Advanced Concepts and Components for adaptive Avionics

Similar documents
Network on Chip round table European Space Agency, ESTEC Noordwijk / The Netherlands 17 th and 18 th of September 2009

Multi-DSP/Micro-Processor Architecture (MDPA)

GR712RC A MULTI-PROCESSOR DEVICE WITH SPACEWIRE INTERFACES

SEFUW workshop. Feb 17 th 2016

The SpaceWire RTC: Remote Terminal Controller

Rad-Hard Microcontroller For Space Applications

ESA round table. September L. Goulard PY. Bretécher

Scalable Sensor Data Processor Development Status DSP Day - September 2014

Operability and Modularity concepts of future RTUs/RIUs

Advanced Computing, Memory and Networking Solutions for Space

TAS RTU PRODUCTS. ADCSS 2015 Noordwijk. Thales Alenia Space 23/10/2015. Ref.: DOC-TAS-EN-001

COMPARISON BETWEEN GR740, LEON4-N2X AND NGMP

CLICK TO EDIT MASTERTITLE

SpaceWire IP Cores for High Data Rate and Fault Tolerant Networking

Flight Computer: Managing the Complexity

LEON3-Fault Tolerant Design Against Radiation Effects ASIC

ATMEL ATF280E Rad Hard SRAM Based FPGA. Bernard BANCELIN ATMEL Nantes SAS, Aerospace Business Unit

Processor and Peripheral IP Cores for Microcontrollers in Embedded Space Applications

Multi-DSP/Micro-Processor Architecture (MDPA) Paul Rastetter Astrium GmbH

ATMEL SPACEWIRE PRODUCTS FAMILY

GR740 Technical Note on Benchmarking and Validation

September 16, ESA/ESTEC - Data Systems Division. Low Speed Multidrop Busses - New. Architectures Enabled by All-Digital Low Speed

Development Status for JAXA Critical Parts, 2008

SMCSlite and DS-Link Macrocell Development

SpaceWire Remote Terminal Controller

AT697E LEON2-FT Final Presentation

DEVELOPING RTEMS SMP FOR LEON3/LEON4 MULTI-PROCESSOR DEVICES. Flight Software Workshop /12/2013

ADVANCED ELECTRONIC SOLUTIONS AVIATION SERVICES COMMUNICATIONS AND CONNECTIVITY MISSION SYSTEMS

Massively Parallel Processor Breadboarding (MPPB)

PowerPC- based Processor Modules for Space Applications

ATF280E A Rad-Hard reprogrammable FPGA

On-Board Control Procedures: Autonomous and Updateable Spacecraft Operator Onboard and Beyond

Payload Data Processing Technologies for JUICE

ESA Supported General Purpose Standard Microprocessors

Microelectronics Presentation Days March 2010

FPGAs APPLICATIONS. 2012, Sept Copyright Atmel Corporation

Digital Control for Space Power Management Devices

GR740 Technical Note on Benchmarking and Validation

Command & Data Handling. By: Justin Hadella Brandon Gilles

ESA IPs & SoCs developments

Introduction to LEON3, GRLIB

Design of Next Generation CPU Card for State of the Art Satellite Control Application

Example of Technology Development Program

11th symposium on advanced space technologies in robotics and automation

SpaceFibre Flight Software Workshop 2015

On-Board Data Systems

The SMCS332SpW and SMCS116SpW: Development Status

Executive Summary Next Generation Microprocessor (NGMP) Engineering Models Product code: GR740

Next Generation Microprocessor for Power Systems Control September 2006 M. Ruiz, SABCA, Belgium

GR740 Processor development

Your Company Logo Here. Flying High-Performance FPGAs on Satellites: Two Case Studies

Fifth SpaceWire WG Meeting SpaceWire based On-Board-Computer

SpaceWire Router ASIC

Development an update. Aeroflex Gaisler

About using FPGAs in radiation environments

Video Processing Chain VPC2 SpaceWire Networking Protocol Meeting July 2005

GOES-R SpaceWire Implementation

Intellectual Property Macrocell for. SpaceWire Interface. Compliant with AMBA-APB Bus

FPGA VHDL Design Flow AES128 Implementation

RAD6000 Space Computers

LEVERAGING SERIAL DIGITAL INTERFACES STANDARDIZATION: THE RASTA REFERENCE ARCHITECTURE FACILITY AT ESA

CNES requirements w.r.t. Next Generation General Purpose Microprocessor

Next Generation Multi-Purpose Microprocessor

Current status of SOI / MPU and ASIC development for space

RC64. Ramon Chips. Rad-hard high-performance DSP manycore

COTS Commercial is not always advertising Monica Alderighi

EMC2. Prototyping and Benchmarking of PikeOS-based and XTRATUM-based systems on LEON4x4

