When Less Is More: Bigger & Faster Memory in Shrinking Packages for the Mobile Market

Similar documents
Ushering in the 3D Memory Era with V- NAND

Samsung emcp. WLI DDP Package. Samsung Multi-Chip Packages can help reduce the time to market for handheld devices BROCHURE

Flash Storage Trends & Ecosystem

Flash Memory Overview: Technology & Market Trends. Allen Yu Phison Electronics Corp.

JEDEC Mobile Forum 2014

SSDs & Memory Why it matters what you choose?

White Paper. Samsung V-NAND. Yield more capacity, performance and power efficiency

Why Storage Solutions Are Accelerating the Mobile Revolution

2012 NAND Flash Outlook

Signs of Intelligent Life: AI Simplifies IoT

The Many Flavors of NAND and More to Come

UFS 3.0 Controller Design Considerations

Optimize your system designs using Flash memory

Eco-efficiency. ESH R&D Center. Part 1. Introduction Part 2. Case study. Environment, Safety & Health

Chapter 0 Introduction

Green Memory Solution. Jung-Bae Lee

Mobile Industry "Need for Speed"

Flash Storage Solutions for Embedded Applications Making the Right Choice

Leading the 10Gig Wave. Jefferies 2013 Global Technology Conference May 7, 2013

NAND Flash Memory. Jin-Soo Kim Computer Systems Laboratory Sungkyunkwan University

MOTOROLA. Beyond Mobile Broadband. Anil Barot Director of Strategy & Portfolio Mgmt

The Evolution of Mobile

Trends in Communications

Company Overview May Silicon Motion Technology Corp. All rights reserved.

3D NAND Technology Scaling helps accelerate AI growth

This is an era of UFS and UFS Card

Memory Industry Dynamics & Market Drivers Memory Market Segments Memory Products Dynamics Memory Status 2007 Key Challenges for 2008 Future Trends

Memory Industry Report T A B L E O F C O N T E N T S

Cisco Visual Networking Index (VNI) Mobile Data Forecast

From Boolean Algebra to Smart Glass

Sustaining profitable growth in Mobile

The Drive Interface Progress Cycle

Samsung System LSI Business

Innovations in Non-Volatile Memory 3D NAND and its Implications May 2016 Rob Peglar, VP Advanced Storage,

Customization Key to Embedded Storage Applications

How Good Is Your Memory? An Architect s Look Inside SSDs

Emerging IC Packaging Platforms for ICT Systems - MEPTEC, IMAPS and SEMI Bay Area Luncheon Presentation

White Paper: The V-Nand paradigm shift

System-on-Chip Architecture for Mobile Applications. Sabyasachi Dey

Secure data storage -

IFX Day Secure Mobile Solutions. Dominik Bilo CMO Secure Mobile Solutions Business Group. November 16, Munich. IFX Day 2004.

iphone 5 and iphone 7 (April 14 and 17, 2017) iphone 5 WiFi module iphone 7 battery application processors wafer level packaging 3D NAND

The Evolving NAND Flash Business Model for SSD. Steffen Hellmold VP BD, SandForce

2013 National HDT Rally

Reducing Emissions Re-enables Growth; Electronics Provides the Key. Presented by : Robert Barnes Date : 2 nd December2010

NAND Flash Memory. Jinkyu Jeong Computer Systems Laboratory Sungkyunkwan University

SanDisk Overview. Mike Chenery Senior Fellow. 5th Annual Needham HDD & Memory Conference Boston, MA. November 3, 2011

Solid State Drives Leading the Innovation Curve

Why a digital hotel compendium is viable today

Wireless. Gilles Delfassy. Senior Vice President Wireless Terminals Business Unit

It s Not Your. Drive, or Is It? Transformational Storage Technology. John Scaramuzzo Senior VP/GM

Don t Forget the Memory. Dean Klein, VP Memory System Development Micron Technology, Inc.

Meeting the 3G/4G Challenge: Maintaining Profitability in the Mobile Backhaul Through Ethernet

26 May Bratislava EXPO. David Hovey. C Cisco and/or its affiliates. All rights reserved.

Mission Impossible: Surviving Today s Flood of Critical Data

Flash Memory. 2D NAND vs. 3D NAND. White Paper F-WP002

Changing the World: The Flash Memory Revolution. Eli Harari Chairman & CEO SanDisk Corporation

BRIDGING THE GLOBE WITH INNOVATIVE TECHNOLOGY

Predicting the Next Wave of Semiconductor Growth

Examine these great deals.

SSD (Solid State Disk)

Why Next-Generation NAND Flash Requires a Dedicated Test Solution

Mobile Data Trends and Networks Fit for Purpose

Flash Product Roadmap Q4 Product Management Div. 10/30/2018

Extending the Benefits of GDDR Beyond Graphics

Samsung Electronics. 10 th KRX Global Investors Conference -1 -

Factors Driving LTE Adoption. Anil Barot Director Broadband Strategy & Device Alliance Ecosystem April 1, 2009

Transitioning from e-mmc to UFS: Controller Design. Kevin Liu ASolid Technology Co., Ltd.

