New Power 795 New High-end 24 to 256 Cores 8 8 TB memory TurboCore 3.7, 4.0 or 4.25 GHz 1,000 VMs* with PowerVM Capacity on Demand Enterprise RAS 24x7 Warranty PowerCare 1 * Statement of Direction
System Capacity Moves Up with POWER7 over 5X system capacity than 5.0GHz Power 595 over 7X system capacity than 2.3GHz p5-595 256c 192c 128c 64c 64c 64c 2 rperf performance for fully-configured systems. 4GHz & 4.25GHz estimates shown of system configured with 64-way LPARs. 3.7 GHz estimate shown of configured with 48-way LPARs.
Performance per Core Moves Up with POWER7 up to 1.6X improvement over POWER6 up to 2X improvement over POWER5+ rperf performance estimate for fully configured 64-way systems divided by number of cores 3
Power 795 Power 795 MTM 9119-FHB Architecture Up to 32 Sockets ( Max 256 Cores) 4 TurboCore / 8 MaxCore & 6 Core L2 & L3 Cache On Chip DDR3 Memory Up to 8 TB DASD / Bays Remote I/O Drawer ( SAS / SSD ) Book Interconnect Point to Point GX++ Bus 4 per System Book Max: 32 ( 8 Nodes ) Media Bays Media drawer Remote IO Drawers 1 32 drawers LPARs Up to 254 SOD up to 1024 Redundant Power & Cooling Yes Hot Maintenance Yes Cooling Air Redundant Clock Yes Power / Thermal (TPMD) Advanced Energy Scale Optional DC power
Power 795 Processor Core Options 32 32 32 32 32 32 32 32 256 Cores / 32 Core Books MaxCore Chips ( 8 Cores) @ 4.0 GHz 16 16 16 16 16 16 16 16 128 Cores / 16 Core Books TurboCore Chips ( 4 Cores ) @ 4.256 GHz 24 24 24 24 24 24 24 24 192 Cores / 24 Core Books 6 Core Chips @ 3.72 GHz
Large LPAR support on Power 795 Power 795 is optimized for large-scale consolidation POWER7 increases the node density and system core capacity by 4X Power 795 provides 2X memory capacity and 3X memory bandwidth over POWER6 Power 795 requires a minimum number of inter-node links to support LPAR > 32-cores 4+ books on 3.7 or 4.0 GHz systems 3+ books on 4.25 GHz TurboCore systems With above requirements met, Power 795 supports up to 128-way LPARs LPARs >128-way (up to 256-way) are supported on Power 795 systems with 4GHz processors Key enabled via feature #1256 Requires pre-sales performance assessment; request via RPQ POWER6 POWER7 8 8 32 32 8 8 32 32 POWER7 2 Book 3 Book 32 32 32 32 32 TurboCore 16 16 16 6
IBM Power Systems Power Flex deploying a comprehensive virtualization infrastructure New flex i ble [ˈflek-sə-bəl] characterized by a ready capability to adapt to new, different, or changing requirements* Multi-system virtualization infrastructure providing a highly available and flexible IT environment to support clients most demanding business resiliency objectives leveraging years of IBM innovations. At least two systems enables active-active availability Allocate and rebalance processor and memory Live Partition Mobility for flexible workload movement Seamless growth with Capacity on Demand On/Off Processor days for extra capacity Serious flexibility. *source : www.miriam-webster.com
Power Flex in action System A System B System A System B Planned Maintenance 64 Inactive 64c Active 64 Inactive 64c Active System being Maintained 64 64 Activated Inactive Temporary 64c Active System A System B System A System B Resource Re-balancing 32 Inactive 32c Active 64c Active 64 Inactive 64c Active 64 Inactive 64c Active 32 Inactive 32c Active 64c Active 8 Higher availability and increased flexibility
Power Flex details 2 to 4 Power 795 systems in a capacity pool Each system purchased with 4+ 4.0/4.25 GHz books 2 x 32/64-way TurboCore 50% minimum activations per system PowerVM and Electronic Service Agent are prerequisites ` All systems in a pool must have equivalent IBM hardware maintenance status Software licensed by core or S/N and its SWMA must have at least a minimum license on each machine on which the software will run 32c inactive 32c Active 32c inactive 32c Active Virtual processor and memory capacity (activations) may be simply rebalanced up to 12 times per year Activation / De-activation keys provided via CoD Project Office 2 x 64/128-way MaxCore Inactive resources on one system may be activated upon request to support periodic maintenance on another system in the capacity pool Activation / De-activation key provided to enable capacity on one system while another is being maintained Included On/Off Processor Days provide utility computing for short term projects, workload spikes or immediate capacity 960 days included per book 64c inactive 64c Active 64c inactive 64c Active 9