ESA Contract 18533/04/NL/JD

Microcontrollers Applications within Thales Alenia Space products

THE ADPMS READY FOR FLIGHT AN ADVANCED DATA & POWER MANAGEMENT SYSTEM FOR SMALL SATELLITES & MISSIONS

2 nd ESA IP-Cores Day

SINGLE MODULAR ON-BOARD COMPUTER FOR SPACE APPLICATIONS

SINGLE BOARD COMPUTER FOR SPACE

John Cornforth (1), Andrew Bacon (1), I Sturland (2), Roland Trautner (TO) (3) (1) Presented by John Cornforth

The S6000 Family of Processors

DRPM architecture overview

32 bit Embedded Real-time computing Core Single Chip Development (ERC32SC/TSC695) Contract 12598/FM (SC)

SEMBRA SEnsoristica Multi Bus per Robotica spaziale (Multibus Wired and Wireless On-Board Sensors and Actuators Networks)

Overview of Microcontroller and Embedded Systems

A common basic SW and DPU platform for the JUICE mission Instruments

A Reference Architecture for Payload Reusable Software (RAPRS)

A ONE CHIP HARDENED SOLUTION FOR HIGH SPEED SPACEWIRE SYSTEM IMPLEMENTATIONS

Scalable Sensor Data Processor: Testing and Validation

LEON- PCI- UMC Development Board

Issues in (very) rad hard systems: an ESA perspective on use of COTS and space grade electronics in JUICE mission.

SpaceWire Remote Memory Access Protocol

EagleEye TSP Porting to HWIL Configuration (RTB)

System-on-a-Programmable-Chip (SOPC) Development Board

SpaceWire 101 Seminar MAPLD 2006 SpaceWire origins and purpose From IEEE 1355 to ECSS-E-50-12A

Virtex-II Architecture. Virtex II technical, Design Solutions. Active Interconnect Technology (continued)

High temperature / radiation hardened capable ARM Cortex -M0 microcontrollers

STM32F3. Cuauhtémoc Carbajal ITESM CEM 12/08/2013

V8uC: Sparc V8 micro-controller derived from LEON2-FT

Zynq-7000 All Programmable SoC Product Overview

So you think developing an SoC needs to be complex or expensive? Think again

Digital Electronics 27. Digital System Design using PLDs

Operating real equipments with fully simulated On Board Computer

SVOM mission: ATF280F/AT697F data processing for real-time GRB detection and localization & ATF280E SpaceWire CEA IP recent developments

High Accuracy Time Synchronization over SpaceWire Networks

New System Solutions for Laser Printer Applications by Oreste Emanuele Zagano STMicroelectronics

Transcription:

Advanced Concepts and Components for adaptive Avionics Ph. Armbruster Head of Data Systems Division ESTEC 03/03/2016

AVIONICS : Cost reduction as a challenge AVIONICS include: Data Handling TM/TC Attitude and Orbit Control - FDIR Central Software embedded SW Additional constraint : more for the Payload Less for Avionics! ESA Presentation Ph. Armbruster ESTEC 03/03/2016 D/TEC Slide 2

Avionics : How to reduce the cost? Through generic platforms? Astrobus, Spacebus, small GEO, Alphabus, Neosat Thanks to a higher level of recurrence, by reusing existing designs, Building blocks and components Via more standardized Avionics Space AVionics Open - Interfaces ARchitecture By making tailoring of Data Systems easier: Advanced Concepts and Components for Adaptive Avionics

SAVOIR : Reference Architecture

SAVOIR Functional Reference Architecture Generic Specifications for OBCs, RTUs and Mass Memories ESA Presentation Ph. Armbruster ESTEC 03/03/2016 D/TEC Slide 5

SAVOIR : Standardised Interfaces, Services and Protocols New interfaces: Sensor buses, I2C, SPI PowerLinks Enhanced Networks: Time Triggered Ethernet SpaceWire-D SpaceFibre

