Unidirectional ESD protection diode

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Rev. 1 5 March 2012 Product data sheet 1. Product profile 1.1 General description Unidirectional ElectroStatic Discharge (ESD) protection diode in a leadless ultra small SOD882 Surface-Mounted Device (SMD) plastic package designed to protect one signal line from the damage caused by ESD and other transients. 1.2 Features and benefits ESD protection of one line IEC 61000-4-5; (surge); I PPM =2.5A Ultra small SMD plastic package Rated peak pulse power: P PPM =150W AEC-Q101 qualified Ultra low leakage current: I RM <1nA ESD protection up to 30 kv 1.3 Applications Computers and peripherals Portable electronics Audio and video equipment Communication systems Cellular handsets and accessories 1.4 Quick reference data Table 1. Quick reference data Symbol Parameter Conditions Min Typ Max Unit V RWM reverse standoff voltage - - 36 V C d diode capacitance f = 1 MHz; V R =0V - - 30 pf 2. Pinning information Table 2. Pinning Pin Description Simplified outline Graphic symbol 1 cathode [1] 2 anode 1 2 1 2 Transparent top view sym035 [1] The marking bar indicates the cathode.

3. Ordering information 4. Marking Table 3. Ordering information Type number Package Name Description Version - leadless ultra small plastic package; 2 terminals; body 1.0 0.6 0.5 mm SOD882 Table 4. Marking codes Type number Marking code TC 5. Limiting values Table 5. Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol Parameter Conditions Min Max Unit P PPM rated peak pulse power t p =8/20 s [1][2] - 150 W I PPM rated peak pulse current t p =8/20 s [1][2] - 2.5 A T j junction temperature - 150 C T amb ambient temperature 55 +150 C T stg storage temperature 65 +150 C [1] Device stressed with ten non-repetitive current pulses (8/20 s exponential decay waveform according to IEC 61000-4-5 and IEC 61643-321). [2] Measured from pin 1 to pin 2. Table 6. ESD maximum ratings Symbol Parameter Conditions Min Max Unit V ESD electrostatic discharge voltage IEC 61000-4-2 [1][2] - 30 kv (contact discharge) machine model [2] - 400 V MIL-STD-883 (human body model) - 10 kv [1] Device stressed with ten non-repetitive ESD pulses. [2] Measured from pin 1 to pin 2. Table 7. ESD standards compliance Standard IEC 61000-4-2; level 4 (ESD) MIL-STD-883; class 3B (human body model) Conditions > 15 kv (air); > 8 kv (contact) > 8 kv All information provided in this document is subject to legal disclaimers. NXP B.V. 2012. All rights reserved. Product data sheet Rev. 1 5 March 2012 2 of 11

001aaa631 120 001aaa630 I PP 100 % I PP (%) 100 % I PP ; 8 μs 90 % 80 e t 50 % I PP ; 20 μs 40 10 % 0 0 10 20 30 40 t (μs) t r = 0.7 ns to 1 ns 30 ns 60 ns t Fig 1. 8/20 s pulse waveform according to IEC 61000-4-5 and IEC 61643-321 Fig 2. ESD pulse waveform according to IEC 61000-4-2 6. Characteristics Table 8. Characteristics T amb =25 C unless otherwise specified. Symbol Parameter Conditions Min Typ Max Unit V RWM reverse standoff voltage - - 36 V I RM reverse leakage current V RWM =36V - <1 10 na V BR breakdown voltage I R = 2 ma 38.2 39.0 39.8 V C d diode capacitance f = 1 MHz; V R = 0 V - 18 30 pf V CL clamping voltage [1][2] I PP = 1 A - - 58 V I PPM = 2.5 A - - 80 V r dyn dynamic resistance I R =10A [3] - 9.5 - [1] Device stressed with 8/20 s exponential decay waveform according to IEC 61000-4-5 and IEC 61643-321. [2] Measured from pin 1 to pin 2. [3] Non-repetitive current pulse, Transmission Line Pulse (TLP) t p = 100 ns; square pulse; ANS/IESD STM5-1-2008. All information provided in this document is subject to legal disclaimers. NXP B.V. 2012. All rights reserved. Product data sheet Rev. 1 5 March 2012 3 of 11

10 2 P PPM (W) aaa-002437 P PPM 1.2 006aab321 P PPM(25 C) 0.8 10 0.4 1 10-1 1 10 t p (ms) 0 0 50 100 150 200 T j ( C) T amb =25 C Fig 3. Rated peak pulse power as a function of square pulse duration; maximum values Fig 4. Relative variation of rated peak pulse power as a function of junction temperature; typical values C d (pf) 20 16 aaa-002438 I 12 8 4 V CL V BR V RWM I RM I R + P-N V 0 0 8 16 24 32 40 V R (V) I PP I PPM 006aab324 f=1mhz; T amb =25 C Fig 5. Diode capacitance as a function of reverse voltage; typical values Fig 6. V-I characteristics for a unidirectional ESD protection diode All information provided in this document is subject to legal disclaimers. NXP B.V. 2012. All rights reserved. Product data sheet Rev. 1 5 March 2012 4 of 11