Upgrading to Power 795 Model upgrades from Power 595 to 795 are available Enterprises with Power 595 installed today have already invested in the frame, I/O and power infrastructure of the Power 795 POWER6 5.0 GHz 8 x 8c Book DDR2 4.2 GHz 8 x 8c Book DDR2 9119-FHA Upgrades POWER7 4.25 / 4.0 GHz 8 x 16 / 32c Books DDR3 3.7 GHz 8 x 24c Books DDR3 9119-FHB 10
Power 795 Upgrade Components Replaced Bulk Power Controllers (2) Light Panel Processor Books (up to 8) CPUs Memory Node Controllers (2) DCA (2) Locking bracket System Controllers (2) Frame Retained Bulk Power Supply Network Switch Media Drawer Cables Midplane System Clocks (2) I/O Hub cards Up to 4 per node 12X I/O Drawers 11
Availability / Reliability by Design for POWER7 Operating System Hot patch Kernel Storage Keys Hot Plug / Removal Fans & Power Supplies Hot Plug / Removal PCI-X & PCIe Adapters IO Drawers Hot Plug / Removal Disks Hot Add I/O racks Memory Chip Kill technology with Bit-steering Processors Dynamic De-Allocation Packaging Instruction Retry Alternate Processor Recovery Dual Clocks 770/780/795 Concurrent Add: 770/780 Eliminates Upgrade outages Concurrent Service{ 770/780 Eliminates Repair Outages Passive backplane No active components First Failure Data Capture Help eliminates intermittent failures Hypervisor Mainframe technology Mobility Partition Mobility WPAR Mobility
POWER7 RAS Feature Overview Standard Optional Not available RAS Item Power 750 Power 770 Power 780 Power 595 Power 795 Redundant / Hot Swap Fans & Blowers Hot Swap DASD / Media / PCI Adapters Concurrent Firmware Update Redundant / Hot Swap Power Supplies Dual disk controllers (split backplane) Processor Instruction Retry Alternate Processor Recovery Storage Keys PowerVM /Live Partition Mobility/Live Application Mobility Redundant Service Processors * * Redundant System Clocks * * Redundant / Hot Swap Power Regulators Dynamic Processor Sparing Memory Sparing Hot GX Adapter Add and Cold Repair Hot-node Add / Cold-node Repair * * * Hot-node Repair / Hot-memory Add * * * Dynamic Service Processor and System Clock Failover * * Hot-node Repair / Hot-memory Add for all nodes ** * * * Enterprise Memory Hot GX Adapter Repair Midplane connection for inter-nodal communication Active Memory Mirroring for Hypervisor * Requires two or more nodes ** Planned for 2H10 on 780, 1H11 on 795 All statements regarding IBM's future direction and intent are subject to change or 2010 withdrawal IBM Corporation without notice, and represent goals and objectives only.
Active Memory Mirroring for Hypervisor Eliminates system outages due to uncorrectable errors in memory Maintains two identical copies of the system hypervisor in memory at all times Both copies are simultaneously updated with any changes In the event of a memory failure on the primary copy, the second copy will be automatically invoked and a notification sent to IBM via the Electronic Service Agent (ESA) Memory Hypervisor Hypervisor Copy A Copy B Serious stamina. 14
Power 795 Operating System Release Support GA 9/30 SOD AIX IBM i AIX V7.1 AIX V6.1 TL06 AIX V5.3 TL12 SP 1, or later IBM i 7.1 IBM i with 6.1.1 MC, or later AIX V5.3 TL10 SP 5, or later AIX V5.3 TL11 SP 5, or later AIX V6.1 TL03 SP 7, or later AIX V6.1 TL04 SP 7, or later AIX V6.1 TL05 SP 3, or later Red Hat SUSE VIOS HMC Red Hat Enterprise Linux AP 5 Update 5 for POWER, or later SUSE Linux Enterprise Server 10 SP 3, or later SUSE Linux Enterprise Server 11 SP 1, or later VIOS 2.2, or later V7R720 Firmware efw 7.2e 15
Power Systems rperf Performance 3000 1.6 M CPW 3K rperf WOW!! 2500 2000 1500 1000 500 0 PS701 PS702 720 740 750 770 780 795* * Measured as 4 x 64-way LPARs
IBM Power Systems Reduce cost and simplify with massive consolidation Consolidating into the Power 795 substantially reduces costs, floor space and energy 50 Sun T5220s One IBM Power 795 1 IBM Power 570 2 HP Superdomes Solaris HP-UX HP-UX 5 Sun M4000s 5 HP rx6600s Linux Windows 100 HP DL380 G5s 17
POWER7 Processor POWER7 Active Memory Expansion
