SS9LF00/00/00 and SS9VF00/00/00 ns and BKE EOL Supplemental Information Description Pin Assignments he SS9LF00, SS9LF00, SS9LF00 and SS9VF00, SS9VF00, SS9VF00 are 8K x8, K x8 and K x8 CMOS Multi-Purpose Flash (MPF) manufactured with SS s proprietary, high performance CMOS SuperFlash technology. he split-gate cell design and thick-oxide tunneling injector attain better reliability and manufacturability compared with alternate approaches. he SS9LF00/00/00 devices write (Program or Erase) with a.0-.v power supply. he SS9VF00/00/00 devices write with a.7-.v power supply. he devices conform to JEDEC standard pinouts for x8 memories. his document provides supplemental information about the ns and BKE package parts which are End-of-Life (EOL). Except for the information provided herein, the EOL parts behave as described in the SS9LF00/00/00 and SS9VF00/00/00 data sheet DS-0000. See page for specific part numbers. OP VIEW (balls facing down) SS9LF/VF00 OP VIEW (balls facing down) SS9LF/VF00 A A A A9 A8 A WE# A A A A A VSS A A0 DQ DQ7 DQ VDD DQ DQ DQ VDD A DQ0 DQ A A0 CE# OE# VSS 0 8-tfbga BK P.0 A A A A9 A8 A WE# A A A A A A VSS A0 DQ DQ7 DQ VDD DQ DQ DQ VDD A DQ0 DQ A A0 CE# OE# VSS 0 8-tfbga BK P.0 OP VIEW (balls facing down) SS9LF/VF00 A A A A9 A8 A WE# A A8 A A A A A VSS A0 DQ DQ7 DQ VDD DQ DQ DQ VDD A DQ0 DQ A A0 CE# OE# VSS 0 8-tfbga BK P.0 Figure : Pin Assignment for 8-ball FBGA (mm x 8mm) for Mbit, Mbit, and Mbit 0 Silicon Storage echnology, Inc. DS0000A 0/
SS9LF00/00/00 and SS9VF00/00/00 ns and BKE EOL Suplemental Information AC Characteristics able : Read Cycle iming Parameters V DD =.0-.V for SS9LF00/00/00 Symbol Parameter Min Max Units RC Read Cycle ime ns CE Chip Enable Access ime ns AA Address Access ime ns OE Output Enable Access ime 0 ns CLZ CE# Low to Active Output 0 ns OLZ OE# Low to Active Output 0 ns CHZ CE# High to High-Z Output ns OHZ OE# High to High-Z Output ns OH Output Hold from Address Change 0 ns Packaging Diagram SS9LF00- SS9LF00- SS9LF00-.. his parameter is measured only for initial qualification and after a design or process change that could affect this parameter. OP VIEW BOOM VIEW 8.00 ± 0.0.0 0.80 0. ± 0.0 (8X).00 ± 0.0.00 0.80 H G F E D C B A A CORNER SIDE VIEW.0 ± 0.0 A CORNER SEAING PLANE 0. ± 0.0 0. mm Note:. Complies with JEDEC Publication 9, MO-0, variant 'AB-', although some dimensions may be more stringent.. All linear dimensions are in millimeters.. Coplanarity: 0. mm. Ball opening size is 0.8 mm (± 0.0 mm) 8-tfbga-BK-x8-0mic- Figure : 8-ball hin-profile, Fine-pitch Ball Grid Array (FBGA) mm x 8mm SS Package Code: BK 0 Silicon Storage echnology, Inc. DS0000A 0/
SS9LF00/00/00 and SS9VF00/00/00 ns and BKE EOL Suplemental Information Product Ordering Information SS 9 VF 00 - - C - NHE XX XX XXX - XX - XX - XXX Environmental Attribute E = non-pb Package Modifier H = leads K = 8 balls M = balls ( possible positions) Package ype B = FBGA (0.8mm pitch, mm x 8mm) N = PLCC M = WFBGA (0.mm pitch, mm x mm) W = SOP (type, die up, 8mm x mm) emperature Range C = Commercial = 0 C to +70 C I = Industrial = -0 C to +8 C Minimum Endurance = 0,000 cycles Read Access Speed = ns = ns 70 = 70 ns Device Density 00 = Mbit 00 = Mbit 00 = Mbit Voltage L =.0-.V V =.7-.V Product Series 9 = Multi-Purpose Flash. Environmental suffix E denotes non-pb solder. SS non-pb solder devices are RoHS compliant. 0 Silicon Storage echnology, Inc. DS0000A 0/
SS9LF00/00/00 and SS9VF00/00/00 ns and BKE EOL Suplemental Information Valid combinations for SS9LF00 SS9LF00--C-NHE SS9LF00--C-WHE SS9LF00--C-BKE SS9LF00--C-MME Valid combinations for SS9VF00 SS9VF00-70-C-BKE SS9VF00-70-I-BKE Valid combinations for SS9LF00 SS9LF00--C-NHE SS9LF00--C-WHE SS9LF00--C-BKE SS9LF00--C-MME Valid combinations for SS9VF00 SS9VF00-70-C-BKE SS9VF00-70-I-BKE Valid combinations for SS9LF00 SS9LF00--C-NHE SS9LF00--C-WHE SS9LF00--C-BKE Valid combinations for SS9VF00 SS9VF00-70-C-BKE SS9VF00-70-I-BKE Note:Valid combinations are those products in mass production or will be in mass production. Consult your SS sales representative to confirm availability of valid combinations and to determine availability of new combinations. 0 Silicon Storage echnology, Inc. DS0000A 0/
SS9LF00/00/00 and SS9VF00/00/00 ns and BKE EOL Suplemental Information able : Revision History Revision Description Date A EOL document for ns parts and BKE parts Jun 0 ISBN:978--077-9- 0 Silicon Storage echnology, Inc a Microchip echnology Company. All rights reserved. SS, Silicon Storage echnology, the SS logo, SuperFlash, MP, and FlashFlex are registered trademarks of Silicon Storage echnology, Inc. MPF, SQI, Serial Quad I/O, and Z-Scale are trademarks of Silicon Storage echnology, Inc. All other trademarks and registered trademarks mentioned herein are the property of their respective owners. Specifications are subject to change without notice. Refer to www.microchip.com for the most recent documentation. For the most current package drawings, please see the Packaging Specification located at http://www.microchip.com/packaging. Memory sizes denote raw storage capacity; actual usable capacity may be less. SS makes no warranty for the use of its products other than those expressly contained in the Standard erms and Conditions of Sale. For sales office locations and information, please see www.microchip.com. Silicon Storage echnology, Inc. A Microchip echnology Company www.microchip.com 0 Silicon Storage echnology, Inc. DS0000A 0/