ESD TESTER Cs Rd 450 Ω RG 223/U 50 Ω coax 10x ATTENUATOR 4 GHz DIGITAL OSCILLOSCOPE 50 Ω IEC 61000-4-2 network C s = 150 pf; R d = 330 Ω DUT (DEVICE UNDER TEST) vertical scale = 2 kv/div horizontal scale = 10 ns/div vertical scale = 100 V/div horizontal scale = 10 ns/div unclamped +8 kv ESD pulse waveform (IEC 61000-4-2 network) clamped +8 kv ESD pulse waveform (IEC 61000-4-2 network) vertical scale = 2 kv/div horizontal scale = 10 ns/div vertical scale = 100 V/div horizontal scale = 10 ns/div unclamped -8 kv ESD pulse waveform (IEC 61000-4-2 network) clamped -8 kv ESD pulse waveform (IEC 61000-4-2 network) aaa-002439 Fig 7. ESD clamping test setup and waveforms All information provided in this document is subject to legal disclaimers. NXP B.V. 2012. All rights reserved. Product data sheet Rev. 1 5 March 2012 5 of 11

7. Application information The device is designed for the protection of one unidirectional data line from surge pulses and ESD damage. The device is suitable on lines where the signal polarities are either positive or negative with respect to ground. The device provides a surge capability of 150 W for an 8/20 s waveform. line to be protected (positive signal polarity) line to be protected (negative signal polarity) ESD protection diode ESD protection diode unidirectional protection of one line aaa-002440 Fig 8. Application diagram 8. Test information Circuit board layout and protection device placement Circuit board layout is critical for the suppression of ESD, Electrical Fast Transient (EFT) and surge transients. The following guidelines are recommended: 1. Place the device as close to the input terminal or connector as possible. 2. Minimize the path length between the device and the protected line. 3. Keep parallel signal paths to a minimum. 4. Avoid running protected conductors in parallel with unprotected conductors. 5. Minimize all Printed-Circuit Board (PCB) conductive loops including power and ground loops. 6. Minimize the length of the transient return path to ground. 7. Avoid using shared transient return paths to a common ground point. 8. Use ground planes whenever possible. For multilayer PCBs, use ground vias. 8.1 Quality information This product has been qualified in accordance with the Automotive Electronics Council (AEC) standard Q101 - Stress test qualification for discrete semiconductors, and is suitable for use in automotive applications. All information provided in this document is subject to legal disclaimers. NXP B.V. 2012. All rights reserved. Product data sheet Rev. 1 5 March 2012 6 of 11

9. Package outline 0.62 0.55 0.50 0.46 0.30 0.22 2 0.65 1.02 0.95 0.30 0.22 1 Dimensions in mm 0.55 0.47 cathode marking on top side (if applicable) 03-04-17 Fig 9. Package outline SOD882 10. Packing information 11. Soldering Table 9. Packing methods The indicated -xxx are the last three digits of the 12NC ordering code. [1] Type number Package Description Packing quantity 10000 SOD882 4 mm pitch, 8 mm tape and reel -315 [1] For further information and the availability of packing methods, see Section 14. 1.3 0.7 R0.05 (8 ) solder lands 0.9 0.6 0.7 0.8 solder resist solder paste occupied area 0.3 0.4 0.5 Dimensions in mm sod882_fr Fig 10. Reflow soldering is the only recommended soldering method. Reflow soldering footprint SOD882 All information provided in this document is subject to legal disclaimers. NXP B.V. 2012. All rights reserved. Product data sheet Rev. 1 5 March 2012 7 of 11

12. Revision history Table 10. Revision history Document ID Release date Data sheet status Change notice Supersedes v.1 20120305 Product data sheet - - All information provided in this document is subject to legal disclaimers. NXP B.V. 2012. All rights reserved. Product data sheet Rev. 1 5 March 2012 8 of 11