Active Memory Expansion - Details Innovative POWER7 technology For AIX 6.1 or later For POWER7 servers Initially requires system be HMC managed (excludes BladeCenter) System Director support 2H / 2010 Uses compression / decompression to expand physical memory available Small amount of processor resource provides a significant increase in the effective memory maximum Processor resource part of AIX partition s resource and licensing Actual expansion results dependent upon how Compressible the data being used in the application SAP SD 2-tier benchmark shows up to 100% expansion, Results will vary New no-charge estimation tool helps predict CPU usage & expansion No-charge 60-day trial available Chargeable feature to permanently enable Active Memory Expansion
Active Memory Expansion No Active Memory Expansion Active Memory Expansion Real Memory Size Memory True Memory Size Uncompressed Memory Pool Compressed Memory Expanded Memory Size Expanded Memory Reduce Physical Memory requirements for a LPAR Increase memory capacity Enable consolidation of LPARs onto a system
Active Memory Expansion Client Deployment 1 Planning Tool A. Part of AIX 6.1 TL4 B. Calculates data compressibility & estimates CPU overhead due to Active Memory Expansion C. Provides initial recommendations CPU Utilization Estimated Results Memory Expansion 2 60-Day Trial A. One-time, temporarily enablement B. Config LPAR based on planning tool C. Use AIX tools to monitor Act Mem Exp environment D. Tune based on actual results CPU Utilization Memory Expansion Actual Results App. Performance Memory Expansion 3 Deploy into Production A. Permanently enable Active Memory Expansion B. Deploy workload into production C. Continue to monitor workload using AIX performance tools Performance Time
Active Memory Expansion - Planning Tool Active Memory Expansion Modeled Statistics: ----------------------- Modeled Expanded Memory Size : 8.00 GB Expansion True Memory Modeled Memory CPU Usage Factor Modeled Size Gain Estimate --------- -------------- ----------------- ----------- 1.21 6.75 GB 1.25 GB [ 19%] 0.00 1.31 6.25 GB 1.75 GB [ 28%] 0.20 1.41 5.75 GB 2.25 GB [ 39%] 0.35 1.51 5.50 GB 2.50 GB[ 45%] 0.58 1.61 5.00 GB 3.00 GB [ 60%] 1.46 Active Memory Expansion Recommendation: --------------------- The recommended AME configuration for this workload is to configure the LPAR with a memory size of 5.50 GB and to configure a memory expansion factor of 1.51. This will result in a memory expansion of 45% from the LPAR's current memory size. With this configuration, the estimated CPU usage due to Active Memory Expansion is approximately 0.58 physical processors, and the estimated overall peak CPU resource required for the LPAR is 3.72 physical processors. This sample partition has fairly good expansion potential A nice sweet spot for this partition appears to be 45% expansion 2.5 GB gained memory Using about 0.58 cores additional CPU resource Tool included in AIX 6.1 TL4 SP2 Run tool in the partition of interest for memory expansion. Input desired expanded memory size. Tool outputs different real memory and CPU resource combinations to achieve the desired effective memory.
Active Memory Expansion: Partition On / Off With HMC, check Active Memory Expansion box and enter True and max memory Memory expansion factor To turn off expansion, unclick box Partition IPL required to turn on or off Active Memory Expansion Modeled Statistics: ----------------------- Modeled Expanded Memory Size : 8.00 GB 5.5 true 8.0 max Expansion True Memory Modeled Memory CPU Usage Factor Modeled Size Gain Estimate --------- -------------- ----------------- ----------- 1.21 6.75 GB 1.25 GB [ 19%] 0.00 1.31 6.25 GB 1.75 GB [ 28%] 0.20 1.41 5.75 GB 2.25 GB [ 39%] 0.35 1.51 5.50 GB 2.50 GB [ 45%] 0.58 1.61 5.00 GB 3.00 GB [ 60%] 1.46 Active Memory Expansion Recommendation: --------------------- The recommended AME configuration for this workload is to configure the LPAR with a memory size of 5.50 GB and to configure a memory expansion factor of 1.51. This will result in a memory expansion of 45% from the LPAR's current memory size. With this configuration, the estimated CPU usage due to Active Memory Expansion is approximately 0.58 physical processors, and the estimated overall peak CPU resource required for the LPAR is 3.72 physical processors.
