CHAPTER 12 ARRAY SUBSYSTEMS [ ] MANJARI S. KULKARNI

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CHAPTER 2 ARRAY SUBSYSTEMS [2.4-2.9] MANJARI S. KULKARNI

OVERVIEW Array classification Non volatile memory Design and Layout Read-Only Memory (ROM) Pseudo nmos and NAND ROMs Programmable ROMS PROMS, EPROMs, EEPROMs and Flash Serial Access Memories Shift Registers and Queues Content-Addressable Memory Programmable Logic Array Robust Memory Design Summary 2

Read Only Memory CLASSIFICATION ROMs (i)mask Programmed ROMs - Data is written during chip fabrication using a photo mask (ii)fused ROMs - Data is written by blowing the fuse electrically, hence cannot be modified later Programmable Read Only Memories (PROMs) Data is written after chip fabrication (i)erasable PROMs - Complete block is erased using UV light which is penetrated through glass window (ii)electrically Erasable PROMs - 8 bit data is erased at a time, hence slower (iii) Flash - Programmed using high electrical voltage. Erases data in blocks hence faster 3

(A) Read-Only Memory Mask ROM Ex: Pseudo-nMOS NOR ROM Storing Bit information Presence or absence of 4 transistor Selective placement of metal contacts according to customer requirement Threshold implant by making the transistor permanently OFF Pseudo-nMOS ROM Static power and large contact area Ex: Active High Word lines bit5 - - - - - - - - - - - - - bit

Polysilicon vertical 2:4 ROW DECODER and ROM LAYOUT Inverters generating A[-] _bar signals Horizontal Polysilicon P+ diff N+ diff ROM layout 5

Pseudo-nMOS NAND ROMs Ex: Active low word lines NMOS on non-selected word lines are ON bit5 - - - - - - - - - - - - - bit 6

Concept of Floating Gate Programming Changing the threshold voltage[fowler Nordheim Tunneling] Two threshold voltage - two states and 7

Programming Floating Gate STORING STATES (i) Positive threshold [enhancement mode] Electrons accumulated near the floating gate increases the threshold voltage (ii) Negative threshold [depletion mode] Electrons leave the floating gate decreasing the threshold voltage Gnd Vg>Vd Vd Vpp Gnd Open Electrons accumulated (i) Positive Vt (Logic ) (ii) Negative Vt (Logic ) 8

Flash Memory NAND Flash Name coined - blocks of memory were erased all at once in a flash [Masuoka84] Flash memory based on floating gate concept ssl - String select gsl - Ground select Page - no. of cells on a word line 9

Flash - Read and Program Operations Program v logic 8v logic Read -Vt-> bit line discharges +Vt-> bit line remains the same ON---> v---> 2v--> v---> OFF Substrate - GND 3v3---> 4V5---> V---> 4V5---> 3v3--->

Serial Access Memories - Shift Registers Look for hold timing! No Logic between the registers Min delay violation How to avoid? Use - buffers Variant Serial In Parallel Out [SIPO] Parallel In Serial Out [PISO] Four Stage 8-bit Shift Register Serial In Parallel Out Parallel In Serial Out

Shift Register - Variant 64 stage [-63] Tapped Delay Line Multiplexer control the delay Delay blocks built from 32,6,8,4,2,-stage shift register In this Example [] 42 stage Delay 2

Serial Access Memories - Queues Queues supports different data read and write clock and data FULL and EMPTY flags Internally maintains separate read and write pointers 3

Queues FIFO/LIFO First In First Out [FIFO] Buffers Data between two asynchronous data streams On WRITE clk The data is written in the Queue and asserts FULL flag when no more data can be written On READ clk This stored data is read until EMPTY flag is asserted Last In First Out [LIFO] Subroutine stacks Single pointer for read and write WRITE Increments pointer if last element FULL = Read READ decrements pointer if first element EMPTY = Write 4

Content-Addressable Memory [CAM] Data to be retrieved is with known binary keyword than known address Similar to SRAM cell with addition of a matched line APPLICATION Translational Look Aside Buffer [TLB] in microprocessor supporting virtual memory cache 5

T CAM Cell Tag => <=Tag_b Initial condition Match line: Precharged Bit Match = Bit Match = Match line discharges 6

Programmable Logic Arrays [PLAs] Flexible design approach Regular structure for implementing combinational logic in sum-of-products (SOP) form AND (products)-or (sum) structure Both AND plane and OR plane is programmable Implementation Pseudo-nMOS PLAs Dynamic PLAs 7

PLA - Full adder implementation AND/OR Schematic Pseudo-nMOS Schematic c c s s 8

Robust Memory Design Why do we need robust design? Defects make chips useless Yield loss How can we achieve it? Redundancy In memory chips extra rows and columns can fix bad cells Extra sub arrays can replace arrays that are beyond repair Supplement to Redundancy Error Correcting Codes [ECC] ECC XOR actual data and corrupt data to detect flip bit Challenge in redundancy Minimize the overhead of the replacement logic 9

Summary Array designs represents basic cell in 2D which enables regular structure and hence high density and careful layout is required ROM T cell with the contents wired to a constant value EPROM, EEPROM FLASH programmable memories Used store code with high storage density CAM similar to SRAM with look up mode to identify a particular word presented Used in Translational look aside buffers PLA AND-OR plane implementation with design flexibility Used implementation of quick combinational logic and use with synthesis tools logic can be simplified 2

Reference and Questions Reference Neil H. E. Weste and David Money Harris, Array Subsystems, in CMOS VLSI DESIGN A CIRCUITS AND SYSTEMS PERSPECTIVE, Fourth ed. MA,USA, Ch. 2, sec 2.4-2.9, pp. 527-546 2