Technology for Innovators TM TI WIRELESS TECHNOLOGY DELIVERING ALL THE PROMISE OF 3G

Embracing the Next Wave

EUROPE ERICSSON MOBILITY REPORT APPENDIX NOVEMBER

Advanced Information Storage 11

Next Generation Data Center : Future Trends and Technologies

3D systems-on-chip. A clever partitioning of circuits to improve area, cost, power and performance. The 3D technology landscape

INTRODUCTION TO WIRELESS COMMUNICATION

Key Components of Mobile Device -A whole new Era for emmc- Memory and Storage Division Sean Yang June 5 th, 2014

Embedded and Removable Flash Memory Storage Solutions for Mobile Handsets and Consumer Electronics

Slide 1. Opera Max. Migrating the next billion smartphone users for better app experience

Flash Technology: Annual Update

Samsung s Green SSD (Solid State Drive) PM830. Boost data center performance while reducing power consumption. More speed. Less energy.

Toshiba America Electronic Components, Inc. Flash Memory

Toward a Memory-centric Architecture

It Takes Guts to be Great

Business Case for the Cisco ASR 5500 Mobile Multimedia Core Solution

Mobile Computing. Juha-Matti Liukkonen, Nov 17, 2010

Technology Advancement in SSDs and Related Ecosystem Changes

Augmented Reality Reality or Novelty?

Samsung Chromebook for Education. Innovation for next-generation learning

FTTH Forum 15. Mai im Trafo Baden

SSDs Driving Greater Efficiency in Data Centers

The Networked SocIety

Optimizing Your Memory Sub-System

Femtocells as a Tool for Data Off-Load November 18 th 2010 CDG-Femto Forum Live Webinar: How Femtocells are Enhancing CDMA Networks

I N V E S T O R S P R E S E N T A T I O N

The Internet of Things is Now: M2M Devices Forecast

When it comes to double-density Flash memory, some pairs are just better.

Wireless Internet Caucus. Wireless Metrics. Dr. Robert F. Roche CTIA-The Wireless Association. March 21, 2011

SanDisk Choosing the Right Non- Volatile Memory for Your Application Needs. August 2009

Optimizes Embedded Flash-based Storage for Automotive Use

Technology Watch. Data Communications 2 nd Quarter, 2012

Transcription:

When Less Is More: Bigger & Faster Memory in Shrinking Packages for the Mobile Market Kathy Choe Thomas, Flash Product Mktg Samsung Semiconductor, Inc.

Living in the Connected World Like it or Not, We Are Connected Anytime, Anywhere Cloud Services Mobile Social Media Imaging Augmented Reality Online Games Wireless Bio Sensing Tagging Gesture 3D Displays Robotics Nano Cloud computing and seamless connectivity are real Mobile devices going far beyond laptops & cell phones Memory technology at the center of this evolution www.cisco.com, www.lightninglaboratories.com

Connect Everything, Everywhere 1980 s Stand-alone Ever-increasing Data Traffic Load 40% Annual Growth 55,560 1990 s 2010 s Wired Connectivity Hardware Performance Improvements & Virtualization 10,160 2008 14,743 2009 42,165 2013 30,811 21,367 2012 2011 2010 (Petabytes Per Month) The Cisco Visual Networking Index Cloud Computing & Seamless Connectivity Smart Mobile Clients for Rich Mobile Experience

Mobile Internet will be 10X Desktop Internet Computing Growth Drivers Over Time 100,000 10,000 1,000 100 10 1 Increasing Integration Minicomputer Mainframe 10MM+ Units PC 100MM+ Units Desktop Internet 1B+ Units / Users Mobile Internet 10B+ Units??? 1MM+ Units 1960 1970 1980 1990 2000 2010 2020 Source: Morgan Stanley

Mobile Internet Users to Outgrow Desktop Users Mobile users to exceed desktop users within 5 years Connectivity Everywhere More WiFi/Broadband Products Text, Email, Internet on-the-fly Mobile Apps, ecommerce Cloud Computing (Data 24x7) Growth of Social Networking Creating the NEED for: Instant communication Getting & Giving Info Instant Gratification The NEED to be Always Connected Source: Morgan Stanley Research

Social Networking Driving Internet Usage Social Networking > Email Communication Source: Morgan Stanley Research

Evolution of Device Usage, Interface, & Content Evolution Changes: Hardware, Software Form Factor Usage Model Content Form, Source Memory Solutions Source: Morgan Stanley Research Physical Digital Content. Home/Office Mobile Cloud

Smartphones Broaden the Mobile Experience Breakdown of Smartphone Usage Time EMAIL 10% MUSIC 12% VOICE 47% GAME 2% Seamless Connectivity At Home,At Work & On the Go Others 2% TEXT 15% INTERNET 12% Mobile Phone Production Unit in Billions 1.2 1.0 0.2 1.0 0.3 Smartphones Smartphones greatly increasing mobile internet usage 1.3 1.4 1.0 Smartphones Drive Growth 0.4 1.5 1.0 0.5 2009 2010 2011 2012 Non-Smartphones isuppli, Gartner CAGR 8% 0% 36%

Smartphones Driving Memory Consumption GB s/system growing 3X faster than PC s Smartphone memory content averaging over 7GB+/set in 2010 7GB+ > 300MB 173% 111% 188% 75% 119% 3.6GB 6.5~6.9GB 178MB 3.4GB DRAM NAND Smartphones driving Memory Consumption 1.6GB Overall handset 273% DRAM 746 426 NAND 0.02 1.0 3.8 6.2 26 70 148

Overall Mobile Market Driving Memory Demand Mobile DRAM Growth @ CAGR of 75% NAND Growth @ CAGR of 109% DRAM Bit Outlook NAND Bit Outlook 1Gb Equivalent 31B 16Gb Equivalent 13.5B CAGR 44% 10% CAGR 53% 6% 10B 84% 75% 80% 42% 2009 2012 14% 4% 2.8B 26% 109% 14% 160% 2009 2012 Computers Mobile Others SSD Mobile Others Company Data

Small Devices Driving Big Requirements Seamless Connectivity Instant ON Always ON Battery Life Portability The Mobile Network Storage Performance Reliability Memory technology must support these requirements Memory technology can enhance these requirements

THINnovation Diet with Samsung Memory Build Muscle: More Memory in the same space Trim the Fat: Die Shrinks = Smaller Chips/Pkg Run Fast: Higher Performance Memory Consume Less: Power Reduction even at higher performance Run Long: Lower Power = Longer Battery Life Better Products Better User Experience

THINnovation Diet with Samsung Memory Trim the Fat Die Shrinks = Smaller Chips/Pkg Conventional Mobile Memory Build More Muscle More Memory in the Same Pkg (Die Stack) Run Fast: Higher Performance Memory Consume Less: Power Reduction even at higher performance Run Long: Lower Power = Longer Battery Life Better Products Better User Experience

Packing Transistors into Tinier Silicon DRAM NAND 2009 2012 2009 2012 Process 56nm 2Xnm 35nm 1Xnm Process Density 2Gb 8Gb Density 32Gb 128Gb/ 256Gb Density doubling every 1-2 years until 2012 Performance & Power Reduction improvements Cost Reduction/Productivity Increase with each new shrink Economies of Scale through Process Migration continue

MCP & MoviNAND: More Die & Capacity per Pkg Chip Stack Number 16GB 120GB Packaging Technology 20 EA 11Gb 32Chip Stack 15 EA 16 Chip Stack 64GB 3.2Gb movinand (emmc) 10 EA 8 EA 8- Chip 6/7-Chip 4/5-Chip 3- Chip 1/2- Chip 8 Chip Stack 10 Chip Stack 8GB 16GB 32GB 6 EA MCP 5Chip 4GB 4GB 16GB 4 EA movimcp Year 2004 2005 2006 2007 2008 2009 2010 2011

Unique Packaging: PoP for Slim & Small ND MCP Modem Over 40% Space Gain + Higher Performance MCP Solution POP Solution Modem (169mm2) ND MCP (136.5mm2) POP Stack ( CDMA Phone ) Over 305mm 2 144mm 2 ~ 196mm 2 PoP = Package-on-Package 1 Package footprint instead of 2 40% space gain > 50% higher performance Proven high volume manufacturing capability

Samsung s 1-Stop Shop for Memory Total memory package for any & all mobile devices High Density, High Performance, Low Power, Small Package Size movinand (emmc) SSD Mobile DRAM Internal Memory External (Optional) Storage Up to 256GB LPDDR1/LPDDR2 Up to 64GB Up to 4Gb & 800MHz SD & microsd Cards 2-bit MLC 3-bit TLC CL6/CL10 CL2/CL4 Hi Speed MCP Up to 32GB High Density Communication Memory NAND/eMMC+DRAM NOR+UtRAM Any combo in single pkg Baseband/Cellular to Total System Memory

Memory Highlights Samsung increasing memory in the space of a single chip Packing higher density into a single die Up to 16 die stacks into a single chip Stacked Package-on-Package Power reduction through process shrinks and lower voltages While increasing performance! Samsung Memories creating value & driving mobile evolution Better End Products Better User Experience THINnovation! Samsung has the expertise in advanced Memory technology to drive the mobile revolution with THINnovative solutions

Mobile Applications Win with Samsung! Samsung at the center of Mobile and Multimedia evolution Creating the Future with Samsung THINnovation

Thank You!