Active Memory Expansion & Active Memory Sharing Active Memory Expansion Effectively gives more memory capacity to the partition using compression / decompression of the contents in true memory AIX partitions only Active Memory Sharing Moves memory from one partition to another Best fit when one partition is not busy when another partition is busy AXI, IBM i, and Linux partitions 15 10 5 0 #10 #9 #8 #7 #6 #5 #4 #3 #2 #1 Active Memory Expansion together with Active Memory Sharing Supported Considerations Only AIX partitions using Active Memory Expansion Active Memory Expansion value is dependent upon compressibility of data and available CPU resource
POWER7 Processor POWER7 Misc
PCIe SSD RAID Card Host Bus Features PCIe1.0 x8 for transfer speeds upto 2GB/s LP double wide card Device Bus Features SAS speed = 3 GB/s 4 Byte CRC for each LBA Memory Features 512MBs of Unified C/S & D/S No Write Cache Solid State Disk 177GB / 200 GB usable emlc: Total possible 708GB Performance Seq Rd 800 MB/sec JBOD/RAID Seq Wrt 800 MB/ Sec JBOD Seq Write 200MB/Sec RAID 5 45K IOPs Read/Write JBOD Software Support: IBM i / AIX / Linux Advanced Functions 1 to 4 SSD s per Card RAID 0,10,5 Hot Spare Back ground parity checking Auto Config RAID 0 Service Assumptions SSD Service is deferred repair
SSD PCIe SAS Adapter Description: SAS Adapter / Double wide 1-4 SSD bays Capacity: 177 GB (RAID) / 200GB (JBOD) per SSD per Drive Supported OS: AIX / Linux / IBM i Used in tpmc Benchmark with Power 780
4765-001: PCIe Cryptographic Coprocessor Hardware Security Module for Power Systems 2X - 7X Performance increase Depends on Software stack Housed within a tamper-responding environment Off-loads sensitive data processing and cryptographic functions Provides cryptographic key management & lockbox Provides secure-key cryptographic coprocessor functions Provides SSL acceleration functions Certified at NIST Level Physical security (FIPS4) Programmable (Hw & Sw) Follow-on to XCrypto 4764-001 AIX Support initially
POWER7 Virtualization Support Maintain 1 to 10 ratio for Physical cores to LPARs. Power 750: Power 755 Power 770 / 780: Power 795 Active Memory Expansion Up to 160 (320) LPARS Not Supported Up to 254 (640) LPARs Up to 254 (1,000) LPARs Active Memory Expansion compresses in-memory data to fit more data into memory Increases the effective amount of memory capacity Managed by the OS and hypervisor OS compresses and decompress data based on memory accesses Is transparent to applications
POWER7 Processor POWER7 Power 7 Servers
Power 750 Express 8233-E8B 4U 1 to 4 sockets 6 6 or 8 cores per socket 3.0 to 3.55 GHz Energy-Star Qualified Up to 181,000 CPW Up to 331.06 rperf
Power 750 Express System POWER7 Architecture DDR3 Memory 8233-E8B 6 Cores @ 3.3 GHz 8 Cores @ 3. 0, 3.3, 3.55 GHz Max: 4 Sockets Up to 512 GB 4U Depth: 28.8 System Unit SAS SFF Bays System Unit IO Expansion Slots Integrated SAS / SATA System Unit Integrated Ports Integrated Virtual Ethernet System Unit Media Bays IO Drawers w/ PCI slots Cluster Redundant Power and Cooling Certification (SoD) EnergyScale Up to 8 Drives (HDD or SSD) 73 / 146 / 300GB @ 15k (2.4 TB) (Opt: cache & RAID-5/6) PCIe x8: 3 Slots (2 shared) PCI-X DDR: 2 Slots 1 GX+ & Opt 1 GX++ 12X cards Yes 3 USB, 2 Serial, 2 HMC Quad 10/100/1000 Optional: Dual 10 Gb 1 Slim-line DVD & 1 Half Height PCIe = 4 Max: PCI-X = 8 MAX 12X SDR / DDR (IB technology) Yes (AC or DC Power) Single phase 240 VAC or -48 VDC NEBS / ETSI for harsh environments Active Thermal Power Management
Power 750 Express System Overview 3 PCIe & 2 PCI-X Slots TPMD Dual Power Supplies Half-High Bay (tape or removable disk Up to 4 DVD 8 SFF Bays Processor / Memory Cards (Disk or SSD) Fans
Power 770 9117-MMB 12 or 16 core 4U Nodes Up to 4 Nodes per system 3.1 and 3.5 GHz Capacity on Demand Enterprise RAS Up to 292,700 CPW Up to 579.39 rperf
Power 770 Power 770 4U x 32 inches Depth Maint Coverage: 9 x 5 Processor Technology L3 Cache Redundant Power & Cooling Redundant Server Processor Redundant Clock Hot Add Support Hot Service 6 Cores @ 3.55 GHz 8 Cores @ 3.1 GHz On Chip Yes Yes / Two Enclosure minimum Yes / Two Enclosure minimum System Unit Single Enclosure 4 Enclosures Yes Yes Processors Up to 2 Sockets 8 Sockets DDR3 Memory (Buffered) Up to 512 GB Up to 2 TB SAS/SSD SFF Bays 6 24 DVD-RAM Media Bays 1 Slim-line 4 Slim-line SAS / SATA Controller 2 / 1 8 / 4 PCIe bays 6 PCIe 24 PCIe GX++ Slots (12X DDR) 2 8 Integrated Ethernet Std: Quad 1Gb Opt: Dual 10Gb + Dual 1 Gb Std: Four Quad 1Gb Opt: Four x Dual 10Gb + Dual 1 Gb USB 3 12 12X I/O Drawers w/ PCI slots Max: 4 PCIe, 8 PCI-X Max: 16 PCIe, 32 PCI-X
Power 780 9179-MHB New Modular High-End Up to 64 Cores TurboCore Mode 3.86 or 4.14 GHz Up to 343,050 CPW Up to 685.09 rperf Capacity on Demand Enterprise RAS 24x7 Warranty PowerCare
Power 780 Processor Technology L3 Cache Redundant Power & Cooling Redundant Server Processor Redundant Clock Hot Add Support Hot Service Power 780 4 Cores @ 4.1 GHz TurboCore 8 Cores @ 3.8 GHz On Chip Yes Yes / Two Enclosure minimum Yes / Two Enclosure minimum System Unit Single Enclosure 4 Enclosures Processors 2 Sockets 8 Sockets DDR3 Memory (Buffered) Up to 512 GB Up to 2 TB Yes Yes Maint Coverage 24 X 7 PowerCare Support SAS/SSD SFF Bays (CEC) 6 24 DVD-RAM Media Bays 1 Slim-line 4 Slim-line SAS / SATA Controller 2 / 1 8 / 4 PCIe (CEC) 6 PCIe 24 PCIe GX++ Slots (12X DDR) 2 8 Integrated Ethernet Std: Quad 1Gb Opt: Dual 10Gb + Dual 1 Gb Std: Four Quad 1Gb Opt: Four x Dual 10Gb + Dual 1 Gb USB 3 12 12X I/O Drawers w/ PCI slots Max: 4 PCIe, 8 PCI-X Max: 16 PCIe, 32 PCI-X
POWER7 Modular Layout GX Slots PCIe Slots POWER7 Processor Chip 16 DIMM slots TPMD FSP 6 SFF Bays Interconnect POWER7 Processor Chip
FSP Cabling Configuration ( Logical View ) FSP/ Clock CEC Enclosure 1 Drw to Drw Connection FSP/ Clock CEC Enclosure 2 Drw to Drw Connection Drw to Drw Connection Drw to Drw Connection CEC Enclosure 3 CEC Enclosure 4 Point to Point Cabling Three cables Hot Drawer Add Support Add cables to live systems No disruptions Hot Failover support FSP Clock Concurrent Service Support Rear Front
POWER7 Modular CEC Disk/SSD Options Base: Dual Split Backplane 2 SAS controllers built in JBOD or RAID10 (AIX/Linux support) SAS SAS Optional: Triple Split Backplane Add #5901 PCIe SAS adapter Add #1815 cable assembly JBOD or RAID10 (AIX/Linux support) SAS SAS PCIe SAS Optional: No Split Backplane #5662 175MB write cache Dual Controller Adds Option of RAID-5/6 AIX/ IBM i /Linux support SAS / SAS + cache
IBM Power Systems. Smarter systems for a Smarter Planet. 41