low densities Stable architectures Value added features (XiP, security, quality, small data, etc) Serial Low pin counts Easy PCB routing Smallest footprint Synchronous operations Cheapest low density Parallel Basic add/data interface Asynchronous random access Synchronous burst operations Higher throughput Best XiP architecture 13
NAND product attributes Low pin counts Cheapest cost/bit at high densities Frequent conversions/migrations required Fast programming Discrete Some controllers support boot Some standards (ONFI) Common packages Needs SW for error management Demand paging saves bits Managed Error management onboard Some controllers support boot Higher density reach Easier conversions/migrations Standards (MMC, USB, usd ) 14
Flash Architectures Component Level All architectures have their advantages Trend in the industry moving toward the lower pin count architectures 15
NAND technology challenges How to manage the ECC requirements? NAND controllers with high ECC capability ECC NAND managed solutions on-die ECC, ClearNAND Fully managed solutions emmc, eusb, others How to manage lower Endurance? Understand the application and usage model How does the file system work? How often are you programming? How big is the data file/s? What is the PLC of your system? Determines PE Cycles and Density Required Intersecting your project and the memory technology is key to success! August 12 16
NAND system solutions for Industry Raw NAND for application expert with NAND data Host Controller I management and ready to support ECC needs. NAND Interface FTL ECC LLD NAND BUS Raw NAND ECC NAND for application that do not want to change the ECC with the NAND litho shrink. Host Controller II NAND Interface FTL LLD NAND BUS ECC NAND ECC Serial NAND for application requiring high density with Serial protocol. Host Controller III SPI Interface FTL LLD SPI BUS SPI ECC emmc interface for application that want to offload by any Host Controller IV emmc NAND NAND data management with a standard interface. emmc Interface LLD MMC BUS ECC FTL eusb interface for application that want to offload by any Host Controller V eusb NAND NAND data management with a standard interface. eusb Interface LLD USB BUS ECC FTL August 12 17
Level of Management by NAND solutions Level of Management by NAND Solution Raw NAND ECC NAND (On-Die ECC, ClearNAND) Fully Managed (emmc, eusb) Complexity of Customer Development (NAND Management by Host) New Product Qualification (Complexity & Effort) High Med Low High Med Low Relative Cost Low Med High Trade offs between Complexity, Qualification Effort & Cost 18
Agenda Non-Volatile Market & Trends Flash Cell Architectures Flash Memory Choices System Considerations Summary 19
Performance considerations for system solutions Host Controller I Raw NAND NAND Interface FTL ECC LLD NAND BUS Host Controller II NAND Interface FTL LLD NAND BUS On-Die ECC NAND ECC Host Controller III emmc emmc Interface LLD emmc BUS ECC FTL Device Throughput Raw NAND, ECC NAND and emmc require different management software The correct performance evaluation is at system LLD = Low Level Driver ECC = Error Correction Code FTL = NAND Scheduling Logical Mapping, Bad Block Management, Wear Leveling 20
Memory subsystem designs/architecture Execute in Place (XIP) Architecture Store and Download (SnD) Architecture CPU I$ D$ Memory/Bus Controller Code Data Working Working Static Flash DRAM CPU I$ D$ Memory/Bus Controller Boot Data & Files Shadow Working Static NOR NAND DDRx Code copied and fixed in place at boot Simple architecture Possible to reduce DRAM density Lower stand-by power Complex but higher performance More DRAM required Higher stand-by power 21
System cost reductions and simplification Software Architecture System Architecture N+3 High Write CPU Main Memory RAM NVM N+2 N+1 N Critical Data Shadowed Code High Read Boot Code + OS Memory Banks Complimentary I/O E 2 BatRAM/nvRAM NOR/NAND Understand Your Usage Model xram Usage models How many CE#/Banks do you use Why might you split memory into separate chips Other system SW requirements (file system, data logging, etc) System BOM Can you eliminate or partially eliminate any unnecessary memory? Performance vs. Cost ratio 22
Larger Data Fetches 23
Performance Comparison Small Data 24
Memory technology comparison Attributes PCM DRAM NAND NOR EEpROM Bit Alterable Non-volatile Cost Read Speed Write Speed All memory technologies have their advantages Look for ways to differentiate and stay cost effective 25
Agenda Non-Volatile Market & Trends Flash Cell Architectures Flash Memory Choices System Considerations Summary 26
What s next? Customers 1. Understand memory usage 2. Understand true cost 3. Work with a trustworthy supplier Suppliers 1. Provides technology leadership & product longevity 2. Architecture transparency 3. Systems expertise & silicon/solution standards 27
Broadest Portfolio Industry s broadest portfolio Manufacturing Expertise/Stability Computing, server/networking, embedded, mobile, consumer Automotive Storage Graphics / Consumer Networks Server Wireless Personal Computing Industrial 28
Micron s Product Portfolio NOR Parallel and Serial NOR product portfolios, densities 512Kb-2Gb+ Technology leadership on 65nm and 45nm. Automotive and industrial qualified solutions NAND Discrete and managed solutions, densities 128Mb-64GB Technology leadership on 20nm Automotive and industrial qualified e MMC solutions Legacy support for low density NAND DRAM Legacy SDRAM through cost/performance leading DDR3 offerings Discrete and module DRAM solutions High speed RLDDRx Options Automotive and industrial qualified solutions Phase Change Memory First commercially available PCM products P5Q: Serial NOR compatible, densities 32-128Mb Award winning technology New families on 45nm 29