Building blocks Prototypes available in 2016 In cooperation with CNES

History of ESA Microprocessor Developments MA 31750 (Dynex Semiconductor) MIL-STD-1750A architecture GEC-Plessey 1.5 μm SPARC V7 ERC32 3-chipset IU, FPU, MEC: TSC691, 692, 693 Temic 0.8 μm SPARC V7 ERC32 single chip Temic 0.5 μm TSC695 SPARC V8 LEON2 AT697 Atmel 0.18 μm SPARC V8 LEON4/NGMP GR740 ST Microelectronics 65 nm Goal: 10x AT697 performance ESA Presentation Ph. Armbruster ESTEC 03/03/2016 D/TEC Slide 8

L2 cache memories GR740 Trade-Offs Traded specification taking into account technology constraints and capabilities Increased L2 cache size 2 Mbyte Improved performance counters to ease execution time analysis L2 cache controller split support to reduce inter-core interference Sign-off frequency 250 MHz (WC) 4x250 MHz = 10x100 MHz We reach our goal (10xAT697) Pin multiplexing to reduce pin count PROM with UART, CAN, 1553 and SPW debug ports Half of SDRAM port multiplexed with PCI and one of 2 Ethernet ports L2 cache memories CPU CPU CPU CPU Interfaces PLL Interfaces ESA Presentation Ph. Armbruster ESTEC 03/03/2016 D/TEC Slide 9 Chip area ~ 8.4 x 8.7 = 73 mm²

GR740 Block Diagram ESA Presentation Ph. Armbruster ESTEC 03/03/2016 D/TEC Slide 10

GR740 Block Diagram 4 CPU cores with FPU and L1 cache ESA Presentation Ph. Armbruster ESTEC 03/03/2016 D/TEC Slide 11

GR740 Block Diagram 4 CPU cores with FPU and L1 cache Shared memory and L2 cache ESA Presentation Ph. Armbruster ESTEC 03/03/2016 D/TEC Slide 12

GR740 Block Diagram 4 CPU cores with FPU and L1 cache Shared memory and L2 cache Debug Support ESA Presentation Ph. Armbruster ESTEC 03/03/2016 D/TEC Slide 13

GR740 Block Diagram 4 CPU cores with FPU and L1 cache Shared memory and L2 cache Debug Support Peripherals & Interfaces ESA Presentation Ph. Armbruster ESTEC 03/03/2016 D/TEC Slide 14

GR740 : more information GR740 prototypes currently (Q1/2016) under test in evaluation board ESA Presentation Ph. Armbruster ESTEC 03/03/2016 D/TEC Slide 15

BRAVE Introduction and General objectives BRAVE: Big Re-programmable Array for Versatile Environments Main Goal: Provide to the Space Industry a High-capacity, highperformance radiation hardened reprogrammable European FPGA Main motivation: Competitive FPGA capacity, performance and radiation hardness to be used in a wide range of space equipment across all ESA missions in Science, Exploration, Earth Observation, Telecom and Navigation. Also in Launchers and Human Spaceflight. FPGA unlimited re-programmability extra advantage: enable re-configurable and adaptive systems; and also reduces impacts in the (frequent) event of unexpected design changes or modification ESA Presentation Ph. Armbruster ESTEC 03/03/2016 D/TEC Slide 16

BRAVE Introduction and General objectives Extra motivations/ considerations: FPGA cost advantages: FPGAs offer shorter development times, simpler, less expensive design and manufacturing phases than Application Specific Integrated Circuits (ASICs). Equipment suppliers (including SMEs) have access to FPGAs and often cannot afford advanced ASIC technologies Reduce dependency on USA EAR/ITAR FPGA key components Extend and keep the European Competence to develop FPGAs and capability to specify and develop future FPGA products for space. ESA Presentation Ph. Armbruster ESTEC 03/03/2016 D/TEC Slide 17

BRAVE Product elements overview FPGA Component Evaluation Kit (EK) EK Board FPGA Design Flow (FPGA Tools) (NB: the figure does not represent the final board design) ESA Presentation Ph. Armbruster ESTEC 03/03/2016 D/TEC Slide 18 (Note: Simplified view)

BRAVE: FPGA architecture overview The FPGA architecture is based on TILES that have the following elements: Clusters of Look-Up Tables (LUTs): based on 4-inputs LUT + DFF Memory block blocks: DP-RAM: based on 48Kb RAM blocks Register Files: 64x16bits DSP blocks: based on 18x18 bits multiplier Interconnect: Innovative interconnect that allows high density. The FPGA includes also: FPGA Core FPGA IO Multi-standard configurable IOs PLLs Configuration logic with internal self-check (rad-hard) ESA Presentation Ph. Armbruster ESTEC 03/03/2016 D/TEC Slide 19

IO BANK NG-MEDIUM overview, first FPGA of BRAVE First BRAVE rad-hard FPGA developed in 65nm Unlimited re-configurability (SRAM-based FPGA) Key milestone: First silicon and FPGA tools available for end-user: Mid -2016 Configurable by SpaceWire (and other serial/ parallel options) Build-in (*) EDAC for Internal memory RAM blocks Build-in (*) CMIC ( Configuration Memory Integrity Check ) Hardening performance (expected): TID > 100Krad (300krad tested) Single-Event Latch-Up Immunity (SEL) to LET TH > 60 MeV.cm2/mg @125 o C (*) Build-in in Radiation Hardened Logic ESA Presentation Ph. Armbruster ESTEC 03/03/2016 D/TEC Slide 20 Device NG-MEDIUM Capacity: ASIC Gates 550 000 Modules Register 32 256 LUT-4 34 272 Embedded RAM (Mb) 2,1 Embedded DSP 112 Clocks 24 Embedded Serial Link SpaceWire 400Mbps 1 User I/Os LGA-625 380 MQFP-352 Layout Work 160 CG BITSTREAM INTERFACE CG IO BANK TILES DP RAM & DSP IO BANK Courtesy: NanoXplore 2015 Nanoxplore SAS Company Confidential CG CG

BRAVE, more public details soon The first BRAVE FPGA will be officially pre-announced at the SpacE FPGA Users Workshop (SEFUW) at ESTEC on the 17 th of March: https://indico.esa.int/indico/event/130/ ESA Presentation Ph. Armbruster ESTEC 03/03/2016 D/TEC Slide 21

Compact Reconfigurable Avionics Concept : Reconfigurable Data Handling core Reconfigurable DH Core/module Analog Interfaces Analogue sensors and actuators Multi-Core CPU Reconfigurable FPGA Digital Interfaces Digital Interfaces Powerlink Controller Smart sensors and actuators Analog Interfaces Specific Interfaces Standardised Interfaces User def Interfaces ESA Presentation Ph. Armbruster ESTEC 03/03/2016 D/TEC Slide 22

Compact Reconfigurable Avionics: Mk I Reconfigurable Data Handling core Reconfigurable DH Core/module Analog Interfaces Analogue sensors and actuators Multi-Core CPU GR740 Digital Interfaces Reconfigurable FPGA: BRAVE Medium Digital Interfaces Powerlink Controller Smart sensors and actuators Analog Interfaces Specific Interfaces Mil1553b/SpW/CAN/Ethernet/SPI ECSS-E-ST-50-14 User def Interfaces ESA Presentation Ph. Armbruster ESTEC 03/03/2016 D/TEC Slide 23

Compact Reconfigurable Avionics: Mk I Development flow Matlab / Simulink SystemC/C Open Libs Software Development Flow Hardware Development Flow Ip Cores Reconfigurable DH Core/module Multi-Core CPU GR740 Reconfigurable FPGA: BRAVE Medium Digital Interfaces Digital Interfaces Analog Interfaces Validation EGSE / Environment

Compact Reconfigurable Avionics: Smart AOCS & GNC Elements Standard set of externally accommodated sensors Data Handling Core & Actuator drive within a single board/unit Scalable actuators with standard power and data interface Magneto meter R N GNSS antenna(s) MEMS IMU Data Handling Core Sensors processing Actuator Drive Electronics Reaction wheels WDE WDE WDE Magnetic Torquers Sun sensor Star Tracker OH R R N Optical Navigation Camera N GNSS SpaceWire Link N Digital data buses R AOCS/GNC functional chains N R Power Distribution & Management N R Propulsion Solar Array Drive Mechanism N N R R Candidate sensors: FaintStar-based Star Tracker, MEMS-based IMU, Sun sensor on a chip, Navigation on a chip ESA Presentation Ph. Armbruster ESTEC 03/03/2016 D/TEC Slide 25 Applications: LEO Earth Observation, LEO Telecom, Exploration, In-orbit servicing Concepts: SAVOIR-SAFI, Spacewire AOCS prototyping, Time and Space partitioning

Conclusions A good design of complex VLSI components starts by a proper and in depth analysis of its field of application Microprocessors and re-programmable FPGAs are playing an increasingly important role for on-board Electronics GR740 Leon-4 based processors and BRAVE FPGAs pave the European way to Adaptive Avionics Acknowledgments to many ESTEC colleagues, R. Weigand and D. Merodio and also to Cobham Gaisler, NanoXplore teams and ST Microelectronics ESA Presentation Ph. Armbruster ESTEC 03/03/2016 D/TEC Slide 26