13. Legal information 13.1 Data sheet status Document status [1][2] Product status [3] Definition Objective [short] data sheet Development This document contains data from the objective specification for product development. Preliminary [short] data sheet Qualification This document contains data from the preliminary specification. Product [short] data sheet Production This document contains the product specification. [1] Please consult the most recently issued document before initiating or completing a design. [2] The term short data sheet is explained in section Definitions. [3] The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status information is available on the Internet at URL http://www.nxp.com. 13.2 Definitions Draft The document is a draft version only. The content is still under internal review and subject to formal approval, which may result in modifications or additions. NXP Semiconductors does not give any representations or warranties as to the accuracy or completeness of information included herein and shall have no liability for the consequences of use of such information. Short data sheet A short data sheet is an extract from a full data sheet with the same product type number(s) and title. A short data sheet is intended for quick reference only and should not be relied upon to contain detailed and full information. For detailed and full information see the relevant full data sheet, which is available on request via the local NXP Semiconductors sales office. In case of any inconsistency or conflict with the short data sheet, the full data sheet shall prevail. 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This document supersedes and replaces all information supplied prior to the publication hereof. Suitability for use in automotive applications This NXP Semiconductors product has been qualified for use in automotive applications. Unless otherwise agreed in writing, the product is not designed, authorized or warranted to be suitable for use in life support, life-critical or safety-critical systems or equipment, nor in applications where failure or malfunction of an NXP Semiconductors product can reasonably be expected to result in personal injury, death or severe property or environmental damage. NXP Semiconductors and its suppliers accept no liability for inclusion and/or use of NXP Semiconductors products in such equipment or applications and therefore such inclusion and/or use is at the customer's own risk. Applications Applications that are described herein for any of these products are for illustrative purposes only. NXP Semiconductors makes no representation or warranty that such applications will be suitable for the specified use without further testing or modification. Customers are responsible for the design and operation of their applications and products using NXP Semiconductors products, and NXP Semiconductors accepts no liability for any assistance with applications or customer product design. It is customer s sole responsibility to determine whether the NXP Semiconductors product is suitable and fit for the customer s applications and products planned, as well as for the planned application and use of customer s third party customer(s). Customers should provide appropriate design and operating safeguards to minimize the risks associated with their applications and products. NXP Semiconductors does not accept any liability related to any default, damage, costs or problem which is based on any weakness or default in the customer s applications or products, or the application or use by customer s third party customer(s). Customer is responsible for doing all necessary testing for the customer s applications and products using NXP Semiconductors products in order to avoid a default of the applications and the products or of the application or use by customer s third party customer(s). NXP does not accept any liability in this respect. Limiting values Stress above one or more limiting values (as defined in the Absolute Maximum Ratings System of IEC 60134) will cause permanent damage to the device. Limiting values are stress ratings only and (proper) operation of the device at these or any other conditions above those given in the Recommended operating conditions section (if present) or the Characteristics sections of this document is not warranted. Constant or repeated exposure to limiting values will permanently and irreversibly affect the quality and reliability of the device. Terms and conditions of commercial sale NXP Semiconductors products are sold subject to the general terms and conditions of commercial sale, as published at http://www.nxp.com/profile/terms, unless otherwise agreed in a valid written individual agreement. In case an individual agreement is concluded only the terms and conditions of the respective agreement shall apply. NXP Semiconductors hereby expressly objects to applying the customer s general terms and conditions with regard to the purchase of NXP Semiconductors products by customer. All information provided in this document is subject to legal disclaimers. NXP B.V. 2012. All rights reserved. Product data sheet Rev. 1 5 March 2012 9 of 11

No offer to sell or license Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights. Export control This document as well as the item(s) described herein may be subject to export control regulations. Export might require a prior authorization from competent authorities. Quick reference data The Quick reference data is an extract of the product data given in the Limiting values and Characteristics sections of this document, and as such is not complete, exhaustive or legally binding. 13.4 Trademarks Notice: All referenced brands, product names, service names and trademarks are the property of their respective owners. 14. Contact information For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: salesaddresses@nxp.com All information provided in this document is subject to legal disclaimers. NXP B.V. 2012. All rights reserved. Product data sheet Rev. 1 5 March 2012 10 of 11

15. Contents 1 Product profile.......................... 1 1.1 General description..................... 1 1.2 Features and benefits.................... 1 1.3 Applications........................... 1 1.4 Quick reference data.................... 1 2 Pinning information...................... 1 3 Ordering information..................... 2 4 Marking................................ 2 5 Limiting values.......................... 2 6 Characteristics.......................... 3 7 Application information................... 6 8 Test information......................... 6 8.1 Quality information...................... 6 9 Package outline......................... 7 10 Packing information..................... 7 11 Soldering.............................. 7 12 Revision history......................... 8 13 Legal information........................ 9 13.1 Data sheet status....................... 9 13.2 Definitions............................. 9 13.3 Disclaimers............................ 9 13.4 Trademarks........................... 10 14 Contact information..................... 10 15 Contents.............................. 11 Please be aware that important notices concerning this document and the product(s) described herein, have been included in section Legal information. NXP B.V. 2012. All rights reserved. For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: salesaddresses@nxp.com Date of release: 5 March 2012 Document identifier: